公开(公告)号：WO2012057993A1

公开(公告)日：2012-05-03

申请号：PCT/US2011/055604

申请日：2011-10-10

Applicant: THE UNIVERSITY OF AKRON ,  JIA, Li ,  BHAWALKAR, Sarang Pramod ,  QIAN, Jun

Inventor： JIA, Li ,  BHAWALKAR, Sarang Pramod ,  QIAN, Jun

IPC: G03F7/16 ,  G03F7/00

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/165

Abstract: A method of surface patterning by transferring particles interfacially trapped at a air-water interface to a substrate includes the steps of: (a) interfacially trapping a plurality of particles at an air-water interface; (b) providing a substrate having a polymer adhesive thereon, the polymer adhesive having a glass transition temperature that is less than 25° C and an advancing water contact angle greater than 50; and (c) transferring the particles of step (a) to the substrate of (b) by the Langmuir-Schaefer technique.

Abstract translation: 通过将在空气 - 水界面处被界面捕获的颗粒转移到基底的表面图案化方法包括以下步骤：（a）在空气 - 水界面处界面捕获多个颗粒; （b）提供其上具有聚合物粘合剂的基材，所述聚合物粘合剂的玻璃化转变温度小于25℃，前进水接触角大于50; 和（c）通过Langmuir-Schaefer技术将步骤（a）的颗粒转移到（b）的底物。

公开(公告)号：WO2011146208A2

公开(公告)日：2011-11-24

申请号：PCT/US2011/033998

申请日：2011-04-26

Applicant: APPLIED MATERIALS, INC. ,  QIAN, Jun ,  GARRETSON, Charles C. ,  DHANDAPANI, Sivakumar ,  DAVID, Jeffrey Drue ,  LEE, Harry, Q.

Inventor： QIAN, Jun ,  GARRETSON, Charles C. ,  DHANDAPANI, Sivakumar ,  DAVID, Jeffrey Drue ,  LEE, Harry, Q.

CPC classification number: B24B49/04 ,  B24B49/12

Abstract: A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.

Abstract translation: 研磨具有多个区域的基板并测量光谱。 对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。 基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引 预计时间比没有这样的调整。 基于对先前基板计算的反馈误差来计算调整。 基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

公开(公告)号：WO2011133386A2

公开(公告)日：2011-10-27

申请号：PCT/US2011/032447

申请日：2011-04-14

Applicant: APPLIED MATERIALS, INC. ,  DHANDAPANI, Sivakumar ,  QIAN, Jun ,  COCCA, Christopher D. ,  FUNG, Jason Garcheung ,  CHANG, Shou-Sung ,  GARRETSON, Charles C. ,  MENK, Gregory E. ,  TSAI, Stan D.

Inventor： DHANDAPANI, Sivakumar ,  QIAN, Jun ,  COCCA, Christopher D. ,  FUNG, Jason Garcheung ,  CHANG, Shou-Sung ,  GARRETSON, Charles C. ,  MENK, Gregory E. ,  TSAI, Stan D.

IPC: B24B37/00 ,  B24B49/03 ,  B24B53/007 ,  H01L21/304

CPC classification number: B24B53/017 ,  B24B37/042

Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Abstract translation: 本文所描述的实施例使用调节扫描的闭环控制（CLC）来实现整个衬垫寿命期间穿过衬垫的均匀凹槽深度去除。 集成到调节臂中的传感器使得可以在现场和实时监测焊盘堆叠厚度。 来自厚度传感器的反馈用于修改焊盘表面上的焊盘调节器停留时间，从而校正可能随焊盘和磁盘寿命而出现的焊盘轮廓中的漂移。 焊盘轮廓CLC可以通过持续调节均匀地减小槽深度，从而提供更长的消耗品寿命并降低运行成本。

