公开(公告)号：WO2016071233A3

公开(公告)日：2016-06-30

申请号：PCT/EP2015075283

申请日：2015-10-30

Applicant: DANFOSS SILICON POWER GMBH

Inventor： BECKER MARTIN ,  EISELE RONALD ,  RUDZKI JACEK ,  OSTERWALD FRANK

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/27848 ,  H01L2224/29012 ,  H01L2224/29017 ,  H01L2224/29019 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/3201 ,  H01L2224/32245 ,  H01L2224/8384 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A description is given of an electronic sandwich structure which has at least a first (1) and a second part (2) to be joined, which are sintered together by means of a sintering layer (3). The sintering layer (3) is formed as a substantially uninterrupted connecting layer, the density of which varies in such a way that at least one region of higher density (4a) and at least one region of lower density (4b) alternate with one another. A description is also given of a method for forming a sintering layer (3) of an electronic sandwich structure, in which firstly a sintering material layer (3) is applied substantially continuously to a second part (2) to be joined as a connecting layer (3), this sintering material layer (3) is subsequently dried and, finally, alternating regions of higher density (4a) and of lower density (4b) of the connecting layer (3) are produced by sintering the second part to be joined (2) with the sintering layer (3) on a first part to be joined (1). The sintering material may be applied in points or stripes. The to-be-joined surfaces of the first part to be joined (1) and the second part to be joined (2) may be arranged plane-parallel, in which case the sintering layer (3) is formed with its surface regularly uneven, i.e. it has in particular regions of greater thickness (3a) and regions of smaller thickness (3b) in defined patterns, which has the effect that, after the sintering process, there are regions of higher density (4a) in the regions (3a) of thicker sintering paste application and regions of lower density (4b) in the regions (3b) of thinner sintering paste application. Alternatively, the to-be-joined surfaces of the first part to be joined (1) and the second part to be joined (2) may at least in certain regions be not arranged plane-parallel, wherein, with an initially completely uniform sintering paste application, a thinner sintering layer is obtained in the regions (4a) where the parts to be joined (1, 2) are at a smaller distance after the sintering, whereas a thicker sintering layer is formed in the regions (4b) where the distance is greater, which finally has the effect that a higher density forms in the regions (4a) where the two parts to be joined (1, 2) are at a smaller distance from one another, than in the regions (4b) where the distance between the parts to be joined (1, 2) is greater. A high lifetime of the electronic sandwich structure connected by sintering is achieved even for parts to be joined (1, 2) that have different coefficients of thermal expansion, in particular in components for power electronics.

Abstract translation: 给出了具有至少第一（1）和第二部分（2）待连接的电子夹层结构的描述，其通过烧结层（3）烧结在一起。 烧结层（3）形成为基本上不间断的连接层，其密度以至少一个较高密度区域（4a）和至少一个较低密度区域（4b）的区域彼此交替的方式变化 。 还描述了一种用于形成电子夹层结构的烧结层（3）的方法，其中首先将烧结材料层（3）基本连续地施加到待接合的第二部分（2）作为连接层 （3）中，随后干燥该烧结材料层（3），最后通过烧结第二待连接部分来制造连接层（3）的较高密度（4a）和较低密度（4b）的交替区域 （2）与烧结层（3）在待接合的第一部分（1）上。 烧结材料可以以点或条纹施加。 待接合的第一部分（1）和待连接的第二部分（2）的待接合表面可以平行平行地布置，在这种情况下，烧结层（3）形成为其表面规则不均匀 ，即具有特定区域（3a）和较薄厚度（3b）的区域，其特征在于，在烧结过程之后，区域（3a）中存在较高密度（4a）的区域 ）较厚的烧结膏应用和较低密度的区域（4b）在较薄烧结膏应用的区域（3b）中。 或者，待接合的第一部分（1）和待连接的第二部分（2）的待接合表面可以至少在某些区域中不平行排列，其中，在初始完全均匀的烧结 在烧结后的距离较小的区域（4a）中得到较薄的烧结层，在区域（4b）中形成较厚的烧结层， 距离较大，这最终具有在要连接的两个部分（1,2）彼此相距较小的区域（4a）中形成较高密度的效果，其中区域（4b）中的 要连接的部件（1,2）之间的距离较大。 即使对于具有不同热膨胀系数的部件（1,2），特别是用于电力电子部件的部件，也可实现通过烧结连接的电子夹层结构的高寿命。