LONG TERM ANALYTE SENSOR ARRAY
    4.
    发明申请
    LONG TERM ANALYTE SENSOR ARRAY 审中-公开
    长期分析仪传感器阵列

    公开(公告)号:WO2005048834A8

    公开(公告)日:2005-08-18

    申请号:PCT/US2004038119

    申请日:2004-11-15

    IPC分类号: A61B5/00 C12Q1/00 G01N33/543

    摘要: A long term analyte sensor for measuring at least one analyte in the body of a user and which includes a housing, a plurality of analyte contacting sensor elements and at least one structure for relaying information away from the sensor. This plurality of analyte contacting sensor elements are typically disposed in an array. The analyte sensor further includes at least one sensor protection membrane that is controllable in a manner such that sensor elements may be activated (e.g. exposed to the external environment) at different times so as to extend the useful life of the sensor. In illustrative analyte sensors, the analyte is glucose.

    摘要翻译: 一种用于测量使用者身体中的至少一种分析物的长期分析物传感器,其包括壳体,多个分析物接触传感器元件和用于将信息远离传感器中继的至少一个结构。 该多个分析物接触传感器元件通常以阵列方式设置。 分析物传感器还包括至少一个传感器保护膜,该传感器保护膜可以以不同时间使传感器元件被激活(例如暴露于外部环境)的方式被控制,以便延长传感器的使用寿命。 在说明性的分析物传感器中,分析物是葡萄糖。

    MULTILAYER SUBSTRATE
    5.
    发明申请
    MULTILAYER SUBSTRATE 审中-公开
    多层基板

    公开(公告)号:WO2004029994A3

    公开(公告)日:2004-06-10

    申请号:PCT/US0329224

    申请日:2003-09-15

    摘要: A multilayer substrate device formed from a base substrate (12) and alternating metalization layers (14) and dielectric layers (16). Each layer is formed without firing. Vias (44) may extend through one of the dielectric layers (16) such that two metalization layers (14) surrounding the dielectric layers (16) make contact with each other. The vias (44) may be formed by placing pillars (40) on top of a metalization layer (14), forming a dielectric layer (16) on top of the metalization layer (14) and surrounding the pillars (40), and removing the pillars (40). Dielectric layers (16) may be followed by other dielectric layers (16) and metalization layers (14) may be followed by other metalization layers (14).

    摘要翻译: 由基底(12)和交替的金属化层(14)和电介质层(16)形成的多层衬底器件。 每层形成而不烧制。 通孔(44)可以延伸穿过介电层(16)中的一个,使得围绕电介质层(16)的两个金属化层(14)彼此接触。 通孔(44)可以通过在金属化层(14)的顶部放置柱(40)而形成,在金属化层(14)的顶部上形成电介质层(16)并围绕柱(40) 支柱(40)。 电介质层(16)之后可以是其它电介质层(16),金属化层(14)之后可以是其它金属化层(14)。