公开(公告)号：WO2017105669A1

公开(公告)日：2017-06-22

申请号：PCT/US2016/060818

申请日：2016-11-07

Applicant: INTEL CORPORATION

Inventor： KUMAR, Siddarth ,  SANE, Sandeep B. ,  SAHASRABUDHE, Shubhada H. ,  TANDON, Shalabh

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A warp controlled package includes a substrate that assumes a warped configuration according to the application of heat. At least one device is coupled along the substrate. A plurality of electrical contacts extend between at least the device and the substrate. One or more counter moment elements are coupled with the substrate. The one or more counter moment elements include a passive configuration and a counter moment configuration. In the counter moment configuration the one or more counter moment elements are configured to apply a counter moment to the substrate to counteract the warped configuration. In the passive configuration the one or more counter moment elements are configured to apply a neutral counter moment less than the counter moment of the counter moment configuration.

Abstract translation: 经向控制的包装包括根据热量施加呈现翘曲构型的基底。 至少有一个装置沿着衬底耦合。 多个电触点至少在器件和衬底之间延伸。 一个或多个反力矩元件与衬底耦合。 一个或多个计数器时刻元件包括被动配置和计数器时刻配置。 在逆时刻配置中，一个或多个反力矩元件被配置为向衬底施加反作用力矩以抵消扭曲配置。 在被动配置中，一个或多个反力矩元件被配置为施加小于反力矩配置的反力矩的中性反力矩。

公开(公告)号：WO2018063213A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054332

申请日：2016-09-29

Applicant: INTEL CORPORATION

Inventor： KUMAR, Siddarth ,  SAHASRABUDHE, Shubhada H. ,  SANE, Sandeep B. ,  TANDON, Shalabh

IPC: H01L23/367 ,  H01L23/373 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/00 ,  H01L23/3675 ,  H01L23/4006 ,  H01L25/065 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.

Abstract translation: 描述了连接封装结构的方法/结构。 那些方法/结构可以包括布置在衬底的第一侧上的管芯的第一侧和管芯的第二侧上的冷却结构，其中冷却结构包括附接到衬底的第一部分和布置在衬底的第二侧上的第二部分 设置在所述模具的第二侧上，其中所述第一和第二部分通过所述冷却结构中的开口分开。 开口围绕第二部分的一部分，并且至少一个挠曲梁结构连接第一和第二部分。

公开(公告)号：WO2017083015A1

公开(公告)日：2017-05-18

申请号：PCT/US2016/053083

申请日：2016-09-22

Applicant: INTEL CORPORATION

Inventor： SAHASRABUDHE, Shubhada H. ,  SANE, Sandeep B. ,  KUMAR, Siddarth ,  TANDON, Shalabh

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/488

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/81365 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815

Abstract: Discussed generally herein are methods and devices for more reliable Package on Package (PoP) Through Mold Interconnects (TMIs). A device can include a first die package including a first conductive pad on or at least partially in the first die package, a dielectric mold material on the first die package, the mold material including a hole therethrough at least partially exposing the pad, a second die package including a second conductive pad on or at least partially in the second die package the second die package on the mold material such that the second conductive pad faces the first conductive pad through the hole, and a shape memory structure in the hole and forming a portion of a solder column electrical connection between the first die package and the second die package.

Abstract translation: 这里通常讨论的是用于通过模具互连（TMI）更可靠地封装（PoP）封装的方法和设备。 器件可以包括第一管芯封装和第二管芯封装，第一管芯封装包括在第一管芯封装上或者至少部分地在第一管芯封装中的第一导电焊盘，在第一管芯封装上的电介质模制材料，模制材料包括穿过其中的至少部分地暴露焊盘的孔， 包括在第二管芯上或至少部分地在第二管芯中的第二导电焊盘的管芯封装将第二管芯封装封装在模具材料上，使得第二导电焊盘通过孔面对第一导电焊盘，并且在孔中形成形状记忆结构， 第一管芯封装和第二管芯封装之间的焊料柱电连接的一部分。

公开(公告)号：WO2017105486A1

公开(公告)日：2017-06-22

申请号：PCT/US2015/066634

申请日：2015-12-18

Applicant: INTEL CORPORATION

Inventor： EBRAHIMI, Nona ,  ROMEO, Joseph M. ,  ROSS, Christopher L. ,  SANCHEZ, Rene J. ,  MILLER, Marcie M. ,  SCIARAPPO, Jill C. ,  KONA, Amarnath ,  SAHASRABUDHE, Shubhada H. ,  SCHNEIDER, Matthew J. ,  KRONSCHNABEL, Rod E. ,  MOSS, Thomas V. ,  WHITEHORN, Steven ,  EDWARDS, Kevin ,  SWESEY, Keith A. ,  YANCY, Cecilia ,  GOMEZ, Camilo F.

IPC: B60R25/102 ,  B60R21/015 ,  B60R22/10 ,  B60N2/26

CPC classification number: B60N2/26 ,  B60R21/01556 ,  B60R22/105

Abstract: A system and method for child car seat safety detection and notification are disclosed. A particular embodiment is configured to: provide at least one sensor to measure a condition present in an environment in which a child is restrained in a child car seat in a vehicle; determine, based on sensor data from the sensor, if the condition requires a notification to be sent to a user; generate a notification message including at least a portion of the sensor data and information indicative of a location of the child car seat; send the notification message to a mobile device application; and send the notification message to a vehicle subsystem application.

Abstract translation: 公开了用于儿童车座安全检测和通知的系统和方法。 特定实施例被配置为：提供至少一个传感器以测量存在于儿童被限制在车辆中的儿童汽车座椅中的环境中的状况; 基于来自传感器的传感器数据确定条件是否需要向用户发送通知; 生成包括所述传感器数据的至少一部分和指示所述儿童汽车座椅的位置的信息的通知消息; 将通知消息发送给移动设备应用程序; 并将通知消息发送给车辆子系统应用程序。