公开(公告)号：WO2017196537A1

公开(公告)日：2017-11-16

申请号：PCT/US2017/029576

申请日：2017-04-26

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： JACKSON, Charles, M. ,  KUNKEE, Elizabeth, T.

IPC: H05K1/14 ,  H05K3/40 ,  H01R12/71 ,  H01R13/24 ,  H01R12/50 ,  H05K1/02 ,  H05K3/18 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly (100) includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips (115, 130, 145) and at least two conductive contacts (105, 110, 135, 140, 150, 155, 160, 165). One contact is integrated with a conductive path on the base PCB (105, 110) and another contact pad (160, 165) is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

Abstract translation: 弹性电连接器组件（100）包括基底PCB和堆叠的互连弹性导电结构层，其中每个结构具有至少两个弹性导电条（115,130,145）和至少两个导电 触点（105,110,135,140,​​150,155,160,165）。 一个触点与基底PCB（105,110）上的导电路径集成，并且另一个触点焊盘（160,165）被定位成当目标PCB平行于基底PCB安装时与目标PCB建立导电路径。 弹性导电条由于在基础PCB和目标PCB之间施加在叠置层上的压缩力而弯曲。 弹性导电结构通过沉积金属来顺序地形成每个堆叠层而形成，其中一个触点最初形成为与基底PCB上的导电路径接合。