Abstract:
A device includes a glass substrate, a plurality of electronic components, a metallization layer, and a plurality of vias. The plurality of electronic components are on a first surface of the glass substrate. The metallization layer is on a second surface of the glass substrate opposite to the first surface. The plurality of vias extend through the glass substrate. At least one via is in electrical communication with an electronic component and the metallization layer.
Abstract:
A device includes a sheet of high purity fused silica that has a thickness of less than 500 µm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 µm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 µm, and wherein the silica is free of indicia of grinding and polishing.
Abstract:
A method of manufacturing a honeycomb body, comprising extruding honeycomb extrudate (200) in an axial direction (A), the honeycomb extrudate (200) having an outer periphery (206); and laser machining in situ the honeycomb extrudate (200) to form a laser cut in the honeycomb extrudate. A system for in situ cutting a wet green ceramic extrudate, comprising a laser (500, 732, 826) configured to irradiate laser energy to an outer periphery of a wet green ceramic article, the laser energy adapted to cut through at least a portion of the outer periphery (206).
Abstract:
Described herein are methods and apparatus that can be used to selectively alter the fictive temperature of glass-based substrates. The apparatus includes a laser apparatus having a power and a wavelength, the laser apparatus and the glass-based substrate positioned with respect to each other so that a laser beam from the laser apparatus can heat the glass-based substrate at a controlled heating rate so that the glass-based substrate is heated from a first temperature to a target peak temperature and can cool the glass-based substrate at a controlled cooling rate from the target peak temperature to a second temperature such that a target fictive temperature is obtained in a region of the glass-based substrate. The laser apparatus can be in-line with a glass forming apparatus that forms glass-based substrates.
Abstract:
A device includes a sheet of high purity fused silica that has a thickness of less than 500 µm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 µm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 µm, and wherein the silica is free of indicia of grinding and polishing.
Abstract translation:装置包括厚度小于500μm的高纯度熔凝硅石片材,其中片材包括片材中的特征,其中特征具有小于500μm的横截面尺寸 大于50微米且深度至少为100纳米,其中特征彼此间隔小于50微米的距离,并且其中二氧化硅不含研磨和抛光标记。 p >
Abstract:
Methods for making and treating glass articles include directing a beam of at least one laser source onto at least a major surface of a glass article such that the beam imparts a plurality of texturing features on the major surface, the plurality of texturing features having a peak-to-valley height H ranging from about 5 nanometers to about 40 nanometers.
Abstract:
A method and corresponding apparatus for processing optical fiber include directing light from a directed light source toward an optical fiber on a fiber draw. A fiber core of the optical fiber is heated, using at least the light from the directed light source, to a fiber core temperature within a glass transformation temperature range of the fiber core. The method can be used to reduce fictive temperature of the fiber core, with Rayleigh scattering being reduced, leading to lower attenuation losses in the fiber core.