公开(公告)号：WO2006087301A3

公开(公告)日：2006-12-07

申请号：PCT/EP2006050866

申请日：2006-02-13

Applicant: MUEHLBAUER AG ,  BIERL STEFAN ,  KUNZE WOLFRAM ,  KLOOSS MATTHIAS ,  POENITZ VOLKER ,  BERGMANN DIETER

Inventor： BIERL STEFAN ,  KUNZE WOLFRAM ,  KLOOSS MATTHIAS ,  POENITZ VOLKER ,  BERGMANN DIETER

IPC: H05K13/00

CPC classification number: H01L21/67109 ,  H01L21/67132 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K13/003

Abstract: The invention relates to a method for connecting semiconductor (2) or interposer (24) components placed in one or several rows on a flexible continuous supporting strip (1, 23) by heat hardened adhesives or soldering materials, wherein first heating components (7a-c; 26) are downwardly applied to the top surfaces (2a) of the semiconductor (2) or interposer (24) components by a first adjustable downward pressure force, at least one second heating component (8; 27) counteracts said first downward pressure force on the lower surface (2b) of said semiconductor (2) or interposer (24) components, an endless belt (9, 10; 28, 29) having the same running speed that the supporting strip (1, 23) is continuously displaceable in a parallel to the running direction (5) of said supporting strip (1, 23) between the first heating components (7a-c; 26) and the semiconductor (2) or interposer (24) components and between the second heating components (8; 27) and the semiconductor (2) or interposer (24) components, while the first heating components (7a-c; 26) produce the first pressure force by spring-loading.

Abstract translation: 本发明涉及一种具有柔性连续载带接合的一个或多个的行布置的半导体元件（2）或Interposem（24）的方法（1，23）是指在加热时固化的粘合剂或Lotmitteln，其中，所述半导体元件的上侧（2a）的 （2）或插入（24）的第一加热元件（7A-C; 26）具有可调节的第一压力从顶部至底部和下侧（2b）的半导体元件（2）或插入（24）的至少一个第二加热元件加压（8 （27）和半导体元件; 27）从下面的第一按压力的向上抵消，（第一加热元件7A-C之间; 26）和半导体元件（2）或Interposem（24）和第二加热之间元件（8 2）或Interposem（24）每一个都具有环形带（9，10;具有相对相同的速度载带（1，23）的运行方向（平行5）载带（1 28，29），23）连续bewe 是GT而第一加热元件（7A-C; 26）通过弹簧加载的装置施加所述第一压缩力。

公开(公告)号：WO2007000407A3

公开(公告)日：2007-03-15

申请号：PCT/EP2006063465

申请日：2006-06-22

Applicant: MUEHLBAUER AG ,  GOD RALF WOLFGANG ,  BROD VOLKER ,  BERGMANN DIETER

Inventor： GOD RALF WOLFGANG ,  BROD VOLKER ,  BERGMANN DIETER

IPC: G06K19/077 ,  B32B37/20 ,  H01L21/60

CPC classification number: B31D1/021 ,  B31D1/027 ,  G06K19/07718 ,  G06K19/07749 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01082 ,  H01L2224/83

Abstract: The invention relates to the production of self-adhesive RFID transponders, in which RFID chips are successively bonded to antennae. The method comprises the following steps: a) an antenna strip (13) is advanced with a self-adhesive first carrier strip (18) at an identical speed; b) the chips are applied to the antenna strip (13) by means of an application unit (17), to form a large number of RFID transponder inlays, each chip being allocated to one respective antenna (15) and making electrical contact with the latter by means of a contact device (17); c) the antenna strip (13) and the carrier strip (18) are then joined and the carrier strip (18) is laminated onto the antenna strip (13) by means of a lamination device (23, 24), in such a way that the carrier strip (18) covers the antennae (15) and the chips; d) each RFID transponder inlay is die-cut using a die cutting unit (25, 26), which severs the antenna strip (13) without severing the carrier strip (18), to form transponders (30a); and e) the sections (28) of the antenna strip (13) that are devoid of antennae are removed from the carrier strip (18), leaving intact the carrier strip (30) that supports the die-cut RFID transponders (30a).

Abstract translation: 本发明涉及生产自粘的RFID应答器，是在与天线的RFID芯片连接顺序，该方法包括以下步骤：a）移动一个天线带材（13）的和移动以相同的速度自粘支撑带（18）; b）将所述芯片（天线带13）上，以形成RFID应答器嵌体的施加器（17），在每种情况下一个天线（15）和分配的每个芯片的装置（通过接触装置17）的装置被带入与其电接触; c）中合并的天线带（13）和载带（18）的与层叠天线磁带上的载带（18）（13），使得所述载体带（18）覆盖所述天线（15）和芯片（23通过层压装置的手段， 24）; d）在不切断为应答器（30A）的形成的载体带（18）分隔每个RFID应答器嵌体（由天线带（13的分割装置）（由一个分离装置25,26的装置），以及e）从天线带的天线自由部分28）的吸 （13）从载带（18）围绕该分离的RFID标记（30A），以接收轴承载带（30）。

公开(公告)号：WO2013124438A3

公开(公告)日：2013-10-17

申请号：PCT/EP2013053599

申请日：2013-02-22

Applicant: MUEHLBAUER AG

Inventor： SCHLEMPER KLAUS ,  BERGMANN DIETER ,  BROD VOLKER

IPC: H01L31/0392 ,  B32B37/20 ,  H01L31/048 ,  H01L31/18

CPC classification number: H01L31/188 ,  B32B37/206 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2457/12 ,  H01L31/03926 ,  H01L31/0488 ,  Y02E10/50

Abstract: A thin-film solar module can have the following features: a first film web; a sequence of electrically conductive contact points arranged at a distance from one another on the first film web with respective first and second regions; a sequence of flexible thin-film solar cells which has a first side that is designed as a first pole at least in certain regions and a second side that is designed as a second pole at least in certain regions, a photovoltaically active layer structure, a flexible sealing layer located on the first side of the layer structure, and at least one electrical conductor located between the layer structure and the sealing layer and contacting the first pole, wherein the flexible sealing layer and the electric conductor protrude laterally past the photovoltaically active layer structure; wherein the thin-film solar cells are arranged on the first film web such that the second pole contacts a first contact point of the contact points on the first film web in the first region and the electric conductor contacting the first pole contacts a second contact point adjacent to the first contact point on the first film web in the second region.

Abstract translation: 一种薄膜太阳能电池模块可以包括以下特征：第一薄膜幅材; 一个所述第一片材上间隔开的导电接触衬垫到相应的第一和第二区域的结果; 一系列具有被至少部分地构造为第一极和第二侧，其被至少部分地构造为第二极，光伏活性层结构，位于柔性覆盖层的层结构的第一侧的第一侧柔性薄膜太阳能电池的， 且具有设置在所述覆盖层和所述电导体的至少接触所述第一杆，其中所述柔性覆盖层和所述电导体延伸超出光电活性层结构侧之间的层结构; 其中，所述第一片材上的薄膜太阳能电池，使得第二极接触部在所述第一区域中的第一片上的第一接触点，并且所述第一极接触电导体邻近第一膜卷材上在接触第二接触点的所述第一点的一个 第二区域接触。