公开(公告)号：WO2009134865A3

公开(公告)日：2009-11-05

申请号：PCT/US2009/042085

申请日：2009-04-29

Applicant: APPLIED MATERIALS, INC. ,  QIAN, Jun ,  DHANDAPANI, Sivakumar ,  LEE, Harry, Q. ,  OSTERHELD, Thomas, H. ,  ZHU, Zhize

Inventor： QIAN, Jun ,  DHANDAPANI, Sivakumar ,  LEE, Harry, Q. ,  OSTERHELD, Thomas, H. ,  ZHU, Zhize

IPC: H01L21/304

Abstract: A computer implemented method includes obtaining at least one current spectrum with an in-situ optical monitoring system, comparing the current spectrum to a plurality of different reference spectra, and determining based on the comparing whether a polishing endpoint has been achieved for the substrate having the outermost layer undergoing polishing. The current spectrum is a spectrum of light reflected from a substrate having an outermost layer undergoing polishing and at least one underlying layer. The plurality of reference spectra represent spectra of light reflected from substrates with outermost layers having the same thickness and underlying layers having different thicknesses.

公开(公告)号：WO2020168423A1

公开(公告)日：2020-08-27

申请号：PCT/CA2020/050211

申请日：2020-02-19

Applicant: ZHANG, Lei ,  QIAN, Jun

Inventor： ZHANG, Lei ,  QIAN, Jun

IPC: G06N3/063 ,  G06N3/04

Abstract: A method and system for a convolution model multi-mode hardware accelerator. The method comprises receiving a stream of an input feature map into the one or more processors utilizing a convolution model that includes a plurality of convolution layers, estimating a sparsity characteristic of a data portion that encompasses at least one of the plurality of convolution layers, the data portion comprising at least one of weights and input data, processing, in accordance with the sparsity characteristic, the data portion of the convolution model using a first and a second hardware accelerator modes, and in accordance with the processing, generating a plurality of output features that are interpretive of the input feature map.

公开(公告)号：WO2012015699A2

公开(公告)日：2012-02-02

申请号：PCT/US2011/045096

申请日：2011-07-22

Applicant: APPLIED MATERIALS, INC. ,  QIAN, Jun ,  SWEDEK, Boguslaw, A. ,  LEE, Harry, Q. ,  DAVID, Jeffrey, Drue ,  DHANDAPANI, Sivakumar ,  OSTERHELD, Thomas, H.

Inventor： QIAN, Jun ,  SWEDEK, Boguslaw, A. ,  LEE, Harry, Q. ,  DAVID, Jeffrey, Drue ,  DHANDAPANI, Sivakumar ,  OSTERHELD, Thomas, H.

IPC: H01L21/304 ,  H01L21/66

CPC classification number: G05B23/0208 ,  G05B2219/31459 ,  G05B2219/45232

Abstract: A method of configuring a polishing monitoring system includes receiving user input selecting a plurality of libraries, each library of the plurality of libraries comprising a plurality of reference spectra for use in matching to measured spectra during polishing, each reference spectrum of the plurality of reference spectra having an associated index value, for a first zone of a substrate, receiving user input selecting a first subset of the plurality of libraries, and for a second zone of the substrate, receiving user input selecting a second subset of the plurality of libraries.

Abstract translation: 配置抛光监控系统的方法包括接收选择多个库的用户输入，所述多个库中的每个库包括用于在抛光期间与测量光谱匹配的多个参考光谱，每个 所述多个参考光谱的参考光谱具有相关联的索引值，用于衬底的第一区域，接收选择所述多个文库的第一子集的用户输入，以及所述衬底的第二区域，接收用户输入，选择第二 多个库的子集。

公开(公告)号：WO2011133386A3

公开(公告)日：2012-02-02

申请号：PCT/US2011032447

申请日：2011-04-14

Applicant: APPLIED MATERIALS INC ,  DHANDAPANI SIVAKUMAR ,  QIAN JUN ,  COCCA CHRISTOPHER D ,  FUNG JASON GARCHEUNG ,  CHANG SHOU-SUNG ,  GARRETSON CHARLES C ,  MENK GREGORY E ,  TSAI STAN D

