公开(公告)号：WO2011146208A2

公开(公告)日：2011-11-24

申请号：PCT/US2011/033998

申请日：2011-04-26

Applicant: APPLIED MATERIALS, INC. ,  QIAN, Jun ,  GARRETSON, Charles C. ,  DHANDAPANI, Sivakumar ,  DAVID, Jeffrey Drue ,  LEE, Harry, Q.

Inventor： QIAN, Jun ,  GARRETSON, Charles C. ,  DHANDAPANI, Sivakumar ,  DAVID, Jeffrey Drue ,  LEE, Harry, Q.

CPC classification number: B24B49/04 ,  B24B49/12

Abstract: A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.

Abstract translation: 研磨具有多个区域的基板并测量光谱。 对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。 基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引 预计时间比没有这样的调整。 基于对先前基板计算的反馈误差来计算调整。 基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

公开(公告)号：WO2011133386A2

公开(公告)日：2011-10-27

申请号：PCT/US2011/032447

申请日：2011-04-14

Applicant: APPLIED MATERIALS, INC. ,  DHANDAPANI, Sivakumar ,  QIAN, Jun ,  COCCA, Christopher D. ,  FUNG, Jason Garcheung ,  CHANG, Shou-Sung ,  GARRETSON, Charles C. ,  MENK, Gregory E. ,  TSAI, Stan D.

Inventor： DHANDAPANI, Sivakumar ,  QIAN, Jun ,  COCCA, Christopher D. ,  FUNG, Jason Garcheung ,  CHANG, Shou-Sung ,  GARRETSON, Charles C. ,  MENK, Gregory E. ,  TSAI, Stan D.

IPC: B24B37/00 ,  B24B49/03 ,  B24B53/007 ,  H01L21/304

CPC classification number: B24B53/017 ,  B24B37/042

Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Abstract translation: 本文所描述的实施例使用调节扫描的闭环控制（CLC）来实现整个衬垫寿命期间穿过衬垫的均匀凹槽深度去除。 集成到调节臂中的传感器使得可以在现场和实时监测焊盘堆叠厚度。 来自厚度传感器的反馈用于修改焊盘表面上的焊盘调节器停留时间，从而校正可能随焊盘和磁盘寿命而出现的焊盘轮廓中的漂移。 焊盘轮廓CLC可以通过持续调节均匀地减小槽深度，从而提供更长的消耗品寿命并降低运行成本。

公开(公告)号：WO2005049274B1

公开(公告)日：2005-12-29

申请号：PCT/US2004038083

申请日：2004-11-12

Applicant: APPLIED MATERIALS INC ,  CHEN HUNG CHIH ,  ZUNIGA STEVEN M ,  GARRETSON CHARLES C ,  MCALLISTER DOUGLAS R ,  MEYER STACY ,  LIN JIAN ,  HUEY SIDNEY P ,  OH JEONGHOON ,  DOAN TRUNG T ,  SCHMIDT JEFFREY ,  WOHLERT MARTIN S ,  HUGHES KERRY F ,  WANG JAMES C ,  LU DANNY CAM TOAN ,  DELAMENIE ROMAIN BEAU ,  BALAGANI VENKATA R ,  ALLEN ADEN MARTIN ,  FONG MICHAEL JON

Inventor： CHEN HUNG CHIH ,  ZUNIGA STEVEN M ,  GARRETSON CHARLES C ,  MCALLISTER DOUGLAS R ,  MEYER STACY ,  LIN JIAN ,  HUEY SIDNEY P ,  OH JEONGHOON ,  DOAN TRUNG T ,  SCHMIDT JEFFREY ,  WOHLERT MARTIN S ,  HUGHES KERRY F ,  WANG JAMES C ,  LU DANNY CAM TOAN ,  DELAMENIE ROMAIN BEAU ,  BALAGANI VENKATA R ,  ALLEN ADEN MARTIN ,  FONG MICHAEL JON

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  Y10T29/49815

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Abstract translation: 保持环可通过机加工或研磨环的底表面而成形，以在底表面中形成成形轮廓。 保持环的底表面可以包括平坦的，倾斜的和弯曲的部分。 研磨可以使用专门用于研磨扣环底面的机器进行。 在研磨过程中，环可以被允许围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：WO2012054149A2

公开(公告)日：2012-04-26

申请号：PCT/US2011/051251

申请日：2011-09-12

Applicant: APPLIED MATERIALS, INC. ,  DHANDAPANI, Sivakumar ,  JAIN, Asheesh ,  GARRETSON, Charles C. ,  MENK, Gregory, E. ,  TSAI, Stan, D.

Inventor： DHANDAPANI, Sivakumar ,  JAIN, Asheesh ,  GARRETSON, Charles C. ,  MENK, Gregory, E. ,  TSAI, Stan, D.

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B53/007 ,  B24B37/005

Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus includes a rotatable platen and a conditioner device coupled to a base. The conditioner device includes a shaft rotatably coupled to the base by a first motor. A rotatable conditioner head is coupled to the shaft by an arm. The conditioner head coupled to a second motor controlling rotation of the conditioner head. One or more measurement devices are provided that are operable to sense a rotational force metric of the shaft relative to the base and a rotational force metric of the conditioner head.

