公开(公告)号：WO2003065421A1

公开(公告)日：2003-08-07

申请号：PCT/IB2003/000269

申请日：2003-01-29

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  CERNUSCA, Michael ,  KAUER, Christoph ,  TOTH, Marcus

Inventor： CERNUSCA, Michael ,  KAUER, Christoph ,  TOTH, Marcus

IPC: H01L21/00

CPC classification number: H01L24/95 ,  B65G47/848 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2924/01033 ,  H01L2924/01327 ,  H05K13/0038 ,  H05K13/028

Abstract: In a method for the placement of miniature components (2) on a carrier (3) for miniature components (2), the miniature components (2) are fed, after their withdrawal from a storage container 17, by a feed means (33) to substantially roller-shaped placing means (34), which placing means (34) can be driven into rotation, on which placing means (34) the miniature components (2) are firmly held, and with which placing means (34) the miniature components (2) held thereon are fed to the likewise driven tape-shaped carrier (3).

Abstract translation: 在用于将微型部件（2）放置在用于微型部件（2）的载体（3）上的方法中，微型部件（2）在通过进给装置（33）从储存容器17中取出之后被供给， 到基本上为辊状的放置装置（34），该放置装置（34）可以被驱动旋转，微型部件（2）被牢固地保持在放置装置（34）上，微型部件 保持在其上的部件（2）被馈送到同样被驱动的带状载体（3）。

公开(公告)号：WO2002078080A1

公开(公告)日：2002-10-03

申请号：PCT/IB2002/000486

申请日：2002-02-18

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.

Inventor： SCHOBER, Joachim, H. ,  TOTH, Marcus

IPC: H01L21/607

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05144 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48611 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: In a data carrier (1) with a chip module (3), the chip (5) of the chip module (3) is provided, in the region of its chip connecting layers (8), with a respective wire connecting means which is formed by a flat metal layer (10) and whereto an end (13), bonded in a wedge-shape fashion, of a bond wire (11) is connected.

Abstract translation: 在具有芯片模块（3）的数据载体（1）中，芯片模块（3）的芯片（5）在其芯片连接层（8）的区域中设置有相应的导线连接装置 由平坦金属层（10）形成，并且连接有接合线（11）的以楔形方式接合的端部（13）。