Abstract:
A micro-electrical-mechanicai system (MEMS) guided wave device includes a single crystal piezoelectric layer and at least one guided wave confinement structure configured to confine a laterally excited wave in the single crystal piezoelectric layer. A bonded interface is provided between the single crystal piezoelectric layer and at least one underlying layer. A multi-frequency device includes first and second groups of electrodes arranged on or in different thickness regions of a single crystal piezoelectric layer, with at least one guided wave confinement structure. Segments of a segmented piezoelectric layer and a segmented layer of electrodes are substantially registered in a device including at least one guided wave confinement structure.
Abstract:
RF filter structures are disclosed that may have multiple filter paths, which are provided by weakly coupled resonators. The filter paths may be interconnected so that additional filter paths may be realized between input and output terminals of the RF filter structures. The weakly coupled resonators from the filter paths may be arranged in a matrix. In one embodiment, an RF filter structure includes a first filter path and a second filter path. The first filter path includes (at least) a first pair of weakly coupled resonators while a second filter path includes (at least) a second pair of weakly coupled resonators. To interconnect the first filter path and the second filter path, a cross-coupling capacitive structure is electrically connected between the first filter path and the second filter path. As such, an additional filtering path may be realized through the interconnection provided by the cross-coupling capacitive structure.
Abstract:
The present disclosure provides a vertical inductor structure in which the magnetic field is closed such that the magnetic field of the vertical inductor structure is cancelled in the design direction outside the vertical inductor structure, yielding a small, or substantially zero, coupling factor of the vertical inductor structure. In one embodiment, several vertical inductor structures of the present disclosure can be placed in close proximity to create small resonant circuits and filter chains.
Abstract:
A radio frequency (RF) system includes an RF power amplifier (PA), which uses an envelope tracking power supply voltage to provide an RF transmit signal, which has an RF envelope; and further includes an envelope tracking power supply, which provides the envelope tracking power supply voltage based on a setpoint. RF transceiver circuitry, which includes envelope control circuitry and an RF modulator is disclosed. The envelope control circuitry provides the setpoint, such that the envelope tracking power supply voltage is clipped to form clipped regions and substantially tracks the RF envelope between the clipped regions, wherein a dynamic range of the envelope tracking power supply voltage is limited. The RF modulator provides an RF input signal to the RF PA, which receives and amplifies the RF input signal to provide the RF transmit signal.
Abstract:
The present disclosure provides a vertical inductor structure in which the magnetic field is closed such that the magnetic field of the vertical inductor structure is cancelled in the design direction outside the vertical inductor structure, yielding a small, or substantially zero, coupling factor of the vertical inductor structure. In one embodiment, several vertical inductor structures of the present disclosure can be placed in close proximity to create small resonant circuits and filter chains.
Abstract:
A lateral semiconductor device having a vertical region for providing a protective avalanche breakdown (PAB) is disclosed. The lateral semiconductor device has a lateral structure that includes a conductive substrate, semi-insulating layer(s) disposed on the conductive substrate, device layer(s) disposed on the semi-insulating layer(s), along with a source electrode and a drain electrode disposed on the device layer(s). The vertical region is separated from the source electrode by a lateral region wherein the vertical region has a relatively lower breakdown voltage level than a relatively higher breakdown voltage level of the lateral region for providing the PAB within the vertical region to prevent a potentially damaging breakdown of the lateral region. The vertical region is structured to be more rugged than the lateral region and thus will not be damaged by a PAB event.
Abstract:
The present disclosure provides a power device and power device packaging. Generally, the power device of the present disclosure includes a die backside and a die frontside. A semi-insulating substrate with epitaxial layers disposed thereon is sandwiched between the die backside and the die frontside. Pads on the die frontside are coupled to the die backside with patterned backmetals that are disposed within vias that pass through the semi-insulating substrate and epitaxial layers from the die backside to the die frontside.
Abstract:
This disclosure relates to radio frequency (RF) power converters and methods of operating the same. In one embodiment, an RF power converter includes an RF switching converter, a low-drop out (LDO) regulation circuit, and an RF filter. The RF filter is coupled to receive a pulsed output voltage from the RF switching converter and a supply voltage from the LDO regulation circuit. The RF filter is operable to alternate between a first RF filter topology and a second RF filter topology. In the first RF filter topology, the RF filter is configured to convert the pulsed output voltage from a switching circuit into the supply voltage. The RF filter in the second RF filter topology is configured to filter the supply voltage from the LDO regulation circuit to reduce a ripple variation in a supply voltage level of the supply voltage. As such, the RF filter provides greater versatility.
Abstract:
A direct current (DC)-DC converter, which includes a parallel amplifier and a switching supply, is disclosed. The switching supply includes switching circuitry, a first inductive element, and a second inductive element. The parallel amplifier has a feedback input and a parallel amplifier output. The switching circuitry has a switching circuitry output. The first inductive element is coupled between the switching circuitry output and the feedback input. The second inductive element is coupled between the feedback input and the parallel amplifier output.
Abstract:
Disclosed is a transceiver for an envelope following system that includes a power amplifier (PA) having a signal input, a signal output, and a power input that receives power from a power management system that modulates a supply voltage provided to the PA in response to an envelope signal. The transceiver includes a calibration subsystem that is adapted to provide a first test signal to the signal input of the PA and to provide a second test signal to the power management system in place of the envelope signal. The calibration subsystem is programmed with calibration methods that sweep the first test signal through a first range and to sweep the second test signal through a second range in order to derive values that make up a pseudo-envelope look-up table (LUT) that is usable by the transceiver.