METHOD FOR REMOVING A CONTAMINATION LAYER FROM AN OPTICAL SURFACE, METHOD FOR GENERATING A CLEANING GAS, AND CORRESPONDING CLEANING AND CLEANING...
    2.
    发明申请
    METHOD FOR REMOVING A CONTAMINATION LAYER FROM AN OPTICAL SURFACE, METHOD FOR GENERATING A CLEANING GAS, AND CORRESPONDING CLEANING AND CLEANING... 审中-公开
    从光学表面去除污染层的方法,用于产生清洁气体的方法以及相应的清洁和清洁方法

    公开(公告)号:WO2009059614A1

    公开(公告)日:2009-05-14

    申请号:PCT/EP2007/009593

    申请日:2007-11-06

    CPC classification number: B08B5/02 B08B7/00 G03F7/70925

    Abstract: The invention relates to a method for at least partially removing a contamination layer (15) from an optical surface (14a) of an EUV-reflective optical element (14) by bringing a cleaning gas, preferably comprising atomic hydrogen, into contact with the contamination layer (15), the method comprising the steps of: directing a jet (20) of cleaning gas to the contamination layer (15) for removing material from the contamination layer (15), monitoring the contamination layer (15) for generating a signal indicative of the thickness of the contamination layer (15), and controlling the jet (20) of cleaning gas by moving the jet (20) of cleaning gas relative to the optical surface (14a) using the signal indicative of the thickness of the contamination layer (15) as a feedback signal, and to a corresponding cleaning arrangement (19 to 24). The invention further relates to a method for generating a jet (20) of cleaning gas, as well as to a corresponding cleaning gas generation arrangement.

    Abstract translation: 本发明涉及通过使清洁气体(优选包括原子氢)与污染物接触而至少部分地从EUV反射光学元件(14)的光学表面(14a)去除污染物层(15)的方法 层(15),所述方法包括以下步骤:将清洁气体的喷嘴(20)引导到污染层(15)以从污染层(15)去除材料,监测污染层(15)以产生信号 指示污染层(15)的厚度,以及通过使用指示污染物厚度的信号相对于光学表面(14a)移动清洁气体的喷嘴(20)来控制清洁气体的喷嘴(20) 层(15)作为反馈信号,以及相应的清洁装置(19至24)。 本发明还涉及一种用于产生清洁气体的喷嘴(20)的方法,以及相应的清洁气体产生装置。

    OPTICAL ELEMENT AND OPTICAL SYSTEM FOR EUV LITHOGRAPHY, AND METHOD FOR TREATING SUCH AN OPTICAL ELEMENT
    3.
    发明申请
    OPTICAL ELEMENT AND OPTICAL SYSTEM FOR EUV LITHOGRAPHY, AND METHOD FOR TREATING SUCH AN OPTICAL ELEMENT 审中-公开
    用于EUV光刻的光学元件和光学系统,以及用于处理这种光学元件的方法

    公开(公告)号:WO2014139694A1

    公开(公告)日:2014-09-18

    申请号:PCT/EP2014/050471

    申请日:2014-01-13

    Abstract: The invention relates to an optical element (50), comprising: a substrate (52), an EUV radiation reflecting multilayer system (51) applied to the substrate (52), and a protective layer system (60) applied to the multilayer system (51) and having at least a first and a second layer (57, 58), wherein the first layer (57) is arranged closer to the multilayer system (51) than the second layer (58). The first layer (57) serves as a diffusion barrier for hydrogen and has a lower solubility for hydrogen than the second layer (58), which serves for absorbing hydrogen. The invention also relates to an optical system for EUV lithography which comprises at least one such optical element (50), and to a method for treating an optical element (50) in order to remove hydrogen incorporated in at least one layer (57, 58, 59) of the protective layer system (60) and/or in at least one layer (53, 54) of the multilayer system (51).

    Abstract translation: 本发明涉及一种光学元件(50),包括:衬底(52),施加到衬底(52)的EUV辐射反射多层系统(51)和应用于多层系统的保护层系统(60) 51)并且具有至少第一和第二层(57,58),其中所述第一层(57)比所述第二层(58)更靠近所述多层系统(51)布置。 第一层(57)用作氢的扩散阻挡层并且具有比用于吸收氢的第二层(58)更低的氢的溶解度。 本发明还涉及一种用于EUV光刻的光学系统,其包括至少一个这样的光学元件(50),以及一种用于处理光学元件(50)以便除去并入至少一层(57,58 ,59)和/或所述多层系统(51)的至少一层(53,54)中。

