Abstract:
Methods and apparatuses are provided for photoacoustic imaging. One such apparatus may include an ultrasound-on-a-chip device attached to a housing, an optical emitter attached to the housing, and a controller enclosed at least partially in the housing. The ultrasound-on-a-chip device may include a plurality of ultrasonic transducers. The optical emitter may include an array of diodes arranged at a periphery of the plurality of ultrasonic transducers. The controller may be configured to control the optical emitter to emit pulses of light, to control the plurality of ultrasonic transducers to detect ultrasonic waves emitted from a target to be imaged in response to exposure to the pulses of light, and to convert the ultrasonic waves to digital signals. For example, the optical emitter may be controlled to emit chirped optical pulses. The digital signals may be processed by the controller to produce image-formation data.
Abstract:
Described herein are methods and apparatuses for ultrasound coupling. Certain aspects relate to coupling bodies for acoustically coupling an ultrasound device to a subject. A coupling body may include a first surface configured to couple to an ultrasound device, a second surface configured to contact the subject, a reservoir internal to the coupling body, and a plurality of openings extending between the reservoir and one or both of the first surface and the second surface. The reservoir may contain ultrasound gel. A coupling body may include an adhesive coupled to a subpart of the surface of the coupling body. A coupling body may include a first surface configured to contact the ultrasound device and a second surface including first adhesive configured to adhere to the subject. The first surface may also include second adhesive configured to adhere to an ultrasound patch device. Certain aspects also relate to packaging coupling bodies.
Abstract:
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
Abstract:
Processes for fabricating capacitive micromachined ultrasonic transducers (CMUTs) are described, as are CMUTs of various doping configurations. An insulating layer separating conductive layers of a CMUT may be formed by forming the layer on a lightly doped epitaxial semiconductor layer. Dopants may be diffused from a semiconductor substrate into the epitaxial semiconductor layer, without diffusing into the insulating layer. CMUTs with different configurations of N-type and P-type doping are also described.
Abstract:
An ultrasound device is described configurable to operate in a variety of modes. At least some of the modes are associated with different frequencies of ultrasound signals. A system is also described, comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
Abstract:
To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially- available output interfaces.
Abstract:
Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
Abstract:
Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
Abstract:
A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.