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    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE
    1.
    发明申请
    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE 审中-公开
    使用多个小型MEMS器件来替代大型MEMS器件的方法

    公开(公告)号：WO2010054244A2

    公开(公告)日：2010-05-14

    申请号：PCT/US2009/063616

    申请日：2009-11-06

    Applicant: CAVENDISH KINETICS, INC. ,  SMITH, Charles Gordon ,  KNIPE, Richard L. ,  JOSHI, Vikram ,  GADDI, Roberto ,  UNAMUNO, Anartz ,  VAN KAMPEN, Robertus Petrus

    Inventor： SMITH, Charles Gordon ,  KNIPE, Richard L. ,  JOSHI, Vikram ,  GADDI, Roberto ,  UNAMUNO, Anartz ,  VAN KAMPEN, Robertus Petrus

    IPC: B81C1/00

    CPC classification number: B81B7/04 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/135 ,  H01G5/18 ,  H01G5/40

    Abstract: Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

    Abstract translation: 本文公开的实施例通常包括使用大量的小MEMS器件来代替单个更大的MEMS器件或数字可变电容器的功能。 大量较小的MEMS器件具有与较大器件相同的功能，但是由于尺寸较小，因此可以使用互补金属氧化物半导体（CMOS）兼容工艺封装在腔中。 通过大量较小器件的信号平均，允许较小器件阵列的精度等同于较大的器件。 通过考虑使用具有惯性响应的集成模数转换的基于MEMS的加速度计开关阵列来举例说明该过程。 还通过考虑使用MEMS器件结构（其中MEMS器件并行地作为数字可变电容器）来使用该过程。

    PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE
    2.
    发明申请
    PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE 审中-公开
    拉起电极和WAFFLE型微结构

    公开(公告)号：WO2012040092A1

    公开(公告)日：2012-03-29

    申请号：PCT/US2011/052118

    申请日：2011-09-19

    Applicant: CAVENDISH KINETICS, INC ,  KNIPE, Richard L. ,  VAN KAMPEN, Robertus Petrus ,  UNAMUNO, Anartz ,  GADDI, Roberto

    Inventor： KNIPE, Richard L. ,  VAN KAMPEN, Robertus Petrus ,  UNAMUNO, Anartz ,  GADDI, Roberto

    IPC: H01H1/00 ,  H01H59/00

    CPC classification number: H01H1/0036 ,  H01H59/0009 ,  H01H2001/0084

    Abstract: The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.

    Abstract translation: 本发明一般涉及MEMS器件及其制造方法。 MEMS器件的悬臂可以具有华夫饼型微结构。 华夫饼形微结构利用支撑梁来赋予微结构刚度，同时允许支撑梁弯曲。 华夫饼型微结构允许将刚性结构与柔性支撑结合在一起。 此外，可以使用复合弹簧来产生非常硬的弹簧以改善MEMS装置的热开关性能。 为了允许MEMS器件利用更高的RF电压，可以将上拉电极定位在悬臂上方以帮助将悬臂从接触电极拉出。

    MEMS DEVICE ANCHORING
    5.
    发明申请
    MEMS DEVICE ANCHORING 审中-公开
    MEMS器件锚定

    公开(公告)号：WO2013033526A2

    公开(公告)日：2013-03-07

    申请号：PCT/US2012/053327

    申请日：2012-08-31

    Applicant: CAVENDISH KINETICS, INC ,  RENAULT, Mickael ,  JOSHI, Vikram ,  KNIPE, Richard, L. ,  UNAMUNO, Anartz

    Inventor： RENAULT, Mickael ,  JOSHI, Vikram ,  KNIPE, Richard, L. ,  UNAMUNO, Anartz

    IPC: B81C1/00

    CPC classification number: B81B7/00 ,  B81B2201/016 ,  B81B2203/0307 ,  B81C1/00039 ,  B81C2203/0136 ,  H01G5/16 ,  H01H59/0009 ,  Y10T29/49105

    Abstract: Embodiments of the present invention generally relate to a MEMS device that is anchored using the layer that is deposited to form the cavity sealing layer and/or with the layer that is deposited to form the pull-off electrode. The switching element of the MEMS device will have a flexible or movable portion and will also have a fixed or anchor portion that is electrically coupled to ground. The layer that is used to seal the cavity in which the switching element is disposed can also be coupled to the fixed or anchor portion of the switching element to anchor the fixed or anchor portion within the cavity. Additionally, the layer that is used to form one of the electrodes may be used to provide additional leverage for anchoring the fixed or anchor portion within the cavity. In either situation, the movement of the flexible or movable portion is not hindered.

