公开(公告)号：WO2015134157A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/015054

申请日：2015-02-09

Applicant: APPLIED MATERIALS, INC.

Inventor： COX, Michael, S. ,  WANG, Rongping ,  WEST, Brian ,  JOHNSON, Roger, M. ,  DICKINSON, Colin, John

IPC: H01L21/02 ,  H05H1/46

CPC classification number: H01J37/32844 ,  B01D53/323 ,  B01D2257/55 ,  B01D2257/553 ,  B01D2257/556 ,  B01D2258/0216 ,  H01J37/32082 ,  H01J37/32357 ,  H01J37/32495 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32596 ,  H01J37/32669 ,  H01J37/32825 ,  H01J2237/332 ,  H01J2237/334 ,  H01J2237/335 ,  H01L21/02123 ,  H01L21/02274 ,  Y02C20/30

Abstract: Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes a plasma source that has a first plate and a second plate parallel to the first plate. An electrode is disposed between the first and second plates and an outer wall is disposed between the first and second plates surrounding the electrode. The plasma source has a first plurality of magnets disposed on the first plate and a second plurality of magnets disposed on the second plate. The magnetic field created by the first and second plurality of magnets is substantially perpendicular to the electric field created between the electrode and the outer wall. In this configuration, a dense plasma is created.

Abstract translation: 本文公开的实施方案包括减轻半导体工艺中产生的化合物的减排系统。 减排系统包括具有平行于第一板的第一板和第二板的等离子体源。 电极设置在第一和第二板之间，并且外壁设置在围绕电极的第一和第二板之间。 等离子体源具有设置在第一板上的第一多个磁体和设置在第二板上的第二多个磁体。 由第一和第二多个磁体产生的磁场基本上垂直于在电极和外壁之间产生的电场。 在该配置中，产生致密等离子体。

公开(公告)号：WO2013033102A1

公开(公告)日：2013-03-07

申请号：PCT/US2012/052680

申请日：2012-08-28

Applicant: APPLIED MATERIALS, INC. ,  WEST, Brian ,  YOSHIDOME, Goichi ,  HOFMANN, Ralf

Inventor： WEST, Brian ,  YOSHIDOME, Goichi ,  HOFMANN, Ralf

IPC: C23C14/34 ,  C23C14/35

CPC classification number: C23C14/3407 ,  H01J37/3414 ,  H01J37/3497

Abstract: Apparatus and method for physical vapor deposition are provided. In some embodiments, a cooling ring to cool a target in a physical vapor deposition chamber may include an annular body having a central opening; an inlet port coupled to the body; an outlet port coupled to the body; a coolant channel disposed in the body and having a first end coupled to the inlet port and a second end coupled to the outlet port; and a cap coupled to the body and substantially spanning the central opening, wherein the cap includes a center hole.

Abstract translation: 提供了用于物理气相沉积的装置和方法。 在一些实施例中，用于冷却物理气相沉积室中的靶的冷却环可以包括具有中心开口的环形体; 连接到所述主体的入口端口; 连接到所述主体的出口; 冷却剂通道，其设置在所述主体中并且具有联接到所述入口的第一端和联接到所述出口的第二端; 以及联接到所述主体并且基本跨越所述中心开口的盖，其中所述盖包括中心孔。

公开(公告)号：WO2005005278A1

公开(公告)日：2005-01-20

申请号：PCT/US2004/003546

申请日：2004-02-06

Applicant: APPLIED MATERIALS, INC. ,  SCHAUER, Ronald ,  WANG, Jim Junshi ,  WANG, Hong ,  WEST, Brian ,  HE, Yongxiang

Inventor： SCHAUER, Ronald ,  WANG, Jim Junshi ,  WANG, Hong ,  WEST, Brian ,  HE, Yongxiang

