公开(公告)号：WO2015120773A1

公开(公告)日：2015-08-20

申请号：PCT/CN2015/072202

申请日：2015-02-04

Applicant: HONEYWELL INTERNATIONAL INC. ,  ZENG, Liang ,  LIU, Ya Qun ,  CHANG, Jerry ,  ZHANG, Bright ,  DING, Zhe ,  WANG, Wei Jun ,  HUANG, Hong Min

Inventor： ZENG, Liang ,  LIU, Ya Qun ,  CHANG, Jerry ,  ZHANG, Bright ,  DING, Zhe ,  WANG, Wei Jun ,  HUANG, Hong Min

IPC: C09K5/06 ,  H01L23/373

CPC classification number: H01L23/3737 ,  C09K5/063 ,  H01L23/367 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

Abstract translation: 提供了包括聚合物，导热填料和相变材料的可压缩热界面材料。 还提供了用于形成可压缩热界面材料的配方和包括可压缩热界面材料的电子部件。

公开(公告)号：WO2017152353A1

公开(公告)日：2017-09-14

申请号：PCT/CN2016/075827

申请日：2016-03-08

Applicant: HONEYWELL INTERNATIONAL INC. ,  ZHANG, Bright ,  WANG, Wei Jun ,  LIU, Ya Qun ,  HUANG, Hong Min

Inventor： ZHANG, Bright ,  WANG, Wei Jun ,  LIU, Ya Qun ,  HUANG, Hong Min

IPC: C09K5/00

Abstract: A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80wt.％ of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Abstract translation: 在一个示例性实施例中，热界面材料包括至少一种聚合物，至少一种相变材料，至少一种交联剂和至少一种导热填料。 所述至少一种导热材料包括具有约1微米或更小的粒径的第一多个颗粒。 所述至少一种导热填料占所述热界面材料总重量的至少80重量％。 还提供了用于形成热界面材料的配方和包括热界面材料的电子元件。

公开(公告)号：WO2015038454A1

公开(公告)日：2015-03-19

申请号：PCT/US2014/054481

申请日：2014-09-08

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： LIU, Ya Qun ,  ZHANG, Bright ,  DUAN, Huifeng ,  JIANG, Wanchao ,  JIANG, Yunzi ,  DING, Zhe ,  CHEN, David K. ,  SHEN, Yanming ,  WANG, Wei Jun

IPC: C09D183/04 ,  C08L83/04

CPC classification number: C09D183/08 ,  C08G77/24

Abstract: Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si-O-Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si-O-Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si-O-Si linkages, wherein the linking portion is of a formula selected from the group consisting of: -[CH 2 ] a - where a is an integer from 1 to 10 and -[CH 2 ] b CONH[CH 2 ] c - where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.

Abstract translation: 提供了具有改进的疏水性和疏油性的聚氟硅氧烷涂料和用于产生这种涂层的溶液。 在一些实施方案中，涂层包括具有多个Si-O-Si键的聚合物; 和至少两个含氟部分，各自连接至至少一个Si-O-Si键。 每个含氟部分独立地包括连接到Si-O-Si键之一的硅的连接部分，其中连接部分具有选自： - [CH 2] a - 的化合物，其中a是 1〜10的整数， - [CH 2] bCONH [CH 2] c - ，其中b和c独立地为0〜10的整数。各含氟部分也独立地包含与连接部分连接的氟化部分， 选自具有1-10个碳原子的氟化烷基和含全氟醚的有机基团。

公开(公告)号：WO2013026177A1

公开(公告)日：2013-02-28

申请号：PCT/CN2011/001392

申请日：2011-08-22

Applicant: HONEYWELL INTERNATIONAL INC. ,  HUANG, Hongmin ,  GAO, Carol ,  DING, Zhe ,  PENG, Albert ,  LIU, Ya Qun ,  ZHANG, Bright

Inventor： HUANG, Hongmin ,  GAO, Carol ,  DING, Zhe ,  PENG, Albert ,  LIU, Ya Qun ,  ZHANG, Bright

