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1.发明申请
公开(公告)号：WO2019079417A3
公开(公告)日：2019-04-25
申请号：PCT/US2018/056240
申请日：2018-10-17
申请人： CORNING INCORPORATED
发明人： BURKET, Robert Carl , LEVESQUE, Daniel Wayne, Jr. , MARJANOVIC, Sasha , PIECH, Garrett Andrew , VANSELOUS, Heather Nicole , WIELAND, Kristopher Allen
摘要： A method includes forming a closed contour line having a plurality of defects in a transparent workpiece such that the closed contour line defines a closed contour. A pulsed laser beam is directed through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.5 µm/min or less to separate a portion of the transparent workpiece along the closed contour line, thereby forming an aperture extending through the transparent workpiece, the aperture comprising an aperture perimeter extending along the closed contour.
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2.发明申请
公开(公告)号：WO2018005401A1
公开(公告)日：2018-01-04
申请号：PCT/US2017/039357
申请日：2017-06-27
申请人： CORNING INCORPORATED
IPC分类号： H01L21/311 , H01L21/48 , H01L23/15 , H01L23/498
摘要： A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.
摘要翻译： 一种工艺包括将半导体晶片结合到无机晶片。 半导体晶片对于无机晶片透明的光的波长是不透明的。 在键合之后，使用发射光波长的激光器在无机晶片中形成损伤轨迹。 无机晶圆中的损伤轨迹被扩大以通过蚀刻形成穿过无机晶圆的孔。 该孔终止于半导体晶片和无机晶片之间的界面。 还提供了一种物品，其包括结合到无机晶圆的半导体晶圆。 半导体晶片对于无机晶片透明的光的波长是不透明的。 无机晶片具有穿过无机晶片形成的孔。 该孔终止于半导体晶片和无机晶片之间的界面。
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公开(公告)号：WO2018075466A1
公开(公告)日：2018-04-26
申请号：PCT/US2017/056903
申请日：2017-10-17
申请人： CORNING INCORPORATED
CPC分类号： C03C15/00 , B01L3/5027 , B01L2300/0887 , B01L2300/0896 , B23K26/0006 , B23K26/36 , B82Y20/00 , C03B33/0222 , G01R1/06711 , G01R1/06727 , G02B6/107
摘要： A device includes a sheet of high purity fused silica that has a thickness of less than 500 µm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 µm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 µm, and wherein the silica is free of indicia of grinding and polishing.
摘要翻译： 装置包括厚度小于500μm的高纯度熔凝硅石片材，其中片材包括片材中的特征，其中特征具有小于500μm的横截面尺寸 大于50微米且深度至少为100纳米，其中特征彼此间隔小于50微米的距离，并且其中二氧化硅不含研磨和抛光标记。
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4.发明申请
公开(公告)号：WO2022103749A1
公开(公告)日：2022-05-19
申请号：PCT/US2021/058613
申请日：2021-11-09
申请人： CORNING INCORPORATED
IPC分类号： H01L23/498 , H01L23/538 , H01L21/48 , H01L23/15
摘要： In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.
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5.发明申请MICRO-PERFORATED PANEL SYSTEMS, APPLICATIONS, AND METHODS OF MAKING MICRO-PERFORATED PANEL SYSTEMS 审中-公开微穿孔板系统，应用和制造微穿孔板系统的方法
公开(公告)号：WO2018085249A1
公开(公告)日：2018-05-11
申请号：PCT/US2017/059240
申请日：2017-10-31
申请人： CORNING INCORPORATED
发明人： COVARRUBIAS JARAMILLO, Andres , LEVESQUE, Daniel Wayne, Jr. , MOLL, Johannes , PAMBIANCHI, Michael S. , VANNIAMPARAMBIL, Prashanth Abraham
CPC分类号： C03C15/00 , C03C23/0025 , G10K11/162
摘要： The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.
摘要翻译： 所描述的实施例总体上涉及用于消除噪声的微穿孔面板系统和方法以及制造微穿孔面板系统的方法。 特别地，实施例涉及玻璃微孔板系统及其构造方法。
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公开(公告)号：WO2018075466A8
公开(公告)日：2018-04-26
申请号：PCT/US2017/056903
申请日：2017-10-17
申请人： CORNING INCORPORATED
摘要： A device includes a sheet of high purity fused silica that has a thickness of less than 500 µm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 µm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 µm, and wherein the silica is free of indicia of grinding and polishing.
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公开(公告)号：WO2016201027A2
公开(公告)日：2016-12-15
申请号：PCT/US2016/036566
申请日：2016-06-09
申请人： CORNING INCORPORATED
发明人： CASTLE, Thomas Michael , HUANG, Tian , JIN, Yuhui , LEVESQUE, Daniel Wayne, Jr. , PETRIWSKY, Tammy Lynn
IPC分类号： C03C15/00
CPC分类号： C03C15/00 , B23K26/382 , B23K2201/40 , B23K2203/54 , C03C4/0071 , C03C23/0025 , H01L21/4807 , H01L23/15 , Y10T428/24182 , Y10T428/24273 , Y10T428/24479 , Y10T428/24777
摘要： A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 µm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 µm.
摘要翻译： 形成玻璃基板的方法包括提供具有氧化铝的玻璃基板，将脉冲激光束平移在玻璃基板上以形成一个或多个引导孔，使玻璃基板与蚀刻溶液接触并提供搅拌。 蚀刻溶液具有约0至约2.0的pH，蚀刻速率小于约3μm/ min。 公开了一种玻璃基板，其具有在厚度方向上与第一表面相对的第一表面和第二表面，以及穿过第一表面的至少一个孔，其中至少一个孔已经被蚀刻溶液蚀刻。 （1）在不具有至少一个孔的区域中接触第一表面的第一平面或围绕至少一个孔的基底的厚度偏差之间的最大距离d1，以及（2） 从第一平面凹陷的偏差小于或等于约0.2μm。
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