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    ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEANS OF A SINTERING LAYER WITH ALTERNATING REGIONS OF HIGHER AND LOWER DENSITY AND CORRESPONDING MANUFACTURING METHOD
    4.
    发明申请
    ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEANS OF A SINTERING LAYER WITH ALTERNATING REGIONS OF HIGHER AND LOWER DENSITY AND CORRESPONDING MANUFACTURING METHOD 审中-公开
    具有两个部件的电子三角结构通过具有更高和更低密度的相邻区域的烧结层和相应的制造方法

    公开(公告)号：WO2016071233A3

    公开(公告)日：2016-06-30

    申请号：PCT/EP2015075283

    申请日：2015-10-30

    Applicant: DANFOSS SILICON POWER GMBH

    Inventor： BECKER MARTIN ,  EISELE RONALD ,  RUDZKI JACEK ,  OSTERWALD FRANK

    IPC: H01L23/488 ,  H01L21/60

    CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/27848 ,  H01L2224/29012 ,  H01L2224/29017 ,  H01L2224/29019 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/3201 ,  H01L2224/32245 ,  H01L2224/8384 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A description is given of an electronic sandwich structure which has at least a first (1) and a second part (2) to be joined, which are sintered together by means of a sintering layer (3). The sintering layer (3) is formed as a substantially uninterrupted connecting layer, the density of which varies in such a way that at least one region of higher density (4a) and at least one region of lower density (4b) alternate with one another. A description is also given of a method for forming a sintering layer (3) of an electronic sandwich structure, in which firstly a sintering material layer (3) is applied substantially continuously to a second part (2) to be joined as a connecting layer (3), this sintering material layer (3) is subsequently dried and, finally, alternating regions of higher density (4a) and of lower density (4b) of the connecting layer (3) are produced by sintering the second part to be joined (2) with the sintering layer (3) on a first part to be joined (1). The sintering material may be applied in points or stripes. The to-be-joined surfaces of the first part to be joined (1) and the second part to be joined (2) may be arranged plane-parallel, in which case the sintering layer (3) is formed with its surface regularly uneven, i.e. it has in particular regions of greater thickness (3a) and regions of smaller thickness (3b) in defined patterns, which has the effect that, after the sintering process, there are regions of higher density (4a) in the regions (3a) of thicker sintering paste application and regions of lower density (4b) in the regions (3b) of thinner sintering paste application. Alternatively, the to-be-joined surfaces of the first part to be joined (1) and the second part to be joined (2) may at least in certain regions be not arranged plane-parallel, wherein, with an initially completely uniform sintering paste application, a thinner sintering layer is obtained in the regions (4a) where the parts to be joined (1, 2) are at a smaller distance after the sintering, whereas a thicker sintering layer is formed in the regions (4b) where the distance is greater, which finally has the effect that a higher density forms in the regions (4a) where the two parts to be joined (1, 2) are at a smaller distance from one another, than in the regions (4b) where the distance between the parts to be joined (1, 2) is greater. A high lifetime of the electronic sandwich structure connected by sintering is achieved even for parts to be joined (1, 2) that have different coefficients of thermal expansion, in particular in components for power electronics.

    Abstract translation: 给出了具有至少第一（1）和第二部分（2）待连接的电子夹层结构的描述，其通过烧结层（3）烧结在一起。 烧结层（3）形成为基本上不间断的连接层，其密度以至少一个较高密度区域（4a）和至少一个较低密度区域（4b）的区域彼此交替的方式变化 。 还描述了一种用于形成电子夹层结构的烧结层（3）的方法，其中首先将烧结材料层（3）基本连续地施加到待接合的第二部分（2）作为连接层 （3）中，随后干燥该烧结材料层（3），最后通过烧结第二待连接部分来制造连接层（3）的较高密度（4a）和较低密度（4b）的交替区域 （2）与烧结层（3）在待接合的第一部分（1）上。 烧结材料可以以点或条纹施加。 待接合的第一部分（1）和待连接的第二部分（2）的待接合表面可以平行平行地布置，在这种情况下，烧结层（3）形成为其表面规则不均匀 ，即具有特定区域（3a）和较薄厚度（3b）的区域，其特征在于，在烧结过程之后，区域（3a）中存在较高密度（4a）的区域 ）较厚的烧结膏应用和较低密度的区域（4b）在较薄烧结膏应用的区域（3b）中。 或者，待接合的第一部分（1）和待连接的第二部分（2）的待接合表面可以至少在某些区域中不平行排列，其中，在初始完全均匀的烧结 在烧结后的距离较小的区域（4a）中得到较薄的烧结层，在区域（4b）中形成较厚的烧结层， 距离较大，这最终具有在要连接的两个部分（1,2）彼此相距较小的区域（4a）中形成较高密度的效果，其中区域（4b）中的 要连接的部件（1,2）之间的距离较大。 即使对于具有不同热膨胀系数的部件（1,2），特别是用于电力电子部件的部件，也可实现通过烧结连接的电子夹层结构的高寿命。