IPC: H01L21/24 ,  H01L21/228

CPC classification number: H01L21/2225 ,  H01L21/2254

Abstract: Substantially silane-free phosphorous-comprising dopants, methods for forming phosphorous-doped regions in a semiconductor material using substantially silane-free phosphorous-comprising dopants, and a method for fabricating substantially silane-free phosphorous-comprising dopants are provided. A phosphorous-comprising dopant comprises a phosphorous source comprising a phosphorous-comprising salt, a phosphorous-comprising acid, phosphorous-comprising anions, or combinations thereof, an alkaline material, cations from an alkaline material, or combinations thereof, and a liquid medium. The phosphorous-comprising dopant comprises less than 0.1wt.% silanes, oligomers and/or polymers derived from silanes, or a combination thereof.

Abstract translation: 基本上不含硅烷的含磷掺杂剂，使用基本上不含硅烷的含磷掺杂剂在半导体材料中形成磷掺杂区域的方法以及基本上不含硅烷的含磷掺杂剂的制造方法。 含磷掺杂剂包括磷源，其包含含磷的盐，含磷的酸，含磷的阴离子或其组合，碱性材料，来自碱性材料的阳离子或其组合，以及液体介质。 含磷掺杂剂包含小于0.1重量％的硅烷，衍生自硅烷的低聚物和/或聚合物，或其组合。

公开(公告)号：WO2016086410A1

公开(公告)日：2016-06-09

申请号：PCT/CN2014/093138

申请日：2014-12-05

Applicant: HONEYWELL INTERNATIONAL INC. ,  ZHANG, Bright ,  SHEN, Ling ,  WANG, Hui ,  LIU, Ya Qun ,  WANG, Wei Jun ,  HUANG, Hong Min

Inventor： ZHANG, Bright ,  SHEN, Ling ,  WANG, Hui ,  LIU, Ya Qun ,  WANG, Wei Jun ,  HUANG, Hong Min

IPC: C09K5/14

CPC classification number: C09K5/066 ,  C09K5/063 ,  C09K5/14 ,  H01L23/3737 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253

Abstract: A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Abstract translation: 在一个示例性实施例中，热界面材料包括聚合物，相变材料，具有第一粒度的第一导热填料和具有第二粒径的第二导热填料。 第一粒径大于第二粒径。 还提供了一种用于形成热界面材料的配方和包括热界面材料的电子部件。

公开(公告)号：WO2016004565A1

公开(公告)日：2016-01-14

申请号：PCT/CN2014/081724

申请日：2014-07-07

Applicant: HONEYWELL INTERNATIONAL INC. ,  LIU, Ya Qun ,  ZENG, Liang ,  WANG, Hui ,  ZHANG, Bright ,  HUANG, Hong Min

Inventor： LIU, Ya Qun ,  ZENG, Liang ,  WANG, Hui ,  ZHANG, Bright ,  HUANG, Hong Min

IPC: C08K5/29 ,  C08K5/25 ,  C08K3/22 ,  B32B27/18

CPC classification number: C09K5/14 ,  C08K13/02 ,  C08K2201/001 ,  C08L23/0815 ,  C08L2201/08 ,  C08L2203/20 ,  C09K5/063 ,  C09K15/06 ,  C09K15/22 ,  C09K15/24 ,  C09K15/30 ,  G06F1/20 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2924/0002 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/0544 ,  H01L2924/12041 ,  H01L2924/1432 ,  H05K7/2039 ,  H01L2924/00

Abstract: A thermal interface material includes at least one polymer,at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of : nitrogen containing complexing agents,phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

Abstract translation: 热界面材料包括至少一种聚合物，至少一种导热填料; 和至少一种离子清除剂。 在一些实施方案中，离子清除剂是选自以下的络合剂：含氮络合剂，含磷络合剂和基于羟基羧酸的络合剂。