公开(公告)号：WO2010120654A1

公开(公告)日：2010-10-21

申请号：PCT/US2010/030630

申请日：2010-04-09

Applicant: LAM RESEARCH CORPORATION ,  KAWAGUCHI, Mark, Naoshi ,  MUI, David ,  WILCOXSON, Mark

Inventor： KAWAGUCHI, Mark, Naoshi ,  MUI, David ,  WILCOXSON, Mark

IPC: B08B7/04

CPC classification number: B08B3/08 ,  B08B3/12 ,  B08B5/04 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/67051

Abstract: The embodiments provide apparatus and methods for removing particles from a substrate surface, especially from a surface of a patterned substrate (or wafer). The cleaning apparatus and methods have advantages in cleaning patterned substrates with fine features without substantially damaging the features on the substrate surface. The cleaning apparatus and methods involve using a viscoelastic cleaning material containing a polymeric compound with large molecular weight, such as greater than 10,000 g/mol. The viscoelastic cleaning material entraps at least a portion of the particles on the substrate surface. The application of a force on the viscoelastic cleaning material over a sufficiently short period time causes the material to exhibit solid-like properties that facilitate removal of the viscoelastic cleaning material along with the entrapped particles. A number of forces can be applied over a short period to access the solid-like nature of the viscoelastic cleaning material. Alternatively, when the temperature of the viscoelastic cleaning material is lowered, the viscoelastic cleaning material also exhibits solid-like properties.

Abstract translation: 实施方案提供了用于从衬底表面，特别是从图案化衬底（或晶片）的表面去除颗粒的设备和方法。 清洁装置和方法在清洁具有精细特征的图案化基板而没有实质上损坏基板表面上的特征的优点。 清洁装置和方法涉及使用含有大分子量如高于10,000g / mol的聚合物的粘弹性清洁材料。 粘弹性清洁材料截留在基底表面上的至少一部分颗粒。 在足够短的时间段内对粘弹性清洁材料施加力导致材料表现出类似固体的性质，其便于与包裹的颗粒一起去除粘弹性清洁材料。 可以在短时间内施加许多力以获得粘弹性清洁材料的固体样性质。 或者，当粘弹性清洁材料的温度降低时，粘弹性清洁材料也呈现固体状特性。

公开(公告)号：WO2010096041A1

公开(公告)日：2010-08-26

申请号：PCT/US2009/005638

申请日：2009-10-14

Applicant: LAM RESEARCH CORPORATION ,  PENG, Grant ,  MUI, David ,  KON, Shih-Chung

Inventor： PENG, Grant ,  MUI, David ,  KON, Shih-Chung

IPC: H01L21/304 ,  H01L21/302

CPC classification number: H01L21/67051

Abstract: A method for cleaning a substrate is provided that includes applying a liquid medium to a surface of the substrate such that the liquid medium substantially covers a portion of the substrate that is being cleaned. One or more transducers are used to generate acoustic energy. The generated acoustic energy is applied to the substrate and the liquid medium meniscus such that the applied acoustic energy to the liquid medium prevents cavitation within the liquid medium. The acoustic energy applied to the substrate provides maximum acoustic wave displacement to acoustic waves introduced into the liquid medium. The acoustic energy introduced into the substrate and the liquid medium enables dislodging of the particle contaminant from the surface of the substrate. The dislodged particle contaminants become entrapped within the liquid medium and are carried away from the surface of the substrate by the liquid medium.

Abstract translation: 提供了一种用于清洁基板的方法，其包括将液体介质施加到基板的表面，使得液体介质基本上覆盖正被清洁的基板的一部分。 使用一个或多个换能器来产生声能。 产生的声能被施加到基底和液体介质弯液面，使得向液体介质施加的声能防止液体介质内的气蚀。 施加到衬底的声能提供了引入液体介质的声波的最大声波位移。 引入衬底和液体介质的声能使得能够从衬底的表面移除颗粒污染物。 脱落的颗粒污染物被夹带在液体介质中，并通过液体介质从基板表面带走。

公开(公告)号：WO2010053643A1

公开(公告)日：2010-05-14

申请号：PCT/US2009/059293

申请日：2009-10-01

Applicant: LAM RESEARCH CORPORATION ,  ZHU, Ji ,  MENDIRATTA, Arjun ,  MUI, David

Inventor： ZHU, Ji ,  MENDIRATTA, Arjun ,  MUI, David

IPC: B08B3/08

CPC classification number: B08B3/02 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/37 ,  C11D3/3707 ,  C11D3/3723 ,  C11D3/3753 ,  C11D3/3765 ,  C11D3/3773 ,  C11D3/378 ,  C11D3/43 ,  C11D7/265 ,  C11D7/268 ,  C11D7/5004 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/003 ,  Y10S134/902

Abstract: The embodiments provide substrate cleaning techniques to remove contaminants from the substrate surface to improve device yield. The substrate cleaning techniques utilize a cleaning material with solid components and polymers with a large molecular weight dispersed in a cleaning liquid to form the cleaning material, which is fluidic The solid components remove contaminants on the substrate surface by making contact with the contaminants The polymers with large molecular weight form polymer chains and a polymeric network that capture and entrap solids in the cleaning materials, which prevent solids from falling on the substrate surface In addition, the polymers can also assist in removing contaminants form the substrate surface by making contacts with contaminants on the substrate surface In one embodiment, the cleaning material glides around protruding features on the substrate surface without making a forceful impact on the protruding features to damage them.

