公开(公告)号：WO2010128483A3

公开(公告)日：2011-07-21

申请号：PCT/IB2010052018

申请日：2010-05-07

Applicant: IBM ,  DELAMARCHE EMMANUEL ,  DRECHSLER UTE ,  LOVCHIK ROBERT

Inventor： DELAMARCHE EMMANUEL ,  DRECHSLER UTE ,  LOVCHIK ROBERT

IPC: B01J19/00 ,  B01L3/00 ,  B01L3/02

CPC classification number: B01J19/0046 ,  B01J2219/00367 ,  B01J2219/00527 ,  B01J2219/00743 ,  B01L3/0241 ,  B01L3/502707 ,  B01L2300/0874 ,  B01L2300/0887 ,  Y10T29/494 ,  Y10T137/0318 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8359 ,  Y10T137/8593 ,  Y10T137/87153 ,  Y10T137/87885

Abstract: The invention is directed to a multilayer microfluidic probe (MFP) head (100). The head typically comprises a first (110) and second (120) layers facing each others, and at least one tubing port (182), extending from the first layer (110). The first layer comprises one or more via (112), whereby fluid communication is enabled through the first layer towards the second layer. The second layer comprises at least one microchannel (124), relaying fluid communication to an aperture (122). Such a multilayered MFP head is easier to fabricate than heads made with unitary construction. In particular, a microchannel can advantageously be engraved a groove (124) at the level of the interface between the two layers. The MFP head can further be interfaced with tubing using e.g. a standard fitting for tubing port. The invention has substantial potential for e.g. patterning continuous and discontinuous patterns of biomolecules on surfaces as well as for direct processing of resist materials in a non- contact mode.

Abstract translation: 本发明涉及一种多层微流体探针（MFP）头（100）。 头部通常包括彼此面对的第一（110）和第二（120）层，以及从第一层（110）延伸的至少一个管口（182）。 第一层包括一个或多个通孔（112），由此通过第一层朝向第二层的流体连通。 第二层包括至少一个微通道（124），将流体连通中继到孔（122）。 这样的多层MFP头比用单一结构制造的头更容易制造。 特别地，微通道可以有利地在两层之间的界面的水平刻划凹槽（124）。 MFP头可以进一步与例如管道连接。 油管口的标准配件。 本发明具有实质的潜力。 在表面上形成生物分子的连续和不连续图案，以及在非接触模式下直接处理抗蚀剂材料。

公开(公告)号：WO02064495A3

公开(公告)日：2003-06-05

申请号：PCT/IB0200395

申请日：2002-02-08

Applicant: IBM ,  DESPONT MICHEL ,  DRECHSLER UTE ,  GENOLET GREGOIRE ,  VETTIGER PETER

Inventor： DESPONT MICHEL ,  DRECHSLER UTE ,  GENOLET GREGOIRE ,  VETTIGER PETER

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00476 ,  B81C2201/0109

Abstract: A method for at least partially releasing microstructures from a substrate is provided. The method comprises the steps of: a) providing a substrate (2); b) depositing onto said substrate (2) a first layer (4) and a second layer (6), the first layer (4) and the second layer (6) each comprising an electrically conducting material and each having a different oxido-reduction potential; c) electrically connecting the first layer (4) and the second layer (6); d) forming a microstructure (8) on the first (4) and second (6) layers deposited in step b) to produce an intermediate structure (10); and e) electrochemically etching said second layer (6) by immersing the intermediate structure (10) formed in step d) in an electrolyte (12).

Abstract translation: 提供了一种至少部分地从基板上释放微结构的方法。 该方法包括以下步骤：a）提供衬底（2）; b）在所述基板（2）上沉积第一层（4）和第二层（6），所述第一层（4）和所述第二层（6）各自包括导电材料并且各自具有不同的氧化还原 潜在; c）电连接第一层（4）和第二层（6）; d）在步骤b）中沉积的第一（4）和第二（6）层上形成微结构（8）以产生中间结构（10）; 以及e）通过将步骤d）中形成的中间结构（10）浸入电解质（12）中来电化学蚀刻所述第二层（6）。

公开(公告)号：WO03014789A2

公开(公告)日：2003-02-20

申请号：PCT/IB0202117

申请日：2002-06-07

Applicant: IBM ,  DESPONT MICHEL ,  DRECHSLER UTE ,  ROTHUIZEN HUGO E ,  VETTIGER PETER ,  WIDMER ROLAND W

Inventor： DESPONT MICHEL ,  DRECHSLER UTE ,  ROTHUIZEN HUGO E ,  VETTIGER PETER ,  WIDMER ROLAND W

IPC: G02B26/08 ,  B81B3/00 ,  G02B6/122 ,  G02B6/35 ,  G11C23/00 ,  H01H1/00 ,  H01H61/02

CPC classification number: G11C23/00 ,  G02B6/122 ,  G02B6/3514 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3576 ,  G02B6/358 ,  H01H1/0036 ,  H01H61/02 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2061/006

Abstract: A microsystem switch (1, 20, 25, 30, 33) has a support (2) defining a recess (3), and a flexible bridge (6) is mounted on the support (2) bridging the recess (3). The bridge (6) is shaped so as to hold selectively a concave support stable state, in which the bridge bulges out of the recess (3). The switch includes an actuator (8, 9; 26, 27) for effecting flexing of the bridge (6) between the stable states, and a switching element (7, 31, 34) is mounted on the bridge (6) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch (40, 55) has a support (41) defining a recess (42), and an elongate torsion member (44) is mounted on the support (41) bridging the recess (42). A flexible bridge (43, 56) is mounted on the support (41) bridging the recess (42) in a direction substantially perpendicular to the torsion member (44). The bridge (43, 56) is connected to the torsion member (44) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess (42) and a second section of the bridge extends between the cross-point and the opposite side of the recess (42). The bridge (43, 56) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element (45) is mounted at the cross-point of the bridge (43, 56) and torsion member (44), and an actuator (46a, 46b; 58a, 58b) is again provided for effecting flexing of the bridge (43, 56) between the stable states. Here, movement of the bridge (43, 56) between the stable states effects twisting of the torsion member (44) and rotation of the switching element (45) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.