Abstract translation: 提供了用于调节CMP系统中抛光垫的装置和方法。 在一个实施例中，提供了一种用于抛光衬底的装置。 该装置包括可旋转的压盘和联接到基座的调节装置。 调节装置包括通过第一电动机可旋转地联接到基座的轴。 可旋转的调节头通过臂联接到轴上。 调节头联接到控制调节头旋转的第二电动机。 提供一个或多个测量装置，其可操作以感测轴相对于基座的旋转力度量和调节器头的旋转力度量。

公开(公告)号：WO2011133386A3

公开(公告)日：2012-02-02

申请号：PCT/US2011032447

申请日：2011-04-14

Applicant: APPLIED MATERIALS INC ,  DHANDAPANI SIVAKUMAR ,  QIAN JUN ,  COCCA CHRISTOPHER D ,  FUNG JASON GARCHEUNG ,  CHANG SHOU-SUNG ,  GARRETSON CHARLES C ,  MENK GREGORY E ,  TSAI STAN D

Inventor： DHANDAPANI SIVAKUMAR ,  QIAN JUN ,  COCCA CHRISTOPHER D ,  FUNG JASON GARCHEUNG ,  CHANG SHOU-SUNG ,  GARRETSON CHARLES C ,  MENK GREGORY E ,  TSAI STAN D

IPC: B24B37/00 ,  B24B49/03 ,  B24B53/007 ,  H01L21/304

CPC classification number: B24B53/017 ,  B24B37/042

Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Abstract translation: 本文描述的实施例使用调节扫描的闭环控制（CLC），以在整个衬垫寿命期间跨越焊盘实现均匀的凹槽深度去除。 集成到调节臂中的传感器使得可以在现场和实时监测焊盘堆叠厚度。 来自厚度传感器的反馈用于修改焊盘表面上的焊盘调节器停留时间，以校正可能随焊盘和磁盘寿命而出现的焊盘轮廓中的漂移。 焊盘轮廓CLC可以通过持续的调节来均匀地减小槽深度，提供更长的消耗品寿命和降低的操作成本。

公开(公告)号：WO2010008824A3

公开(公告)日：2010-03-25

申请号：PCT/US2009048243

申请日：2009-06-23

Applicant: APPLIED MATERIALS INC ,  DHANDAPANI SIVAKUMAR ,  TSAI STAN D ,  MAO DAXIN ,  DESHPANDE SAMEER ,  CHANG SHOU-SUNG ,  MENK GREGORY E ,  GARRETSON CHARLES C ,  FUNG JASON GARCHEUNG ,  COCCA CHRISTOPHER D ,  CHEN HUNG CHIH

Inventor： DHANDAPANI SIVAKUMAR ,  TSAI STAN D ,  MAO DAXIN ,  DESHPANDE SAMEER ,  CHANG SHOU-SUNG ,  MENK GREGORY E ,  GARRETSON CHARLES C ,  FUNG JASON GARCHEUNG ,  COCCA CHRISTOPHER D ,  CHEN HUNG CHIH

IPC: H01L21/304 ,  B24B37/04

CPC classification number: B24B49/18 ,  B24B37/005 ,  B24B37/042

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract translation: 提供了用于调节抛光垫的方法和装置。 调节元件由调节臂保持，该调节臂在枢转点处可旋转地安装到基座。 执行器使臂绕枢轴点枢转。 调节元件被推靠在抛光垫的表面上，并且相对于抛光垫平移以从抛光垫去除材料并使其表面变粗糙。 研磨调节表面与抛光垫表面的相互作用产生摩擦力。 可以通过监测施加到枢轴点的扭矩以及由此控制的材料去除来监测摩擦力。 调节时间，下压力，平移速度或调节垫的旋转可基于测量的扭矩进行调节。

公开(公告)号：WO2010008824A2

公开(公告)日：2010-01-21

申请号：PCT/US2009/048243

申请日：2009-06-23

Applicant: APPLIED MATERIALS, INC. ,  DHANDAPANI, Sivakumar ,  TSAI, Stan, D. ,  MAO, Daxin ,  DESHPANDE, Sameer ,  CHANG, Shou-Sung ,  MENK, Gregory, E. ,  GARRETSON, Charles, C. ,  FUNG, Jason, Garcheung ,  COCCA, Christopher, D. ,  CHEN, Hung, Chih

Inventor： DHANDAPANI, Sivakumar ,  TSAI, Stan, D. ,  MAO, Daxin ,  DESHPANDE, Sameer ,  CHANG, Shou-Sung ,  MENK, Gregory, E. ,  GARRETSON, Charles, C. ,  FUNG, Jason, Garcheung ,  COCCA, Christopher, D. ,  CHEN, Hung, Chih

