公开(公告)号：WO2004100219A2

公开(公告)日：2004-11-18

申请号：PCT/US2004012543

申请日：2004-04-21

Applicant: MAXWELL TECHNOLOGIES INC ,  PATTERSON JANET SUZANNE

Inventor： PATTERSON JANET SUZANNE

IPC: H01L23/13 ,  H01L23/495 ,  H01L

CPC classification number: H01L24/06 ,  H01L23/13 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48747 ,  H01L2224/85447 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component package and a method of forming the package are disclosed. The package includes a die having a top face with set of contacts and a substrate having a cutout therein. The die may include a memory component and may include SDRAM. The substrate is mounted on the top face, and the cutout overlays the set of contacts. Wire leads extend from the set of contacts, at least partially through the cutout, to the substrate. The set of contacts may be positioned along a central region of the die, and the cutout overlays the central region. The wire leads extend to the substrate and may contact the substrate proximate to the cutout. The package may further include a set of electrical paths extending from the wire leads through the substrate for providing communicative path between the die and an external component.

Abstract translation: 公开了电子部件封装和形成封装的方法。 该封装包括具有顶面和一组触点的模具，以及在其中具有切口的基板。 芯片可以包括存储器组件，并且可以包括SDRAM。 基板安装在顶面上，切口覆盖该组触点。 导线从触点组延伸，至少部分地穿过切口延伸到基板。 该组接触件可以沿着管芯的中心区域定位，并且切口覆盖中心区域。 导线引线延伸到基板并且可以接近靠近切口的基板。 该封装还可以包括从导线穿过衬底延伸的一组电路径，用于提供管芯和外部元件之间的连通路径。