    METHOD FOR OPTIMIZING A PROTECTIVE LAYER SYSTEM FOR AN OPTICAL ELEMENT, OPTICAL ELEMENT AND OPTICAL SYSTEM FOR EUV LITHOGRAPHY
    4.
    发明申请
    METHOD FOR OPTIMIZING A PROTECTIVE LAYER SYSTEM FOR AN OPTICAL ELEMENT, OPTICAL ELEMENT AND OPTICAL SYSTEM FOR EUV LITHOGRAPHY 审中-公开
    用于优化光学元件的保护层系统的方法,用于EUV光刻的光学元件和光学系统

    公开(公告)号:WO2013124224A1

    公开(公告)日:2013-08-29

    申请号:PCT/EP2013/053091

    申请日:2013-02-15

    CPC classification number: G03F7/70958 G02B1/105 G02B1/14

    Abstract: The invention relates to a method for optimizing a protective layer system (59) for an EUV radiation (6) reflecting multilayer system (51) of an optical element (50), comprising the following steps: selecting a material for a topmost layer (57) of the protective layer system (59) from a group of chemical compounds comprising: oxides, carbides, nitrides, silicates and borides, wherein selecting the material for the topmost layer (57) is effected depending on an enthalpy of formation of the respective chemical compound. The invention also relates to an optical element (50), comprising: an EUV radiation (6) reflecting multilayer system (51), and a protective layer system (59) having a topmost layer (57) composed of a material selected from a group of chemical compounds comprising: oxides, carbides, nitrides, silicates and borides, wherein the protective layer system (59) either consists of the topmost layer (57) having a thickness (d) of between 5 nm and 15 nm, or the protective layer system (59) has at least one further layer (58) below the topmost layer (57), the thickness (d 2 ) of which is greater than the thickness (d 1 ) of the topmost layer (57), and wherein the topmost layer (57) has a thickness (d-i) of not more than 5 nm and a thickness (d2) of the further layer (58) or of the further layers is greater than 5 nm.

    Abstract translation: 本发明涉及一种用于优化用于反射光学元件(50)的多层系统(51)的EUV辐射(6)的保护层系统(59)的方法,包括以下步骤:选择最上层的材料(57 )从包括氧化物,碳化物,氮化物,硅酸盐和硼化物的一组化合物组成的保护层系统(59)中,其中选择最上层(57)的材料根据各化学品的形成焓 复合。 本发明还涉及一种光学元件(50),其包括:反射多层体系(50)的EUV辐射(6)和具有最上层(57)的保护层系统(59),所述最顶层(57)由选自组 包括:氧化物,碳化物,氮化物,硅酸盐和硼化物的化合物,其中所述保护层系统(59)由厚度(d)在5nm和15nm之间的最顶层(57)组成,或者保护层 系统(59)在最顶层(57)下方具有至少一个另外的层(58),其厚度(d2)大于最顶层(57)的厚度(d1),并且其中最顶层 57)具有不大于5nm的厚度(di),并且另外的层(58)或其它层的厚度(d2)大于5nm。

    EUV-LITHOGRAPHIESYSTEM UND BETRIEBSVERFAHREN DAFÜR
    6.
    发明申请
    EUV-LITHOGRAPHIESYSTEM UND BETRIEBSVERFAHREN DAFÜR 审中-公开
    EUV光刻系统和操作之方法

    公开(公告)号:WO2016055330A1

    公开(公告)日:2016-04-14

    申请号:PCT/EP2015/072600

    申请日:2015-09-30

    CPC classification number: G03F7/70883 G03F7/70033 G03F7/70341 G03F7/70925

    Abstract: Die Erfindung betrifft ein EUV-Lithographiesystem (1), umfassend: mindestens ein optisches Element (13, 14) mit einer optischen Oberfläche (13a, 14a), die in einer Vakuum-Umgebung (17) des EUV-Lithographiesystems (1) angeordnet ist, sowie eine Zuführungseinrichtung (27) zur Zuführung von Wasserstoff in die Vakuum-Umgebung (17), in der mindestens eine Silizium enthaltende Oberfläche (29a) angeordnet ist. Die Zuführungseinrichtung (27) ist zur zusätzlichen Zuführung eines Sauerstoff enthaltenden Gases in die Vakuum- Umgebung (17) ausgebildet und weist eine Dosiereinrichtung (28) zur Einstellung eines Sauerstoff-Partialdrucks (P02) an der mindestens einen Silizium enthaltenden Oberfläche (29a) und/oder an der optischen Oberfläche (13a, 14a) auf.

    Abstract translation: 本发明涉及一种EUV光刻系统(1),包括:至少一个光学在EUV光刻系统的真空环境(17)具有光学表面(13A,14A)元件(13,14)(1)被布置 和一个供应装置(27),用于供应氢气到其中至少一个含硅表面(29A)被设置在真空区域(17)。 进给装置(27),用于附加地供给含氧气体到所述真空区域内的氧(17)形成,并具有用于调节的氧分压(P02)到所述至少一个表面的含硅(29A)的计量装置(28)和/ 或在光学表面(13A,14A)上。

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