公开(公告)号：WO2017213796A1

公开(公告)日：2017-12-14

申请号：PCT/US2017/032433

申请日：2017-05-12

Applicant: APPLE INC.

Inventor： BACON, Roderick D. ,  BAGE JAYARAJ, Nagendra ,  DICARLO, Derek J. ,  HO, Chi Kin ,  LI, Xingqun ,  MINOO, Jahan C. ,  MUSUNURI, Surya ,  NG, Tony Chi Wang ,  RIBAS, Carlos ,  TAM, Ching Yu John ,  THOMPSON, Evan J. ,  WAGMAN, Daniel C. ,  ZHAO, Di ,  ZUPKE, Robert D.

IPC: G06F13/40 ,  H04L12/40

CPC classification number: H02H9/04 ,  G06F13/4068 ,  H01R13/6683 ,  H01R13/713 ,  H01R24/60 ,  H01R2107/00 ,  H04L12/40045 ,  Y02D10/14 ,  Y02D10/151

Abstract: A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.

Abstract translation: 测量作为系统的外部连接器的多个引脚之一的第一引脚的电压，而除了通过第一电阻被拉到地之外，第一引脚是未驱动的，并且 外部连接器的第二引脚被用作系统的电源导轨。 将测量的电压与短路阈值进行比较，并且响应于超过该阈值，第二引脚上的电源电压降低。 在这样的实施例中，不需要将测试刺激施加到外部连接器的任何引脚。 其他实施例也被描述和要求保护。

公开(公告)号：WO2014051848A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/052389

申请日：2013-07-26

Applicant: APPLE INC.

Inventor： LI, Xingqun ,  RIBAS, Carlos ,  PYPER, Dennis, R. ,  FOSTER, James, H. ,  FISHER, Joseph, R., Jr. ,  MULLINS, Scott, P. ,  MAYO, Sean, A. ,  CHEN, Wyeman

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L2224/16235 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4614 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  Y10T29/49146

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract translation: 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入器安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。