公开(公告)号：WO2015195295A1

公开(公告)日：2015-12-23

申请号：PCT/US2015/033163

申请日：2015-05-29

Applicant: DOW CORNING CORPORATION

Inventor： JOHN, Ranjith, Samuel ,  MEYNEN, Herman ,  YEAKLE, Craig

IPC: H01L23/34 ,  H01L23/12

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C09D183/04 ,  C09K5/14 ,  G03F7/038 ,  G03F7/0755 ,  G03F7/0757 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/32 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40 ,  H01L21/4882 ,  H01L21/78 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00 ,  C08L83/00 ,  C08K5/56

Abstract: Methods for fabrication of thermal interposers, using a low stress photopatternable silicone are provided, for use in production of electronic products that feed into packaging of LEDs, logic and memory devices and other such semiconductor products where thermal management is desired. A photopatternable silicone composition, thermally conductive material and a low melting point compliant solder form a complete semiconductor package module. The photopatternable silicone is applied on a surface of a wafer and selectively radiated to form openings which provided user defined bondline thickness control. The openings are then filled with high conductivity pastes to form high conductivity thermal links. A low melting point curable solder is then applied where the solder wets the silicone as well as the thermally conductive path that leads to low thermal contact resistance between the structured z-axis thermal interposer and the heat sink and/or substrate which can be a wafer or PCB.

Abstract translation: 提供了使用低应力光图案化硅树脂制造热插入件的方法，用于生产供应LED封装，逻辑和存储器件以及其它需要热管理的其它半导体产品的电子产品。 可光致图案的硅氧烷组合物，导热材料和低熔点柔性焊料形成完整的半导体封装模块。 将可光致编码的硅胶施加在晶片的表面上并选择性地辐射以形成提供用户限定的粘结层厚度控制的开口。 然后用高电导率浆料填充开口以形成高导电性热连接。 然后施加低熔点可固化焊料，其中焊料润湿硅树脂以及导致结构化的z轴热插入件与可以是晶片的散热器和/或衬底之间的低热接触电阻的导热路径 或PCB。

公开(公告)号：WO2016126438A1

公开(公告)日：2016-08-11

申请号：PCT/US2016/014417

申请日：2016-01-22

Applicant: DOW CORNING CORPORATION

Inventor： JOHN, Ranjith, Samuel ,  MEYNEN, Herman ,  SELDRUM, Thomas ,  YEAKLE, Craig, R.

IPC: C09D183/04 ,  C08L83/04

CPC classification number: C09D183/06 ,  B81B3/0078 ,  B81B2203/0127 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  C09D183/04 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/296 ,  H01L24/29 ,  H01L2221/68381 ,  H01L2224/29191 ,  C08L83/00 ,  C08K5/56 ,  C08K5/101

Abstract: The invention comprises a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate. The invention also comprises related silicone formulations made by removing a portion, or all, of (D) butyl acetate therefrom, and related cured products, methods, articles and devices.

Abstract translation: 本发明包括乙酸丁酯 - 硅氧烷配方，其包含（A）每分子平均具有至少两个硅键合的烯基的有机聚硅氧烷，（B）每分子平均含有至少两个与硅键合的氢原子的有机硅化合物 ; （C）氢化硅烷化催化剂; 和涂布有效量的（D）乙酸丁酯。 本发明还包括通过从其中除去（D）乙酸丁酯的一部分或全部，以及相关的固化产物，方法，制品和装置制备的相关硅氧烷配方。

公开(公告)号：WO2016003636A1

公开(公告)日：2016-01-07

申请号：PCT/US2015/035924

申请日：2015-06-16

Applicant: DOW CORNING CORPORATION

Inventor： AMB, Chad, Martin ,  JOHN, Ranjith, Samuel ,  WEIDNER, William, Kenneth

IPC: C08J3/24 ,  C08J7/18 ,  G03F7/00

CPC classification number: C08G77/80 ,  C08J3/24 ,  C08J7/18 ,  G02B6/122 ,  G02B6/132 ,  G02B6/30 ,  G03F7/0757 ,  G03F7/162 ,  G03F7/2002 ,  G03F7/26 ,  G03F7/38

Abstract: A method for preparing an article includes applying a first composition on a substrate to form a first layer, and applying a curing condition to a target portion without applying the curing condition to a non-target portion of the first layer to form a first contrast layer. A second composition is then applied on the first contrast layer to form a second layer, and a curing condition is applied to a target portion without applying the curing condition to a non-target portion of the second layer and first contrast layer to form a second contrast layer. A third composition can optionally be applied and cured on the second contrast layer to form a third contrast layer having a cured and uncured portion in the same manner. The uncured portions of these contrast layers are then selectively removed to prepare the article.

Abstract translation: 制备制品的方法包括在基材上施加第一组合物以形成第一层，并且将固化条件施加到目标部分，而不将固化条件施加到第一层的非目标部分，以形成第一对比层 。 然后将第二组合物施加在第一对比层上以形成第二层，并且将固化条件施加到目标部分，而不将固化条件施加到第二层和第一对比层的非目标部分，以形成第二层 对比层。 可以任选地在第二对比层上施加和固化第三组合物，以相同的方式形成具有固化和未固化部分的第三对比层。 然后选择性地去除这些对比层的未固化部分以制备制品。