公开(公告)号：WO2004019412A1

公开(公告)日：2004-03-04

申请号：PCT/US2003/026866

申请日：2003-08-26

Applicant: CALIFORNIA MICRO DEVICES CORPORATION

Inventor： WHITWORTH, Adam, John ,  SHERRIMA, Faraj, A. ,  CHALAKA, Ashok, Kumar

IPC: H01L29/22

CPC classification number: H01L23/60 ,  H01L24/48 ,  H01L25/167 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: An apparatus consisting of a single wire bond silicon sub-mount used to make an LED device which also has built-in ESD protection in the sub-mount. The single wire bond silicon sub-mount uses a pass-through interconnection between the topside of the sub-mount and the underside so that the LED chip mounted thereon is electrically coupled through the sub-mount to the anode.

Abstract translation: 一种由单引线接合硅子座组成的装置，用于制造在子座中也具有内置ESD保护的LED器件。 单线接合硅子座安装在子座的顶侧和下侧之间使用通过互连，使得其上安装的LED芯片通过子座电连接到阳极。