Inventor： DHANDAPANI SIVAKUMAR ,  QIAN JUN ,  COCCA CHRISTOPHER D ,  FUNG JASON GARCHEUNG ,  CHANG SHOU-SUNG ,  GARRETSON CHARLES C ,  MENK GREGORY E ,  TSAI STAN D

IPC: B24B37/00 ,  B24B49/03 ,  B24B53/007 ,  H01L21/304

CPC classification number: B24B53/017 ,  B24B37/042

Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Abstract translation: 本文描述的实施例使用调节扫描的闭环控制（CLC），以在整个衬垫寿命期间跨越焊盘实现均匀的凹槽深度去除。 集成到调节臂中的传感器使得可以在现场和实时监测焊盘堆叠厚度。 来自厚度传感器的反馈用于修改焊盘表面上的焊盘调节器停留时间，以校正可能随焊盘和磁盘寿命而出现的焊盘轮廓中的漂移。 焊盘轮廓CLC可以通过持续的调节来均匀地减小槽深度，提供更长的消耗品寿命和降低的操作成本。

公开(公告)号：WO2011139524A2

公开(公告)日：2011-11-10

申请号：PCT/US2011/032650

申请日：2011-04-15

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey, Drue ,  LEE, Harry, Q. ,  QIAN, Jun ,  ZHANG, Jimin

Inventor： DAVID, Jeffrey, Drue ,  LEE, Harry, Q. ,  QIAN, Jun ,  ZHANG, Jimin

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/042 ,  B24B37/005 ,  B24B49/12 ,  H01L22/12 ,  H01L22/26

Abstract: A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.

Abstract translation: 计算机实现的产生参考光谱的方法包括在具有可旋转压板的抛光设备中抛光第一衬底，在用原位监测系统抛光期间测量来自衬底的光谱序列，将光谱序列中的每个光谱与 指示值等于测量每个光谱的平板旋转数，并将光谱序列存储为参考光谱。

公开(公告)号：WO2008076601A1

公开(公告)日：2008-06-26

申请号：PCT/US2007/085810

申请日：2007-11-28

Applicant: APPLIED MATERIALS, INC. ,  RAVID, Abraham ,  SWEDEK, Boguslaw A. ,  DAVID, Jeffrey Drue ,  QIAN, Jun ,  CARLSSON, Ingemar ,  BENVEGNU, Dominic J. ,  LEE, Harry Q. ,  KARUPPIAH, Lakshmanan

Inventor： RAVID, Abraham ,  SWEDEK, Boguslaw A. ,  DAVID, Jeffrey Drue ,  QIAN, Jun ,  CARLSSON, Ingemar ,  BENVEGNU, Dominic J. ,  LEE, Harry Q. ,  KARUPPIAH, Lakshmanan

IPC: G01B11/06

CPC classification number: G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

Abstract translation: 确定衬底的物理性质的方法包括记录从衬底获得的第一光谱，第一光谱是在改变衬底的物理性能的抛光工艺期间获得的。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：WO2020160653A1

公开(公告)日：2020-08-13

申请号：PCT/CA2020/050136

申请日：2020-02-04

Applicant: ZHANG, Lei ,  QIAN, Jun

Inventor： ZHANG, Lei ,  QIAN, Jun

IPC: G06F15/76 ,  G06F17/10 ,  G06N20/00

Abstract: A method and system for a convolution model hardware accelerator. The method comprises receiving a stream of an input feature map into the one or more processors utilizing a convolution model that includes a plurality of convolution layers, for a given convolution layer within the plurality of convolution layers, reconfiguring a computational order for a plurality of hardware accelerator sub-blocks by re-shuffling a plurality of output filters among the plurality of sub-blocks, and in accordance with the reconfigured computational order, generating output features that are interpretive of the input feature map.