公开(公告)号：WO2015103362A1

公开(公告)日：2015-07-09

申请号：PCT/US2014/072936

申请日：2014-12-31

Applicant: ALPHA METALS, INC. ,  RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai

Inventor： RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai ,  SARKAR, Siuli ,  VENKATAGIRIYAPPA, Ramakrishna, Hosur

IPC: B23K35/362

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Abstract translation: 无松动的热固性助焊剂配方，用于增强焊点的机械可靠性。 根据一个或多个方面，本文所示和描述的焊膏赋予与液滴冲击，热循环，热冲击，剪切强度，弯曲强度性能和/或其它热量中的至少一种相关的改进或增强的焊点性能 机械性能属性。

公开(公告)号：WO2015017615A1

公开(公告)日：2015-02-05

申请号：PCT/US2014/049046

申请日：2014-07-31

Applicant: ALPHA METALS, INC.

Inventor： VENKATAGIRIYAPPA, Ramakrishna, Hosur ,  MUKHERJEE, Sutapa ,  SIDDAPPA, Harish, Hanchina ,  RIBAS, Morgana, De Avila ,  SARKAR, Siuli ,  SINGH, Bawa ,  RAUT, Rahul

IPC: H01L21/48

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L22/12 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/0133 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

Abstract translation: 双边加固（DSR）材料和半导体制造方法。 DSR材料表现出常规底层填充材料的性能，在室温下具有增强的稳定性。