Abstract:
The present techniques generally relate to fabrication of correlated electron materials used, for example, to perform specified application performance parameters 277-283. In embodiments, CEM devices fabricated at a first stage of a wafer fabrication process, such as a front-end-of-line stage, may differ from CEM devices fabricated at a second stage of a wafer fabrication process, such as a middle-of-line stage or a back-end-of-line stage, for example.
Abstract:
Disclosed are methods, systems and devices for operation of memory device. A bitcell may represent a binary value, symbol, parameter or condition based on complementary impedance states of first and second memory elements. A first bitline and a second bitline may be coupled to terminals of the first and second memory elements. A circuit may detect the complementary impedance states responsive to a difference in a rates of charging of the first and second bitlines.
Abstract:
The present techniques generally relate to correlated electron switch devices, and may relate more particularly to digital to analog conversion using correlated electron switch devices.
Abstract:
The present techniques generally relate to correlated electron switch elements and, more particularly, to controlling current through correlated electron switch elements during programming operations.
Abstract:
The present techniques generally relate to devices, such as conducting elements, which operate to place correlated electron switch elements into first and second impedance states. In embodiments, conducting elements are maintained to be at least partially closed continuously during first and second phases of coupling the CES elements between a common source voltage and a corresponding bitline.
Abstract:
The present techniques generally relate to methods, systems and devices for operation of non-volatile memory devices, whereby in an embodiment,a read operation or a particular write operation may be performed on a correlated electron switch (CES) device by coupling a terminal of the CES device to a particular node through any one of multiple different resistive paths.
Abstract:
Disclosed are methods, systems and devices for operation of non-volatile memory devices. In one embodiment, a sense circuit may enable a determination of a current impedance state of a non-volatile memory element while avoiding an unintentional change in the state of the non-volatile memory element.