Abstract:
The invention relates to a process for monitoring a disperse system for non-dispersed impurities (16) before processing of said system into an end product. During said process, part of the disperse system is extruded before processing to form a strip (7) and the impurities in said strip are detected. To this end, weak X-rays are beamed through small areas of the strip (7) continuously or gradually and at right angles to the strip plane. The X-rays emerging from the areas of the strip through which they have passed are subsequently detected in areas. The type, number, size, shape and/ or distribution of the impurities (16) are determined by the detected rays. It is particularly advantageous that impurities inside the strip and also on the surface thereof are detected as a result of X-rays passing through the strip (7). If the impurities (16) exceed a predetermined threshold, the disperse system does not undergo further processing.
Abstract:
A device for epitaxially growing objects of for instance SiC by Chemical Vapour Deposition on a substrate has a first conduit (24) arranged to conduct substantially only a carrier gas to a room (18) receiving the substrate and a second conduit (25) received in the first conduit, having a smaller cross section than the first conduit and extending in the longitudinal direction of the first conduit with a circumferential space separating it from inner walls of the first conduit. The second conduit is adapted to conduct substantially the entire flow of reactive gases and it ends as seen in the direction of said flows, and emerges into said first conduit at a distance from said room.
Abstract:
A semiconductor component and a method for processing said component, which comprises a pn junction, where both the p-conducting (3) and the n-conducting layers (2) of the pn junction constitute doped silicon carbide layers, where the junction is at the edge of the lower doped conducting layer terminated by a depletion region stopper (DRS) which exhibits a charge profile with a stepwise or uniformly increasing total charge and/or effective sheet charge density from a first lowest value to a highest value at the outermost edge (5) of the junction following a radial direction from the main junction towards the outermost edge.
Abstract:
A nickel-base superalloy, in particular for the production of large single-crystal components, consisting essentially of 6.0-6.8 % Cr, 8.0-10.0 % Co, 0.5-0.7 % Mo, 6.2-6.6 % W, 2.7-3.2 % Re, 5.4-5.8 % Al, 0.6-1.2 % Ti, 6.3-7.0 % Ta, 0.15-0.3 % Hf and 0.02-0.04 % C (all by weight), 40-100 ppm B and 15-50 ppm Mg, the remainder being made up of nickel and impurities.
Abstract:
A device for performing, individually or in combination with each other, the functions of voltage control, power factor correction, current limiting and harmonic filtering at a network, with a line voltage U0 and a load voltage U, with the aid of a control voltage DELTA U. The device comprises a controllable reactor comprising at least one control winding (7) and at least one power winding (5) for generating the control voltage DELTA U, as well as a control unit (10) which, via at least one power amplifier (9), delivers a control current Is to the control winding. The power winding is connected in series with the load (2) and through it flows a load current I0. A measuring member (8) senses the magnetic flux ( PHI ) of the controllable reactor and delivers a flux voltage V PHI proportional thereto. Via measuring members, those signals which correspond to the line voltage U0, the load voltage U, the control voltage DELTA U, the load current I0 and the flux voltage V PHI are fed back to the control unit which, in dependence thereon, via the power amplifier(s), delivers such a control current Is to the control winding that the control voltage DELTA U induced in the power winding supplements the line voltage U0 such that the relevant functions or function are/is achieved.
Abstract:
A susceptor for a device for epitaxially growing objects of one of a) SiC, b) a Group 3B-nitride and c) alloys thereof on a substrate to be received in the susceptor has a channel (10') adapted to receive said substrate and through which a source material for the growth is intended to be fed, the walls (8') of the susceptor surrounding said channel being intended to be heated by heating means intended to surround the susceptor. The susceptor is provided with at least two channels (10') adapted to receive at least one substrate for growth of at least one said object each and to receive a portion each of a flow of said source material to be fed to the susceptor for said growth.
Abstract:
In a method for epitaxially growing objects of SiC, a Group III-nitride or alloys thereof on a substrate (13) received in a susceptor (7) having circumferential walls (8) these walls and by that the substrate and a source material (24) for the growth are heated above a temperature level from which sublimation of the material grown starts to increase considerably. The carrier gas flow is fed into the susceptor towards the substrate for carrying said source material to the substrate for said growth. At least a part of said source material for said growth is added to the carrier gas flow upstream the susceptor (7) and carried by the carrier gas flow to the susceptor in one of a) a solid state and b) a liquid state for being brought to a vapour state in a container comprising said susceptor by said heating and carried in a vapour state to said substrate for said growth.
Abstract:
The present invention concerns a method of locating a ground fault in a power distribution network, in which method the start instant of the fault transient is determined from the change of the neutral point voltage, the current and voltage transient signals of the faulty phase are filtered, the duration of the transient is determined, the frequency of the fault transient waveform is estimated, the measured voltage and current transient signals are low-pass filtered, the spectra U( omega ) and I( omega ), of the voltage and current transients are computed, the impedance spectrum (1) is computed, and the estimate of the fault distance is computed for a discrete angular frequency omega k from the equation (2). According to the invention, the voltage and current signals of the faulty phase are filtered using a comb filter, the measured voltage and current signals are low-pass filtered in two directions, the frequency of the charge/discharge transient is estimated from the autocorrelation function of the transient, and the complex value spectra U( omega ) and I( omega ) of the voltage and current transients are computed using parametric spectral estimation methods.
Abstract:
In a method for monitoring of partial discharges in an electric power transformer (1) under normal operating conditions, the magnetic field at a high-voltage bushing (2) on the power transformer is sensed with an inductive sensor (6) comprising at least one coil (6a, 6b) arranged at the bushing, and the electric field at the bushing is sensed with a capacitive sensor (5). The output signals from said sensors are supplied to a signal processing unit (3) in which each one of the output signals is filtered in a separate bandpass filter (101, 102), whereupon the filtered output signals from said sensors are multiplied by each other. An output signal (PDI) from the signal processing unit is formed in dependence on the result of said multiplication for the purpose of detecting internal partial discharges in the transformer.
Abstract:
A method of protecting organic materials such as oils, fats and polymeric materials, which are subjected to oxidation or other degrading influence from external factors such as heat or other radiation as well as electric or magnetic fields, whereby essentially globular or tubular carbon molecules, so-called fullerenes, or derivatives based on said carbon molecules, are added to the organic material.