公开(公告)号：WO2006069341A3

公开(公告)日：2006-10-12

申请号：PCT/US2005046877

申请日：2005-12-21

Applicant: APPLIED MATERIALS INC ,  ISHIKAWA TETSUYA ,  ROBERTS RICK J ,  ARMER HELEN R ,  VOLFOVSKI LEON ,  PINSON JAY D ,  RICE MICHAEL ,  QUACH DAVID H ,  SALEK MOHSEN S ,  LOWRANCE ROBERT ,  BACKER JOHN A ,  WEAVER WILLIAM TYLER ,  CARLSON CHARLES ,  WANG CHONGYANG ,  HUDGENS JEFFREY ,  HERCHEN HARALD ,  LUE BRIAN

Inventor： ISHIKAWA TETSUYA ,  ROBERTS RICK J ,  ARMER HELEN R ,  VOLFOVSKI LEON ,  PINSON JAY D ,  RICE MICHAEL ,  QUACH DAVID H ,  SALEK MOHSEN S ,  LOWRANCE ROBERT ,  BACKER JOHN A ,  WEAVER WILLIAM TYLER ,  CARLSON CHARLES ,  WANG CHONGYANG ,  HUDGENS JEFFREY ,  HERCHEN HARALD ,  LUE BRIAN

IPC: H01L21/00

CPC classification number: H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67766 ,  H01L21/67781

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased throughput, increased reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also has a smaller system footprint. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

Abstract translation: 实施例通常提供一种用于使用具有增加的吞吐量，增加的可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在群集工具中处理的衬底具有更可重复的晶片历史，并且还具有 较小的系统占用空间。 在集群工具的一个实施例中，通过将基板分组在一起并以两个或更多个组的方式传送和处理基板来降低所有权成本，以提高系统吞吐量，并且减少机器人必须进行的转移批次的移动次数 的处理室之间的基板，从而减少机器人的磨损并提高系统的可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：WO2006069348A3

公开(公告)日：2006-09-28

申请号：PCT/US2005046906

申请日：2005-12-21

Applicant: APPLIED MATERIALS INC ,  ISHIKAWA TETSUYA ,  ROBERTS RICK J

Inventor： ISHIKAWA TETSUYA ,  ROBERTS RICK J

IPC: B05C11/02 ,  B05B3/00 ,  B05C5/00

CPC classification number: H01L21/6719 ,  G03F7/3021 ,  H01L21/6715 ,  H01L21/67225

Abstract: An apparatus for dispensing fluid during semiconductor substrate process operations, wherein the apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles (114) coupled to a plurality of fluid sources and a first processing chamber (110) positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber (111) positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber and the second processing chamber.

Abstract translation: 一种用于在半导体衬底工艺操作期间分配流体的装置，其中所述装置包括中央流体分配组，所述中央流体分配组包括耦合到多个流体源的多个分配喷嘴（114）和位于所述第一处理室 中央液体分配银行。 该装置还包括位于中央流体分配库的第二侧的第二处理室（111）和适于在中央流体分配库，第一处理室和第二处理室之间平移的分配臂。

公开(公告)号：WO2004101840A1

公开(公告)日：2004-11-25

申请号：PCT/US2004/002850

申请日：2004-01-30

Applicant: APPLIED MATERIALS INC. ,  CUI, Zhenjiang ,  ROBERTS, Rick, J. ,  COX, Michael, S. ,  ZHAO, Jun

Inventor： CUI, Zhenjiang ,  ROBERTS, Rick, J. ,  COX, Michael, S. ,  ZHAO, Jun

IPC: C23C

CPC classification number: H01L21/76229

Abstract: A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.

Abstract translation: 一种填充蚀刻在衬底中的多个沟槽的方法。 在一个实施例中，该方法包括在衬底上沉积旋涂玻璃材料层并进入多个沟槽; 将旋涂玻璃材料层暴露于溶剂中; 固化旋涂玻璃材料层; 并使用化学气相沉积技术在固化的旋涂玻璃层上沉积二氧化硅玻璃层。

公开(公告)号：WO2006069348A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/046906

申请日：2005-12-21

Applicant: APPLIED MATERIALS, INC. ,  ISHIKAWA, Tetsuya ,  ROBERTS, Rick, J.

Inventor： ISHIKAWA, Tetsuya ,  ROBERTS, Rick, J.

IPC: B05D5/00

CPC classification number: H01L21/6719 ,  G03F7/3021 ,  H01L21/6715 ,  H01L21/67225

Abstract: An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.

Abstract translation: 一种用于在半导体衬底处理操作期间分配流体的装置。 该装置包括中央流体分配库，其包括耦合到多个流体源的多个分配喷嘴和位于中央流体分配池的第一侧的第一处理室。 该装置还包括位于中央流体分配库的第二侧的第二处理室和适于在中央流体分配库，第一处理室和第二处理室之间平移的分配臂。

公开(公告)号：WO2006069341A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/046877

申请日：2005-12-21

Applicant: APPLIED MATERIALS, INC. ,  ISHIKAWA, Tetsuya ,  ROBERTS, Rick, J. ,  ARMER, Helen, R. ,  VOLFOVSKI, Leon ,  PINSON, Jay, D. ,  RICE, Michael ,  QUACH, David, H. ,  SALEK, Mohsen, S. ,  LOWRANCE, Robert ,  BACKER, John, A. ,  WEAVER, William, Tyler ,  CARLSON, Charles ,  WANG, Chongyang ,  HUDGENS, Jeffrey ,  HERCHEN, Harald ,  LUE, Brian

Inventor： ISHIKAWA, Tetsuya ,  ROBERTS, Rick, J. ,  ARMER, Helen, R. ,  VOLFOVSKI, Leon ,  PINSON, Jay, D. ,  RICE, Michael ,  QUACH, David, H. ,  SALEK, Mohsen, S. ,  LOWRANCE, Robert ,  BACKER, John, A. ,  WEAVER, William, Tyler ,  CARLSON, Charles ,  WANG, Chongyang ,  HUDGENS, Jeffrey ,  HERCHEN, Harald ,  LUE, Brian

IPC: H01L21/00

CPC classification number: H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67766 ,  H01L21/67781

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased throughput, increased reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also has a smaller system footprint. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

Abstract translation: 实施方式通常提供了一种用于使用多室处理系统（例如，群集工具）来处理衬底的设备和方法，所述多室处理系统具有增加的生产量，增加的可靠性，在群集工具中处理的衬底具有更多 可重复的晶圆历史，并且还具有较小的系统尺寸。 在群集工具的一个实施例中，通过将衬底分组在一起并且以两个或更多个成组的方式传送和处理衬底来降低所有权成本，以提高系统吞吐量，并且减少机器人为了传送批次而必须做出的移动次数 的处理室之间的基板，从而减少了机器人的磨损并提高了系统的可靠性。 实施例还提供了用于增加衬底传输过程的可靠性以减少系统停机时间的方法和设备。