IPC: H01L21/304

CPC classification number: B24B49/18 ,  B24B37/005 ,  B24B37/042

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract translation: 提供了一种用于调节抛光垫的方法和设备。 调节元件由调节臂保持，该调节臂在枢转点处可旋转地安装到基座。 执行器使臂绕枢轴点枢转。 调节元件被推靠在抛光垫的表面上，并且相对于抛光垫平移以从抛光垫去除材料并使其表面变粗糙。 研磨调节表面与抛光垫表面的相互作用产生摩擦力。 可以通过监测施加到枢轴点的扭矩以及由此控制的材料去除来监测摩擦力。 调节垫的调节时间，下压力，平移速度或旋转可基于测量的转矩进行调节。

公开(公告)号：WO2012054149A3

公开(公告)日：2012-06-14

申请号：PCT/US2011051251

申请日：2011-09-12

Applicant: APPLIED MATERIALS INC ,  DHANDAPANI SIVAKUMAR ,  JAIN ASHEESH ,  GARRETSON CHARLES C ,  MENK GREGORY E ,  TSAI STAN D

Inventor： DHANDAPANI SIVAKUMAR ,  JAIN ASHEESH ,  GARRETSON CHARLES C ,  MENK GREGORY E ,  TSAI STAN D

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B53/007 ,  B24B37/005

Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus includes a rotatable platen and a conditioner device coupled to a base. The conditioner device includes a shaft rotatably coupled to the base by a first motor. A rotatable conditioner head is coupled to the shaft by an arm. The conditioner head coupled to a second motor controlling rotation of the conditioner head. One or more measurement devices are provided that are operable to sense a rotational force metric of the shaft relative to the base and a rotational force metric of the conditioner head.

Abstract translation: 提供了用于在CMP系统中调节抛光垫的设备和方法。 在一个实施例中，提供了一种用于抛光衬底的设备。 该设备包括可旋转的台板和连接到基座的调节器装置。 调节器装置包括通过第一马达可旋转地联接到基座的轴。 可旋转的护理头通过臂连接到轴。 调节器头耦合到控制调节器头的旋转的第二电机。 提供一个或多个测量装置，其可操作以感测轴相对于基座的旋转力度量和调节器头的旋转力度量。

公开(公告)号：WO2011139501A2

公开(公告)日：2011-11-10

申请号：PCT/US2011/032319

申请日：2011-04-13

Applicant: APPLIED MATERIALS, INC. ,  DHANDAPANI, Sivakumar ,  MENK, Gregory E. ,  CHO, Sang J. ,  FUNG, Jason Garcheung ,  COCCA, Christopher D. ,  TSAI, Stan D. ,  CHANG, Shou-Sung ,  GARRETSON, Charles C.

Inventor： DHANDAPANI, Sivakumar ,  MENK, Gregory E. ,  CHO, Sang J. ,  FUNG, Jason Garcheung ,  COCCA, Christopher D. ,  TSAI, Stan D. ,  CHANG, Shou-Sung ,  GARRETSON, Charles C.

IPC: H01L21/304

CPC classification number: B24B53/017 ,  B24B37/042

Abstract: A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.

Abstract translation: 提供了一种用于调节CMP系统中的抛光垫的方法和装置。 在一个实施例中，一种用于调节抛光垫的方法包括向调节盘施加向下的力，该调节盘将调节盘推向抛光垫，测量扫过经过抛光垫的调节盘所需的扭矩，确定向下力的变化 通过将测量的扭矩与模型力分布（MFP）进行比较，并且响应于确定的变化来调节调节盘对抛光垫施加的向下的力。

公开(公告)号：WO2010008824A4

公开(公告)日：2010-05-06

申请号：PCT/US2009048243

申请日：2009-06-23

Applicant: APPLIED MATERIALS INC ,  DHANDAPANI SIVAKUMAR ,  TSAI STAN D ,  MAO DAXIN ,  DESHPANDE SAMEER ,  CHANG SHOU-SUNG ,  MENK GREGORY E ,  GARRETSON CHARLES C ,  FUNG JASON GARCHEUNG ,  COCCA CHRISTOPHER D ,  CHEN HUNG CHIH

Inventor： DHANDAPANI SIVAKUMAR ,  TSAI STAN D ,  MAO DAXIN ,  DESHPANDE SAMEER ,  CHANG SHOU-SUNG ,  MENK GREGORY E ,  GARRETSON CHARLES C ,  FUNG JASON GARCHEUNG ,  COCCA CHRISTOPHER D ,  CHEN HUNG CHIH

IPC: H01L21/304 ,  B24B37/04

CPC classification number: B24B49/18 ,  B24B37/005 ,  B24B37/042

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract translation: 提供了一种用于调理抛光垫的方法和装置。 调节元件由可旋转地安装到枢轴点处的基座的调节臂保持。 执行器绕枢轴点枢转臂。 调理元件被推靠在抛光垫的表面上，并相对于抛光垫平移以从抛光垫移除材料并使其表面变粗糙。 研磨调理表面与抛光垫表面的相互作用产生摩擦力。 可以通过监视施加到枢转点的扭矩来监测摩擦力，并且由此控制材料移除。 调节垫的调节时间，下压力，平移速率或旋转可以基于测量的扭矩来调节。