IPC: B65D81/05

CPC classification number: B65D81/05

Abstract: Disclosed herein is a non-contact package useful (110) when an article (130) to be stored or shipped in the package includes a sensitive surface (132), the performance of which will be detrimentally affected if the sensitive surface is contacted with a nominal amount of mechanical force. A fluid environment which does not produce sufficient mechanical force to detrimentally affect the sensitive surface may be used in contact with the sensitive surface to prevent an undesirable chemical reaction on the sensitive surface. A fluid environment may also be used inside the package to support surrounding walls of the package so that such walls do not contact the sensitive surface and/or to dissipate force applied to the exterior of the package so that the sensitive surface will not be damaged. The more advantageous embodiments of the non-contact packaging not only protect sensitive surfaces of articles within the packaging during storage and shipping of the package, but also reduce the possibility that sensitive surfaces of the article will be damaged by contact with the packaging material during removal of the article from the package.

Abstract translation: 本文公开的是当在包装中被储存或运输的物品（130）包括敏感表面（132）时，有用的（110）非接触包装（110），如果敏感表面与其接触，则其性能将受到不利影响 额定机械力量。 不能产生足够的机械力以不利地影响敏感表面的流体环境可以与敏感表面接触以防止在敏感表面上的不期望的化学反应。 包装内还可以使用流体环境以支撑包装的周围壁，使得这些壁不接触敏感表面和/或消散施加到包装外部的力，使得敏感表面不会被损坏。 非接触式包装的更有利的实施例不仅在包装的储存和运输期间保护包装内的物品的敏感表面，而且还降低了在去除期间通过与包装材料的接触而损坏制品的敏感表面的可能性 的文章从包中。

公开(公告)号：WO2015122979A1

公开(公告)日：2015-08-20

申请号：PCT/US2015/011203

申请日：2015-01-13

Applicant: APPLIED MATERIALS, INC.

Inventor： WEST, Brian ,  COX, Michael, S. ,  OH, Jeonghoon

IPC: H01L21/203 ,  H01L21/683 ,  H01L21/02

CPC classification number: C23C14/541 ,  C23C14/50 ,  C23C16/4586 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109 ,  H01L23/34

Abstract: Embodiments of the present disclosure provides apparatus and method for stabilizing substrate temperature by flowing a flow of cooling gas to an inlet of cooling channels in a substrate support, receiving the flow of cooling gas from an outlet of the cooling channel using a heat exchanger, and releasing the cooling gas to an immediate environment, such as a cleanroom or a minienvironment.

Abstract translation: 本公开的实施例提供了用于通过将冷却气流流向衬底支撑件中的冷却通道的入口来稳定衬底温度的装置和方法，使用热交换器从冷却通道的出口接收冷却气体流;以及 将冷却气体释放到直接的环境中，例如洁净室或微小环境。

公开(公告)号：WO2014149678A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/020272

申请日：2014-03-04

Applicant: APPLIED MATERIALS, INC.

Inventor： WEST, Brian ,  PARKHE, Vijay ,  HIRAHARA, Robert ,  DEYO, Dan

IPC: H01L21/683 ,  H01L21/205

CPC classification number: H01L21/6833 ,  C23C14/50 ,  C23C14/541 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20

Abstract: A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central opening disposed proximate the bottom surface of the electrostatic chuck, the cooling ring assembly including, a cooling section having a top surface thermally coupled to the bottom surface of the electrostatic chuck, the cooling section having a cooling channel formed in a bottom surface of the cooling section, and a cap coupled to a bottom surface of the cooling section and fluidly sealing the cooling channel formed in the cooling section.

Abstract translation: 本文提供了一种用于基板处理系统的基板支撑卡盘。 在一些实施例中，用于基板处理室的基板支撑件可以包括具有顶部基板支撑表面和底部表面的静电卡盘，以及具有靠近静电卡盘的底表面设置的中心开口的冷却环组件， 冷却环组件包括：具有热耦合到静电卡盘的底表面的顶表面的冷却部分，冷却部分具有形成在冷却部分的底表面中的冷却通道，以及联接到冷却部分的底表面的帽 冷却部分并且流体地密封形成在冷却部分中的冷却通道。