PRESSURE SENSOR DEVICE WITH A MEMS PIEZORESISTIVE ELEMENT ATTACHED TO AN IN-CIRCUIT CERAMIC BOARD
    1.
    发明申请
    PRESSURE SENSOR DEVICE WITH A MEMS PIEZORESISTIVE ELEMENT ATTACHED TO AN IN-CIRCUIT CERAMIC BOARD 审中-公开
    具有连接到电路板陶瓷板的MEMS PIEZORESISTIVE元件的压力传感器装置

    公开(公告)号:WO2017003692A1

    公开(公告)日:2017-01-05

    申请号:PCT/US2016/037656

    申请日:2016-06-15

    Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

    Abstract translation: 具有附接到在线陶瓷板的MEMS压阻式压力感测元件的压力传感器装置包括通过将多层陶瓷烧结在一起形成的单片陶瓷电路板。 电路板的底部具有空腔,其形成有从陶瓷电路板形成的材料层。 作为层之一的陶瓷膜片具有周边边缘。 隔膜的厚度使得由边缘限定的隔膜响应于施加的压力而偏转。 附着在陶瓷电路板的顶侧的MEMS压阻式压力感测元件产生响应于陶瓷膜片偏转的输出信号。 携带加压流体的导管可以使用陶瓷电路板的底部上的密封件直接附接到陶瓷电路板,陶瓷电路板通过底部包围空腔的开口。

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