Abstract:
The present disclosure relates to an additive manufacturing (AM) method for making a three-dimensional (3D) object, comprising a) the provision of providing a powdered polymer material (M) comprising at least one poly(ether ether ketone) (PEEK) polymer, and at least one poly(ether imide) (PEI) polymer, b) the deposition of successive layers of the powdered polymer material; and c) the selective sintering of each layer prior to the deposition of the subsequent layer, wherein the powdered polymer material (M) is heated before step c) to a temperature Tp (°C): Tp
Abstract:
Provided is a polyolefin based composite material, in particular a composite material comprising polypropylene or polyethylene, mineral fibers, in particular glass fibers, and an organic salt, in particular a sulfonimide salt. Also provided is the use of a sulfonimide salt, for providing antistatic properties to a polyolefin based composite material reinforced with mineral fibers, and the use of mineral fibers, in particular glass fibers, for enhancing the electric conductivity of a polyolefin based composite comprising a sulfonimide salt.
Abstract:
Use of an effective amount (ε) of a poly(biphenyl ether sulfone) (P2) for diluting a poly(aryl ether ketone) (P1) contained in a polymer composition (C1) consisting of the poly(aryl ether ketone) (P1) and, optionally in addition, one or more ingredients (A) other than the poly(aryl ether ketone) (P1) and the poly(biphenyl ether sulfone) (P2), while at least substantially maintaining the chemical resistance of the polymer composition (C1) in a chemical environment (E) which is more aggressive against the poly(biphenyl ether sulfone) (P2) than against the poly(aryl ether ketone) (P1).
Abstract:
The present disclosure relates to a composite film made of at least LCP and a fiber fabric, for example presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).
Abstract:
Described herein are polyamides (PA) formed from a reaction mixture (RM) including a diamine component (DA) and a dicarboxylic acid component (DC). The diamine component (DA) includes at least 99 mol% of 1,3-bis(aminomethyl)cyclohexane ("1,3-BAC") and the dicarboxyic acid component (DC) includes at least 90 mol% of terephthalic acid ("TA"). It was surprisingly found that the polyamides (PA) had and increased glass transition temperature ("Tg"), while maintaining high melting temperatures ("Tm") and high crystallinity. More particularly, in some embodiments, the polyamides (PA) have a Tg of at least 165 °C, a Tm of at least 280 °C and a heat of fusion ("ΔHf") of at least 20 J/g. Due at least in part to the relative high Tg, Tm and crystallinity (measured by ΔHf), the polyamides (PA) can be advantageously used in high heat application settings, while maintaining desirable mechanical, electrical properties and chemical resistance
Abstract:
Coating composition, uses and methods for making a substrate frost resistant The present invention pertains to the use ofa coating composition comprising: -at least one polymer (ZW) comprising zwitterionic repeating units derived from at least one zwitterionic monomer (A), -at least one polymer (CA) different from polymer (ZW) comprising repeating units derived from at least one carboxylic acid and/or carboxylic anhydride containing monomer (B), and -at least one crosslinking agent (CL). The invention also pertains to the use ofsaid coating composition (C) for making frost resistant a substrate and to articles coated with composition (C).
Abstract:
A polymer composition includes at least one PEDEK-PEEK copolymer having a PEDEK/PEEK mole ratio ranging from 55/45 to 80/20, and at least one friction and wear additive. Methods of making the polymer composition and shaped articles including the polymer composition are also described.
Abstract:
The invention relates to polymers (P) of amides, imides, amides-imides or their derivates. The polymer (P) comprising recurring units (I) of one or more structural formula(e):-A-B-C-D- (I), wherein, A and C, identical or different from each other and from one structural formula to another, independently represent an amido group an imido group of formula or a mixture thereof; B, identical or different from one structural formula to another, is independently selected from the set consisting of C 4 -C 50 hydrocarbon groups, C 12 -C 50 groups, a dibenzodiazocine-containing divalent group, and a mixture thereof; D, identical or different from one structural formula to another, independently represents a dibenzodiazocine-containing divalent group. The invention also relates to a process for the preparation of said polymers. Moreover, the invention relates to polymer compositions containing said polymer, its shaped articles or shaped parts as well as applications of those polymers. On other aspect, the present invention relates to new monomers containing at least one dibenzodiazocine.
Abstract:
Polymer composition (C) containing (i) a poly(aryl ether sulfone) material (M12) composed of a poly(biphenyl ether sulfone) (P1) and, optionally in addition, a poly(aryl ether sulfone) (P2) containing recurring units with arylene groups linked to each other via a secondary, ternary or quaternary carbon atom, and (ii) a per(halo)fluoropolymer material (M34), composed of a per(halo)fluoropolymer (P3) of which at least 2.0 wt. % of the recurring units are derived from a per(halo)fluoromonomer other than tetrafluoroethylene, and a polytetrafluoro ethylene (P4). Shaped article, especially aircraft interior component, comprising the polymer composition (C).
Abstract:
Use of at least one kinked rigid-rod polyarylene of a specific type for its fire resistance properties. Films and coatings consisting of a material comprising the same kinked rigid-rod polyarylene.