公开(公告)号：WO2012166686A3

公开(公告)日：2012-12-06

申请号：PCT/US2012/039779

申请日：2012-05-27

Applicant: MC10, INC. ,  GHAFFARI, Roozbeh ,  DE GRAFF, Bassel ,  ARORA, William ,  HU, Xiaolong ,  ELOLAMPI, Brian

Inventor： GHAFFARI, Roozbeh ,  DE GRAFF, Bassel ,  ARORA, William ,  HU, Xiaolong ,  ELOLAMPI, Brian

IPC: H05K1/00

Abstract: Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.

公开(公告)号：WO2015134588A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/018704

申请日：2015-03-04

Applicant: MC10, INC.

Inventor： GARLOCK, Dave ,  GAUDETTE, Harry ,  FASTERT, Steven ,  STANDLEY, Adam ,  ELOLAMPI, Brian ,  HSU, Yung-Yu

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K5/0034 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/32 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/065 ,  H05K2201/09063 ,  H05K2201/09872 ,  H05K2201/10151 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

Abstract translation: 封装的适形电子器件，封装的适形集成电路（IC）系统以及制造和使用封装的适形电子器件的方法在本文中呈现。 公开了一种保形IC装置，其包括柔性基板，连接到柔性基板的电子电路以及包含电子电路和柔性基板的柔性多部分封装壳体。 多部分壳体包括第一和第二封装壳体部件。 第一封装壳体部件具有用于将电子电路放置在其中的凹陷区域，而第二封装壳体部件具有用于将柔性基板置于其中的凹陷区域。 第一封装壳体部件任选地包括用于在其中安置柔性基板的凹陷区域。 壳体部件可以包括一个或多个穿过基板中的孔的突起，以接合另一壳体部件中的互补的凹陷，从而使密封壳体部件与柔性基板和电子电路对准和互锁。

公开(公告)号：WO2015103580A2

公开(公告)日：2015-07-09

申请号：PCT/US2015/010236

申请日：2015-01-06

Applicant: MC10, INC.

Inventor： MCMAHON, Nicholas ,  WANG, Xianyan ,  ELOLAMPI, Brian ,  KEEN, Bryan, D. ,  GARLOCK, David, G.

IPC: H01L23/29

CPC classification number: H01L23/4985 ,  H01L21/0206 ,  H01L21/4864 ,  H01L21/561 ,  H01L21/565 ,  H01L22/20 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate are fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

Abstract translation: 本文给出了封装的保形电子器件，封装的保形集成电路（IC）传感器系统以及制造和使用封装的保形电子器件的方法。 公开了一种共形集成电路器件，其包括具有附接到柔性衬底的电子电路的柔性衬底。 柔性封装层附接到柔性衬底。 柔性封装层将柔性衬底和封装层之间的电子电路包围。 对于一些配置，封装层和柔性衬底由可拉伸和可弯曲的非导电聚合物制成。 电子电路可以包括具有多个器件岛的集成电路传感器系统，所述多个器件岛经由多个可拉伸电互连电和物理地连接。

公开(公告)号：WO2013052919A2

公开(公告)日：2013-04-11

申请号：PCT/US2012/059131

申请日：2012-10-05

Applicant: MC10, INC.

Inventor： GHAFFARI, Roozbeh ,  LEE, Stephen P. ,  ELOLAMPI, Brian

IPC: A61B5/04

CPC classification number: A61B5/6853 ,  A61B5/0084 ,  A61B5/01 ,  A61B5/02055 ,  A61B5/0215 ,  A61B5/02405 ,  A61B5/036 ,  A61B5/04087 ,  A61B5/042 ,  A61B5/0422 ,  A61B5/044 ,  A61B5/046 ,  A61B5/053 ,  A61B5/0538 ,  A61B5/14539 ,  A61B5/14546 ,  A61B5/1473 ,  A61B5/4836 ,  A61B5/6833 ,  A61B5/6885 ,  A61B18/02 ,  A61B18/1492 ,  A61B18/20 ,  A61B2018/0016 ,  A61B2018/0022 ,  A61B2018/00357 ,  A61B2018/00577 ,  A61B2018/00648 ,  A61B2018/00839 ,  A61B2018/0212 ,  A61B2018/0237 ,  A61B2018/0262 ,  A61B2562/0209 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/125 ,  A61B2562/164 ,  A61M25/10 ,  A61M2025/105 ,  A61N7/00 ,  Y10T156/10

Abstract: An apparatus for medical diagnosis and/or treatment is provided. The apparatus includes a flexible substrate, an intermediate bus disposed on the flexible substrate, and a plurality of sensing elements disposed on the flexible substrate and coupled to the intermediate bus. The plurality of sensing elements and intermediate bus are disposed on the flexible substrate such that the sensing elements are disposed at areas of minimal strain of the flexible substrate.

Abstract translation: 提供了一种用于医疗诊断和/或治疗的设备。 该装置包括柔性衬底，设置在柔性衬底上的中间总线以及设置在柔性衬底上并耦合到中间总线的多个传感元件。 多个感测元件和中间总线设置在柔性基板上，使得感测元件设置在柔性基板的最小应变区域处。