Abstract translation: 这些实施例提供了从衬底表面去除污染物以提高器件产量的衬底清洁技术。 基材清洗技术利用具有分散在清洁液体中的具有大分子量的固体组分和聚合物的清洁材料以形成流体性的清洁材料固体组分通过与污染物接触来去除基底表面上的污染物聚合物与 大分子量形式的聚合物链和聚合物网络，捕获和捕获清洁材料中的固体，防止固体落在基材表面上。此外，聚合物还可以通过与污染物接触来帮助从基材表面上除去污染物 基板表面在一个实施例中，清洁材料围绕基板表面上的突出特征滑动，而不会对突出特征产生强烈的冲击以损坏它们。

公开(公告)号：WO2009078975A2

公开(公告)日：2009-06-25

申请号：PCT/US2008/013714

申请日：2008-12-12

Applicant: LAM RESEARCH CORPORATION ,  MUI, David S. L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

Inventor： MUI, David S. L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

IPC: H01L21/302 ,  H01L21/30

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供用于清洁具有精细特征的图案化衬底的改进材料。 清洁材料在清洁具有精细特征的图案化基材上具有优点，而基本上不损坏特征。 清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损伤全部降低在一起。 包含具有大分子量的聚合物的聚合物的清洁材料捕获基底上的污染物。 此外，清洁材料夹带污染物并且不会将污染物返回到基底表面。 一种或多种具有大分子量的聚合物的聚合物形成长的聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。

公开(公告)号：WO2008031678A1

公开(公告)日：2008-03-20

申请号：PCT/EP2007/058306

申请日：2007-08-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  KING, Matthew, Edward ,  LIU, Peichun, Peter ,  MUI, David ,  PHAM, Mydung ,  QI, Jieming ,  TRUONG, Thuong, Quang

Inventor： KING, Matthew, Edward ,  LIU, Peichun, Peter ,  MUI, David ,  PHAM, Mydung ,  QI, Jieming ,  TRUONG, Thuong, Quang

IPC: G06F13/28 ,  G06F12/10

CPC classification number: G06F13/28 ,  G06F12/1045 ,  G06F12/1081 ,  G06F12/145

Abstract: A memory management unit (MMU) performs address translation and protection using a segment table and page table model. Each DMA queue entry may include a MMU- miss dependency flag. The DMA issue mechanism uses the MMU-miss dependency flag to block the issue of commands that are known to result in a translation miss. However, the direct memory access engine does not block subsequent DMA commands from being issued until they receive a translation miss. When the MMU completes processing of a miss, the MMU sends a miss clear signal to the DMA control unit to reset all MMU-miss dependency flags. When the MMU sends a miss clear signal, the DMA control unit will reset all DMA queue entries with MMU-miss dependency flags set. DMA commands in the DMA queue that were blocked from issue by the MMU-miss dependency flag may now be selected by the DMA control unit for issue.

Abstract translation: 存储器管理单元（MMU）使用段表和页表模型来执行地址转换和保护。 每个DMA队列条目可以包括MMU-miss依赖标志。 DMA问题机制使用MMU-miss依赖标志来阻止已知导致翻译未命中的命令的问题。 然而，直接存储器访问引擎不会阻止随后的DMA命令被发出，直到它们接收到转换未命中。 当MMU完成未命中的处理时，MMU向DMA控制单元发送未命中清除信号，以复位所有MMU-miss依赖标志。 当MMU发送未命中清除信号时，DMA控制单元将重置所有设置了MMU-miss依赖标志的DMA队列条目。 DMA控制单元现在可以由DMA控制单元选择DMA队列中的DMA命令，由MMU-miss依赖标志阻止发布。

公开(公告)号：WO2009079422A1

公开(公告)日：2009-06-25

申请号：PCT/US2008/086742

申请日：2008-12-14

Applicant: LAM RESEARCH CORPORATION ,  ZHU, Ji ,  MENDIRATTA, Arjun ,  MUI, David

Inventor： ZHU, Ji ,  MENDIRATTA, Arjun ,  MUI, David

IPC: H01L21/302 ,  H01L21/304

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.