    Abstract translation: 本发明的实施例总体上涉及一种MEMS器件，其使用被沉积以形成空腔密封层的层和/或被沉积以形成拉脱电极的层来锚定 。 MEMS器件的开关元件将具有柔性或可移动部分，并且还将具有电耦合到地的固定或锚定部分。 用于密封设置开关元件的空腔的层也可以耦合到开关元件的固定部分或锚定部分，以将固定部分或锚定部分锚定在空腔内。 另外，用于形成电极中的一个的层可以用于提供用于将固定或锚定部分锚定在空腔内的附加杠杆作用。 在任何一种情况下，柔性或活动部分的移动都不会受到阻碍。

    ROUTING OF MEMS VARIABLE CAPACITORS FOR RF APPLICATIONS
    6.
    发明申请
    ROUTING OF MEMS VARIABLE CAPACITORS FOR RF APPLICATIONS 审中-公开
    用于射频应用的MEMS可变电容器的布线

    公开(公告)号：WO2013028546A1

    公开(公告)日：2013-02-28

    申请号：PCT/US2012/051427

    申请日：2012-08-17

    Applicant: CAVENDISH KINETICS, INC ,  GADDI, Roberto ,  VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L. ,  UNAMUNO, Anartz

    Inventor： GADDI, Roberto ,  VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L. ,  UNAMUNO, Anartz

    IPC: H01G5/16 ,  H01G5/38 ,  H01H59/00 ,  B81B3/00

    CPC classification number: H01G5/16 ,  H01G5/38 ,  H01G7/00 ,  H01H59/0009 ,  Y10T29/43

    Abstract: The present invention generally relates to a variable capacitor for RF and microwave applications. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.

    Abstract translation: 本发明一般涉及用于RF和微波应用的可变电容器。 可变电容器包括具有与其电耦合的多个单元的接合焊盘。 多个单元中的每一个在其中具有多个MEMS器件。 MEMS器件共享公共RF电极，一个或多个接地电极和一个或多个控制电极。 RF电极，接地电极和控制电极都在电池内彼此平行布置。 RF电极使用不同级别的电路由金属电连接到一个或多个接合焊盘。

    ELECTROSTATIC DAMPING OF MEMS DEVICES
    7.
    发明申请
    ELECTROSTATIC DAMPING OF MEMS DEVICES 审中-公开
    MEMS器件的静电阻尼

    公开(公告)号：WO2014189917A1

    公开(公告)日：2014-11-27

    申请号：PCT/US2014/038771

    申请日：2014-05-20

    Applicant: CAVENDISH KINETICS, INC

    Inventor： VAN KAMPEN, Robertus Petrus ,  UNAMUNO, Anartz

    IPC: H01G5/18

    CPC classification number: H01G5/18 ,  B81B7/008 ,  B81B2201/0221 ,  H01H59/0009

    Abstract: The present invention generally relates to a method and apparatus for damping a plate electrode or switching element in a MEMS DVC device. A resistor disposed between a waveform controller and the electrodes of the MEMS DVC causes the voltage to increase while capacitance decreases during the time that the plate electrode is moving. Due to the increase in voltage and decrease in capacitance, the electrostatic force that resists the plate electrode movement away from an electrode increases, which in turn dampens the movement of the plate electrode.

    Abstract translation: 本发明一般涉及一种用于阻尼MEMS DVC装置中的平板电极或开关元件的方法和装置。 布置在波形控制器和MEMS DVC的电极之间的电阻器在平板电极移动期间电容降低，导致电压增加。 由于电压的增加和电容的减小，抵抗板电极远离电极的静电力增加，这又抑制板电极的运动。

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