公开(公告)号：WO2018136121A1

公开(公告)日：2018-07-26

申请号：PCT/US2017/057728

申请日：2017-10-20

Applicant: LAM RESEARCH CORPORATION

Inventor： TAN, Zhongkui ,  ZHANG, Yiting ,  FU, Qian ,  XU, Qing ,  WU, Ying ,  SRIRAMAN, Saravanapriyan ,  PATERSON, Alex

IPC: H01L21/3065 ,  H01J37/32 ,  H05H1/46 ,  H01L21/67

Abstract: A substrate is positioned on a substrate support structure within a plasma processing volume of an inductively coupled plasma processing chamber. A first radiofrequency signal is supplied from a first radiofrequency signal generator to a coil disposed outside of the plasma processing volume to generate a plasma in exposure to the substrate. A second radiofrequency signal is supplied from a second radiofrequency signal generator to an electrode within the substrate support structure. The first and second radiofrequency signal generators are controlled independent of each other. The second radiofrequency signal has a frequency greater than or equal to about 27 megaHertz. The second radiofrequency signal generates supplemental plasma density at a level of the substrate within the plasma processing volume while generating a bias voltage of less than about 200 volts at the level of the substrate.

公开(公告)号：WO2019099313A1

公开(公告)日：2019-05-23

申请号：PCT/US2018/060240

申请日：2018-11-12

Applicant: LAM RESEARCH CORPORATION

Inventor： ZHANG, Yiting ,  MARSH, Richard ,  SRIRAMAN, Saravanapriyan ,  PATERSON, Alexander

IPC: H01J37/32

Abstract: A substrate processing system includes a multi-zone cooling apparatus to provide cooling for all or substantially all of a window in a substrate processing chamber. In one aspect, the apparatus includes one or more plenums to cover all or substantially all of a window in a substrate processing chamber, including under an energy source for transformer coupled plasma in the substrate processing chamber. One or more air amplifiers and accompanying conduits provide air to the one or more plenums to provide air flow to the window. The conduits are connected to plenum inlets at various distances from the center, to direct airflow throughout the window and thus address center hot, middle hot, and edge hot conditions, depending on the processes being carried out in the chamber. In one aspect, the one or more plenums include a central air inlet, to direct air toward the center portion of the window, to address center hot conditions.