    POWER SEMICONDUCTOR MODULE AND METHOD FOR COOLING A POWER SEMICONDUCTOR MODULE
    6.
    发明申请
    POWER SEMICONDUCTOR MODULE AND METHOD FOR COOLING A POWER SEMICONDUCTOR MODULE 审中-公开
    功率半导体模块和方法冷却半导体功率模块

    公开(公告)号：WO2005117107A3

    公开(公告)日：2006-03-09

    申请号：PCT/DK2005000341

    申请日：2005-05-24

    Applicant: DANFOSS SILICON POWER GMBH ,  OLESEN KLAUS KRISTEN ,  EISELE RONALD

    Inventor： OLESEN KLAUS KRISTEN ,  EISELE RONALD

    IPC: H01L23/473 ,  H01L25/07

    CPC classification number: H01L23/473 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.

    Abstract translation: 它与多个功率半导体，其被安装在印刷电路板（26），功率半导体模块的第一侧，并且其作用在PCB（26）与第一侧相对的第二侧与冷却剂的冷却装置指定 其中，所述冷却装置包括多个通过其冷却剂被引导的细胞。 要最大限度地减少这样的功率半导体模块的风险。 为了这个目的，它提供了一个未冷却的部分（D，E，F）被布置在至少两个小区之间。

    APPARATUS FOR ETCHING LARGE-AREA SEMICONDUCTOR DISKS
    9.
    发明申请
    APPARATUS FOR ETCHING LARGE-AREA SEMICONDUCTOR DISKS 审中-公开
    DEVICE蚀刻大面积的半导体DISCS

    公开(公告)号：WO2008131713A2

    公开(公告)日：2008-11-06

    申请号：PCT/DE2008000566

    申请日：2008-04-02

    Applicant: DANFOSS SILICON POWER GMBH ,  ULRICH HOLGER ,  SENYILIZ TEOMAN ,  EISELE RONALD

    Inventor： ULRICH HOLGER ,  SENYILIZ TEOMAN ,  EISELE RONALD

    IPC: H01L23/495 ,  H01L21/56 ,  H01L25/07

    CPC classification number: H01L21/565 ,  H01L23/4006 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: Disclosed is a method for producing a rigid power module, comprising the following steps: a monolithic lead frame is produced; said lead frame is equipped with semiconductor components and optional passive components, and corresponding connections are bonded; the equipped lead frame is introduced into a pressing tool such that the uncovered lead frame is accessible; the lead frame is fastened within the tool by means of a mounting die; and a duroplastic compression molding material is pressed into the tool so as to envelop the equipped lead frame. Said method is characterized in that cavities are left in predetermined positions in the envelope of the power module during the enveloping process. Furthermore, webs of the monolithic lead frame are cut out by means of punches that are introduced into the cavities such that electrically insulated islands of materials of the previously monolithic lead frame are created.

    Abstract translation: 一种生产固体功率模块，其包括如下步骤：产生一个片冲压格栅; 加载与半导体器件，任何无源部件和对应的化合物的键合的引线框架; 在模具中引入这样组装引线框架，从而使所述无包膜冲压格栅的访问保证; 固定在模具中通过固定印模引线框架; 注入热固性成型材料注射到所述压制工具的安装包裹下引线框架; 其特征在于，在功率模块中的壳体的规定位置保持与包围的凹部，并完成随后的切割出由被导入凹部一体冲压格栅的网状物的冲头，以产生先前片冲压格栅的引线框架材料的电绝缘区。

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