Abstract:
The present disclosure describes carriers for carrying products, connected with reusable stickiness (adhesive) to grab and release different surfaces (products). The present invention also includes different gecko carriers such as a gecko conveyor, gecko cylinder, mechanical gecko arm, etc. While the gecko's "glue" holds the product on the carrier strongly in one direction, one can easily pull the product out to the other direction. Due to the gecko carrier no extra motor or vacuum is needed, hence saving on costs and on extra parts that can be damaged, as well the shape of the product can be changed and not necessarily symmetric. The gecko carrier can come as a complete new product or the gecko adhesive can be as an add-on a belt of an existing carrier. The present invention also include a carrier that has reusable adhesive made out of carbon nanotubes mimicking a gecko foot.
Abstract:
The present invention generally relates to nanowire arrays and methods of fabricating such arrays. In certain embodiments, the fabrication methods can consistently form NW arrays with reproducible configurations at nanoscale sites and produce NWs of specified heights, diameters, and densities. In some cases, the methods also allow formation of NW arrays containing barriers between regions, which would be prohibitively expensive if prepared by other methods.
Abstract:
An integrated module including an array of electrostatically actuated mirrors usable as an optical switch. An array of tiltable mirrors (70, 72) is formed as a micro electromechanical system (MEMS) in one substrate carrier (60). A ceramic multi-chip module (MCM) (62) is formed having multiple layers (80) of wiring and electrodes (94) at one surface forming one side part of the electrostatic capacitive actuators. The MEMS substrate is bonded to the carrier (62) with the carrier electrodes (94) in opposition to the mirrors (70, 72), which form counter electrodes. Advantageously, a handle layer of the MEMS substrate is not removed and the mirrors released until after the bonding with the MCM. Separate high-voltage integrated circuits (ICs) (66) driving the actuators and low-voltage ICs controlling the high-voltage ICs (66) are bonded on the side of the MCM (62) opposite the MEMS (60) with the MCM providing electrical interconnections (68).
Abstract:
An integrated circuit and mirror device including a first substrate (401) comprising a plurality of electrode groups (406), wherein each of the groups comprises a plurality of electrodes. A mirror array (402) formed on a second substrate, each mirror has a mirror surface able to pivot about a fixed point in space. Each of the mirrors has a backside surface operably coupled to one of the electrode groups. A bonding layer (404) mechanically couples the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups. The device has a drive circuitry (400) coupled to each electrode group and configured to apply a voltage to any one of the electrodes in each of the groups. The drive circuitry is disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space.
Abstract:
The disclosed embodiments provide sensitive pixel arrays formed using solvent-assisted or unassisted release processes. Exemplary devices include detectors arrays, tunable optical instruments, deflectable mirrors, digital micro-mirrors, digital light processing chips, tunable optical micro-cavity resonators, acoustic sensors, acoustic actuators, acoustic transducer devices and capacitive zipper actuators to name a few.
Abstract:
This document discusses, among other things, an inertial measurement system including a device layer including a single proof-mass 3 -axis accelerometer, a cap wafer bonded to a first surface of the device layer, and a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3 -axis accelerometer. The single proof-mass 3 -axis accelerometer can be suspended about a single, central anchor, and can include separate x, y, and z-axis flexure bearings, wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor and the z-axis flexure is not symmetrical about the single, central anchor.
Abstract:
Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.
Abstract:
Изобретение относится к микро- и наноэлектромеханическим устройствам и к способу их изготовления. В одном из вариантов реализации изобретения в основе получения наноэлектромеханической структуры лежат механизмы самоорганизации и самосовмещения, в результате чего ее существенные геометрические параметры не испытывают ограничения со стороны возможностей традиционной фотолитографии. Данное обстоятельство обеспечивает достижение степени интеграции до 10 16 м -2 и выше. Кроме того, в одном из аспектов изобретения в качестве независимой координаты адресации элементов используется их резонансная частота, что позволяет уменьшить плотность необходимых межсоединений. В другом аспекте изобретения обеспечивается датчик газов, обладающий высокой чувствительностью измерения концентрации определенных газов или частиц в атмосфере, универсальными и гибкими механизмами селективности, контролируемым процессом регенерации сенсорной способности. Предложенная структура обеспечивает простой способ измерения резонансной частоты осциллирующего элемента, не предполагающий анализ высокочастотного сигнала.