Abstract translation: 将清洁材料施加到基板的表面。 清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合物材料。 冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。 洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

公开(公告)号：WO2009078969A1

公开(公告)日：2009-06-25

申请号：PCT/US2008/013697

申请日：2008-12-12

Applicant: LAM RESEARCH CORPORATION ,  MUI, David, S., L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

Inventor： MUI, David, S., L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

IPC: H01L21/302 ,  H01L21/304

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide apparatus for cleaning patterned substrates with fine features with cleaning materials. The apparatus using the cleaning materials has advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供了用清洁材料清洁具有精细特征的图案化衬底的设备。 使用清洁材料的设备具有清洁具有精细特征的图案化基材而不会显着损害特征的优点。 清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损伤全部降低在一起。 包含具有大分子量的聚合物的聚合物的清洁材料捕获基底上的污染物。 此外，清洁材料夹带污染物并且不会将污染物返回到基底表面。 一种或多种具有大分子量的聚合物的聚合物形成长的聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。

公开(公告)号：WO2006026422A2

公开(公告)日：2006-03-09

申请号：PCT/US2005/030391

申请日：2005-08-25

Applicant: APPLIED MATERIALS, INC. ,  MUI, David ,  LIU, Wei

Inventor： MUI, David ,  LIU, Wei

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L21/32137

Abstract: A method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrate using a gas mixture that includes a passivation gas. The passivation gas is provided to a peripheral region of the substrate to passivate sidewalls of the structures being etched.

Abstract translation: 一种用于使用包括钝化气体的气体混合物在衬底上蚀刻具有高均匀度横向蚀刻速率的材料层的方法和装置。 钝化气体被提供到衬底的周边区域以钝化被蚀刻的结构的侧壁。

公开(公告)号：WO2011094132A3

公开(公告)日：2011-08-04

申请号：PCT/US2011/022075

申请日：2011-01-21

Applicant: LAM RESEARCH CORPORATION ,  YASSERI, Amir A. ,  ZHU, Ji ,  YUN, Seokmin ,  MUI, David S.L. ,  MIKHAYLICHENKO, Katrina

Inventor： YASSERI, Amir A. ,  ZHU, Ji ,  YUN, Seokmin ,  MUI, David S.L. ,  MIKHAYLICHENKO, Katrina

IPC: H01L21/302

Abstract: A method is provided for treating the surface of high aspect ratio nanostructures to help protect the delicate nanostructures during some of the rigorous processing involved in fabrication of semiconductor devices. A wafer containing high aspect ratio nanostructures is treated to make the surfaces of the nanostructures more hydrophobic. The treatment may include the application of a primer that chemically alters the surfaces of the nanostructures preventing them from getting damaged during subsequent wet clean processes.. The wafer may then be further processed, for example a wet cleaning process followed by a drying process. The increased hydrophobicity of the nanostructures helps to reduce or prevent collapse of the nanostructures.

Abstract translation: 提供了一种用于处理高纵横比纳米结构的表面的方法，以在制造半导体器件所涉及的一些严格处理期间帮助保护精细的纳米结构。 处理包含高纵横比纳米结构的晶片以使纳米结构的表面更加疏水。 该处理可以包括应用底漆，该底漆化学改变纳米结构的表面，防止其在随后的湿法清洁过程期间被损坏。然后可以进一步处理晶片，例如湿法清洁过程，然后进行干燥过程。 纳米结构的疏水性增加有助于减少或防止纳米​​结构的塌陷。

公开(公告)号：WO2009078975A3

公开(公告)日：2009-08-27

申请号：PCT/US2008013714

申请日：2008-12-12

Applicant: LAM RES CORP ,  MUI DAVID S L ,  SRINIVASAN SATISH ,  PENG GRANT ,  ZHU JI ,  KON SHIH-CHUNG ,  PODLESNIK DRAGAN ,  MENDIRATTA ARJUN

Inventor： MUI DAVID S L ,  SRINIVASAN SATISH ,  PENG GRANT ,  ZHU JI ,  KON SHIH-CHUNG ,  PODLESNIK DRAGAN ,  MENDIRATTA ARJUN

IPC: H01L21/302 ,  H01L21/304

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供了用于清洁具有精细特征的图案化基板的改进材料。 该清洁材料在清洁具有精细特征的图案化基板方面具有优势，而基本上不损坏该特征。 清洁材料是流体，无论是液相还是液相/气相，并在设备特征周围变形; 因此，清洁材料不会实质上损害设备特征或一起减少损坏。 含有大分子量聚合物的聚合物的清洁材料将污染物捕获在基底上。 另外，清洁材料包裹污染物并且不会将污染物返回到基材表面。 一种或多种具有大分子量的聚合物化合物的聚合物形成长聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长聚合物链和/或聚合物网络显示出捕获和截留污染物的优越能力。