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    TRIBOELECTRIC CHARGE CONTROLLED ELECTRO-STATIC CLAMP
    1.
    发明申请
    TRIBOELECTRIC CHARGE CONTROLLED ELECTRO-STATIC CLAMP 审中-公开
    三电荷充电控制电动夹

    公开(公告)号：WO2012109071A1

    公开(公告)日：2012-08-16

    申请号：PCT/US2012/023481

    申请日：2012-02-01

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. ,  BLAKE, Julian, G. ,  STONE, Dale, K. ,  STONE, Lyudmila ,  SUURONEN, David, E. ,  OSHIRO, Shigeo

    Inventor： BLAKE, Julian, G. ,  STONE, Dale, K. ,  STONE, Lyudmila ,  SUURONEN, David, E. ,  OSHIRO, Shigeo

    IPC: H01L21/683

    CPC classification number: H01L21/6831

    Abstract: An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck In which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate.

    Abstract translation: 公开了一种在去除之前更有效地从衬底去除积聚电荷的静电夹。 目前，升降针和接地引脚是用于在植入后从衬底去除电荷的唯一机制。 本公开描述了一种静电卡盘，其中顶部电介质表面具有嵌入的导电区域，例如密封环中的环形导电区域。 因此，无论衬底在释放过程中的取向如何，衬底的至少一部分将包含工件支撑体的电介质层上的导电区域。 该导电区域可以通过使用电介质层中的导电通孔而连接到地。 在一些实施例中，这些导电通孔是用于向衬底的背侧供应气体的流体导管。

    REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP
    3.
    发明申请
    REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP 审中-公开
    去除基板和静电夹之间的电荷

    公开(公告)号：WO2010120983A2

    公开(公告)日：2010-10-21

    申请号：PCT/US2010/031170

    申请日：2010-04-15

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES ,  STONE, Dale, K. ,  STONE, Lyudmila ,  PETRY, Klaus ,  SUURONEN, David ,  BLAKE, Julian, G.

    Inventor： STONE, Dale, K. ,  STONE, Lyudmila ,  PETRY, Klaus ,  SUURONEN, David ,  BLAKE, Julian, G.

    IPC: H01L21/265 ,  H01L21/687

    CPC classification number: H01L21/6831 ,  H01L21/68742 ,  Y10T29/49998 ,  Y10T279/23

    Abstract: An electrostatic clamp, which more effectively removes built up charge from a substrate prior to and during removal, is disclosed. Currently, the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation. The present discloses describes a clamp having one of more additional Sow resistance paths to ground. These additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp. By providing sufficient charge drainage from the backside surface of the substrate 114, the problem whereby the substrate sticks to the clamp can be reduced. This results in a corresponding reduction in substrate breakage.

    Abstract translation: 公开了一种静电夹具，其在去除和移除之前更有效地从衬底上去除积聚的电荷。 目前，电极引脚和接地引脚是植入后从衬底去除电荷的唯一机制。 本公开描述了一种夹具，具有一个更多额外的Sow电阻到地的路径。 这些额外的管道允许在从夹具移除衬底之前和期间消耗积分电荷。 通过从基板114的背面提供足够的电荷排出，可以减少基板粘附到夹具上的问题。 这导致基板断裂的相应减少。

    EMBOSSED ELECTROSTATIC CHUCK
    5.
    发明申请
    EMBOSSED ELECTROSTATIC CHUCK 审中-公开
    嵌入式静电切割机

    公开(公告)号：WO2009064974A3

    公开(公告)日：2009-08-06

    申请号：PCT/US2008083540

    申请日：2008-11-14

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ,  LISCHER D JEFFREY ,  STONE DALE K ,  STONE LYUDMILA ,  SUURONEN DAVID ,  BLAKE JULIAN G

    Inventor： LISCHER D JEFFREY ,  STONE DALE K ,  STONE LYUDMILA ,  SUURONEN DAVID ,  BLAKE JULIAN G

    IPC: H01L21/683 ,  H01L21/687

    CPC classification number: H01L21/6831

    Abstract: An electrostatic chuck includes a layer having a plurality of protrusions to support a workpiece, wherein at least a portion of the layer has a first plurality of the plurality of protrusions. The first plurality of protrusions is spaced to geometrically form a pattern of hexagons. The first plurality of protrusions may be spaced an equal distance from adjacent protrusions and the equal distance may be about 4.0 millimeters from a center of one protrusion to a center of another protrusion. The present disclosure reduces peak mechanical stress levels conventionally present along an edge of each protrusion. Reducing such mechanical stress levels helps reduce backside damage to a supported workpiece, which in turn can reduce the generation of unwanted particles caused by such damage.