Abstract translation: 微系统开关（1,20,25,30,33）具有限定凹部（3）的支撑件（2），并且柔性桥（6）安装在桥接凹部（3）的支撑件（2）上。 桥（6）成形为能够选择性地保持凹形支撑件稳定状态，其中桥从凸出部（3）突出。 所述开关包括用于在所述稳定状态之间实现所述桥梁（6）的弯曲的致动器（8,9; 26,27），并且将开关元件（7,31,34）安装在所述桥架（6）上， 在稳定状态之间的桥接器之间的开关元件在接通位置和关闭位置之间移动。 根据另一种设计，微系统开关（40,55）具有限定凹部（42）的支撑件（41），并且细长扭转构件（44）安装在桥接凹部（42）的支撑件（41）上。 柔性桥（43,46）安装在基本上垂直于扭转构件（44）的方向上桥接凹部（42）的支撑件（41）上。 桥（43,46）在其交叉点处连接到扭转构件（44），使得桥的第一部分在凹部（42）的交叉点和一侧之间延伸，并且第二部分 该桥在凹口（42）的交叉点和相对侧之间延伸。 桥（43,56）成形为能够选择性地保持第一稳定状态，其中桥的第一部分凸起到凹部中，并且桥的第二部分从凹部膨胀出来，并且第二稳定状态在 这个配置是相反的。 开关元件（45）安装在桥（43,56）和扭转构件（44）的交叉点处，并且再次提供致动器（46a，46b; 58a，58b）以实现桥的弯曲 43，56）之间的稳定状态。 这里，桥梁（43,46）在稳定状态之间的移动使得扭转构件（44）扭转和开关元件（45）的旋转在接通位置和关闭位置之间。 还提供了包括这些开关的开关装置和包括这种开关装置的阵列的开关装置。

公开(公告)号：WO02057179A2

公开(公告)日：2002-07-25

申请号：PCT/IB0200154

申请日：2002-01-11

Applicant: IBM ,  DESPONT MICHEL ,  DRECHSLER UTE ,  MAGNUSON ROY H

Inventor： DESPONT MICHEL ,  DRECHSLER UTE ,  MAGNUSON ROY H

IPC: B81B3/00 ,  B81C1/00 ,  C23F13/14 ,  H01L21/306

CPC classification number: H01L21/30604 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C1/00801 ,  B81C2201/0107 ,  B81C2201/0114 ,  B81C2201/0133 ,  C23F13/14

Abstract: A method for protecting a material of a microstructure comprising said material and a noble metal layer (8) against undesired galvanic etching during manufacture comprises forming on the structure a sacrificial metal layer (12) having a lower redox potential than said material, the sacrificial metal layer (12) being electrically connected to said noble metal layer (8).

Abstract translation: 一种用于在制造过程中保护包含所述材料的微结构材料和贵金属层（8）的方法，用于防止不期望的电化学蚀刻，包括在所述结构上形成具有比所述材料更低氧化还原电位的牺牲金属层（12），所述牺牲金属 层（12）电连接到所述贵金属层（8）。

公开(公告)号：WO2004043850A3

公开(公告)日：2005-03-24

申请号：PCT/GB0304829

申请日：2003-11-07

Applicant: IBM ,  IBM UK

Inventor： POGGE BERNHARD ,  DESPONT MICHEL ,  DRECHSLER UTE ,  PRASAD CHANDRIKA ,  VETTIGER PETER ,  YU ROY

IPC: B81C3/00 ,  H01L21/768

CPC classification number: B81C1/00238 ,  B81B2203/0307 ,  H01L21/76898 ,  H01L2224/16225

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by which it is connected to a substrate. The chip is attached to the MEMS substrate in a direction normal to the substrate surface, so as to make a conductive path from the chip to the MEMS. The chip may be attached by bonding the conductor to C4 metal pads formed on the chip, or by bonding the conductor to metal studs on the chip. The MEMS substrate may be thinned before attachment to the chip, or may be removed from the underside of the MEMS. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.

Abstract translation: 垂直整合的结构包括微机电系统（MEMS）和用于向MEMS输送信号的芯片。 MEMS具有一个具有穿过其中的导体的锚定部分，通过该锚固部分连接到基底。 该芯片沿着垂直于衬底表面的方向附接到MEMS衬底，从而形成从芯片到MEMS的导电路径。 可以通过将导体接合到形成在芯片上的C4金属焊盘，或者通过将导体粘合到芯片上的金属螺柱来附接芯片。 MEMS基板可以在连接到芯片之前变薄，或者可以从MEMS的下侧移除。 使用临时载体板来促进MEMS的处理和与芯片的对准。