Abstract:
Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.
Abstract:
Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.
Abstract:
The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
Abstract:
A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w 0 , and a Rayleigh range Z R that is greater than F D (formulae (I)— where F D is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.
Abstract:
Disclosed herein are glass articles coated on at least one surface with an electrochromic layer and comprising minimal regions of laser damage, and methods for laser processing such glass articles. Insulated glass units comprising such coated glass articles are also disclosed herein.
Abstract:
Disclosed herein are glass article, such as light guide plates, comprising a first surface, an opposing second surface, and a thickness extending therebetween; and at least one side edge comprising a laser ablated region having a thickness of less than or equal to about 35% of the thickness of the glass article, or a chamfer having a height of less than or equal to about 15% of the thickness of the glass article. Display devices comprising such glass articles are also disclosed herein as well as methods for producing such glass articles.
Abstract:
Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
Abstract:
This laser cutting process makes use of a short pulse laser in combination with optics that generate a focal line to fully perforate the body of a range of ion-exchangeable glass compositions. The glass is moved relative to the laser beam to create perforated lines that trace out the shape of any desired parts. The glass may be cut pre-ion exchange, or may be cut post-ion exchange. The laser creates hole-like defect zones that penetrate the full depth the glass, of approximately 1 micron in diameter. These perforations or defect regions are generally spaced from 1 to 15 microns apart.
Abstract:
Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO 2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO 2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
Abstract:
Display devices and antiglare layers that minimize glare and the appearance of sparkle are described. One type of display device includes a pixel substrate, having a pixel array, and an antiglare layer. The antiglare layer has a surface roughness with a spatial frequency such that a typical focal length of the antiglare layer is either at least four times larger than an optical distance between a surface of the array of pixels and the antiglare layer, or at least three times smaller than the optical distance between the surface of the array of pixels and the antiglare layer. In some embodiments, a pixel pitch of the array of pixels is less than 120 µm. In some embodiments, the antiglare layer may have a power spectral density that is elliptical, with a minor axis of the power spectral density aligned with a color direction of the array of pixels.