    Abstract translation: 静电卡盘包括具有多个突起以支撑工件的层，其中该层的至少一部分具有第一多个多个突起。 第一多个突起间隔几何形成六边形图案。 第一多个突起可以与相邻的突起间隔开相等的距离，并且等距离可以是距离一个突起的中心到另一个突起的中心的约4.0毫米。 本公开减少了沿着每个突起的边缘常规存在的峰值机械应力水平。 降低这种机械应力水平有助于减少支撑的工件的背面损坏，这又可以减少由这种损坏引起的不想要的颗粒的产生。

    REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP
    6.
    发明申请
    REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP 审中-公开
    去除基板和静电夹之间的电荷

    公开(公告)号：WO2010120983A3

    公开(公告)日：2011-01-13

    申请号：PCT/US2010031170

    申请日：2010-04-15

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ,  STONE DALE K ,  STONE LYUDMILA ,  PETRY KLAUS ,  SUURONEN DAVID ,  BLAKE JULIAN G

    Inventor： STONE DALE K ,  STONE LYUDMILA ,  PETRY KLAUS ,  SUURONEN DAVID ,  BLAKE JULIAN G

    IPC: H01L21/265 ,  H01L21/687

    CPC classification number: H01L21/6831 ,  H01L21/68742 ,  Y10T29/49998 ,  Y10T279/23

    Abstract: An electrostatic clamp, which more effectively removes built up charge from a substrate prior to and during removal, is disclosed. Currently, the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation. The present discloses describes a clamp having one of more additional Sow resistance paths to ground. These additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp. By providing sufficient charge drainage from the backside surface of the substrate 114, the problem whereby the substrate sticks to the clamp can be reduced. This results in a corresponding reduction in substrate breakage.

    Abstract translation: 公开了一种静电夹具，其在去除和移除之前更有效地从衬底上去除积聚的电荷。 目前，电极引脚和接地引脚是植入后从衬底去除电荷的唯一机制。 本公开描述了一种夹具，具有一个更多额外的Sow电阻到地的路径。 这些额外的管道允许在从夹具移除衬底之前和期间消耗积分电荷。 通过从基板114的背面提供足够的电荷排出，可以减少基板粘附到夹具上的问题。 这导致基板断裂的相应减少。

    EMBOSSED ELECTROSTATIC CHUCK
    7.
    发明申请
    EMBOSSED ELECTROSTATIC CHUCK 审中-公开
    压花静电卡盘

    公开(公告)号：WO2009064974A2

    公开(公告)日：2009-05-22

    申请号：PCT/US2008/083540

    申请日：2008-11-14

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. ,  LISCHER, D., Jeffrey ,  STONE, Dale, K. ,  STONE, Lyudmila ,  SUURONEN, David ,  BLAKE, Julian, G.

    Inventor： LISCHER, D., Jeffrey ,  STONE, Dale, K. ,  STONE, Lyudmila ,  SUURONEN, David ,  BLAKE, Julian, G.

    IPC: H01L21/683 ,  H01L21/68

    CPC classification number: H01L21/6831

    Abstract: An electrostatic chuck includes a layer having a plurality of protrusions to support a workpiece, wherein at least a portion of the layer has a first plurality of the plurality of protrusions. The first plurality of protrusions is spaced to geometrically form a pattern of hexagons. The first plurality of protrusions may be spaced an equal distance from adjacent protrusions and the equal distance may be about 4.0 millimeters from a center of one protrusion to a center of another protrusion. The present disclosure reduces peak mechanical stress levels conventionally present along an edge of each protrusion. Reducing such mechanical stress levels helps reduce backside damage to a supported workpiece, which in turn can reduce the generation of unwanted particles caused by such damage.

    Abstract translation: 静电吸盘包括具有多个支撑工件的突起的层，其中该层的至少一部分具有第一多个多个突起。 第一多个突起间隔开以几何形成六边形图案。 第一多个突起可以与相邻的突起间隔相等的距离，并且等距离可以从一个突起的中心到另一个突起的中心大约4.0毫米。 本公开减少沿着每个突起的边缘常规存在的峰值机械应力水平。 减少这种机械应力水平有助于减少对支撑工件的背面损伤，进而减少由此类损伤引起的不需要的颗粒的产生。

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