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公开(公告)号：WO2020050930A1
公开(公告)日：2020-03-12
申请号：PCT/US2019/044606
申请日：2019-08-01
Applicant: RAYTHEON COMPANY
Inventor： TRULLI, Susan, C. , LAIGHTON, Christopher, M. , HARPER, Elicia, K.
IPC: H01R12/52 , H01L23/66 , H05K1/14 , H01R12/51 , H05K3/34 , H05K1/02 , H05K3/46 , H05K1/18 , H05K1/11
Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RF component and the DC contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.
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公开(公告)号：WO2018226464A1
公开(公告)日：2018-12-13
申请号：PCT/US2018/034992
申请日：2018-05-30
Applicant: RAYTHEON COMPANY
Inventor： LAIGHTON, Christopher. M. , TRULLI, Susan, C. , HARPER, Elicia, K.
Abstract: A microwave transmission line structure having a pair of ground strip conductors on a surface of a dielectric substrate structure. A signal strip conductor is disposed on the surface of the dielectric substrate structure between the pair of ground strip conductors. A solid dielectric layer is disposed over: the signal strip conductor; the upper surface of the dielectric substrate structure between sides of each one of the ground strip conductors; and the signal strip conductor. An electrically conductive shield member is disposed on the solid dielectric layer and on, and in direct contact with, upper surfaces of the pair of ground strip conductors. The structure is used on each one of a plurality of proximate microwave transmission lines formed on the substrate structure to electrically isolate the transmission line.
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公开(公告)号：WO2021167676A1
公开(公告)日：2021-08-26
申请号：PCT/US2020/063698
申请日：2020-12-08
Applicant: RAYTHEON COMPANY
Inventor： LAIGHTON, Christopher, M. , TRULLI, Susan, C. , HARPER, Elicia, K.
IPC: H01P5/02
Abstract: A radio frequency (RF) energy transmission line transition for coupling RF energy between a pair of RF transmission line sections disposed on intersecting surfaces of a corresponding one of a pair of conductive members, a first one of the pair of conductive members having a wall with a jog therein for receiving an end portion of a second one of the pair of conductive members, the end portion of an electrically conductive strip of the first one of the pair of radio frequency transmission line sections being disposed on, and electrically connected to, an electrically conductive strip of a second one of the pair of radio frequency transmission line sections.
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公开(公告)号：WO2019022922A1
公开(公告)日：2019-01-31
申请号：PCT/US2018/040549
申请日：2018-07-02
Applicant: RAYTHEON COMPANY
Inventor： PUZELLA, Angelo, M. , AUER, Lance, A. , ARMENDARIZ, Norman , BOZZA, Donald, A. , FRANCIS, John, B. , HENAULT, Philip, M. , OBERLE, Randal, W. , TRULLI, Susan, C. , ZARKH, Dimitry
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center; and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
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公开(公告)号：WO2017062251A1
公开(公告)日：2017-04-13
申请号：PCT/US2016/054290
申请日：2016-09-29
Applicant: RAYTHEON COMPANY
Inventor： TRULLI, Susan, C.
IPC: H01L23/373
CPC classification number: B32B1/08 , B32B7/12 , B32B9/007 , B32B9/041 , B32B2255/06 , B32B2255/205 , B32B2307/302 , B32B2457/00 , B32B2597/00 , F28F13/00 , F28F21/02 , F28F2013/006 , H01L23/373 , H01L23/3736 , H05K7/2039
Abstract: An anisotropic thermal conduit having an outer cylindrical tube; and an anisotropic thermal material disposed with the outer cylindrical tube.
Abstract translation: 具有外圆柱形管的各向异性热导管; 以及设置有外圆柱形管的各向异性热材料。
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Patent Agency Ranking
公开(公告)号：WO2019190628A3
公开(公告)日：2019-10-03
申请号：PCT/US2019/016282
申请日：2019-02-01
Applicant: RAYTHEON COMPANY
Inventor： TRULLI, Susan, C. , GUPTA, Anurag
IPC: H01L23/373 , F28F21/02 , H01L23/66
Abstract: A cooling structure having a heat generating electric component, a heat spreader comprising thermally anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the heat generating electric component being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the heat generating electric component; and a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane..
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公开(公告)号：WO2019045920A1
公开(公告)日：2019-03-07
申请号：PCT/US2018/043858
申请日：2018-07-26
Applicant: RAYTHEON COMPANY
Inventor： LAIGHTON, Christopher, M. , TRULLI, Susan, C. , HARPER, Elicia, K.
IPC: H01P5/18
Abstract: An RF coupler having: a pair of input ports; a pair of output ports; and a coupling region for coupling: a portion of an input signal at a first one of the input ports to first of the pair of output ports and another portion of the input signal fed to the first one of the input ports a second one of the output ports; and one portion of an input signal fed to a second one of the input ports to the second of the pair of output ports and another portion of the input signals fed to the second one of the input ports to the second one of the output ports. The coupling region comprises a plurality of serially connected, vertically stacked, coupling sections. Each one of a plurality of electrically conductive layers is disposed between a pair of the vertically stacked coupling sections.
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公开(公告)号：WO2016153971A1
公开(公告)日：2016-09-29
申请号：PCT/US2016/023048
申请日：2016-03-18
Applicant: RAYTHEON COMPANY
Inventor： TRULLI, Susan, C.
IPC: H01L23/373
CPC classification number: H01L23/34 , F28F21/085 , F28F21/087 , F28F21/089 , H01L23/373 , H01L23/3731 , H01L23/3735
Abstract: A heat spreader provided having: a ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and a heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.
Abstract translation: 一种散热器，具有：陶瓷基板; 以及设置在所述基板的至少一个表面上的金属化层结构。 金属化层结构包括：设置在基板的至少一个表面上的厚膜层; 在厚膜层上并与之直接接触的扩散阻挡层; 以及设置在扩散阻挡层上并与扩散阻挡层直接接触的导热层。 扩散阻挡层抑制厚膜层中的材料和导热层中的材料在厚膜层和导热层之间的扩散。 金属化层结构设置在基板的多个侧面上。
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公开(公告)号：WO2018231638A1
公开(公告)日：2018-12-20
申请号：PCT/US2018/036581
申请日：2018-06-08
Applicant: RAYTHEON COMPANY
Inventor： LAIGHTON, Christopher. M. , TRULLI, Susan, C. , HARPER, Elicia, K.
IPC: H01P5/18
Abstract: A quadrature coupler having: a pair of overlying strip conductors separated by a first dielectric layer to provide a coupling region between the coupling region of overlying strip conductors; a pair of opposing ground pads, the coupling region being disposed between the pair of opposing ground pads; a second dielectric layer disposed over the coupling region and between the pair of opposing ground pads; and an electrically conductive shield layer disposed over the second dielectric layer, extending over opposing sides of the dielectric layer and onto the pair of opposing ground pads. Portions of coupler are formed by printing or additive manufacturing.
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10.发明申请
公开(公告)号：WO2018140345A1
公开(公告)日：2018-08-02
申请号：PCT/US2018/014653
申请日：2018-01-22
Applicant: RAYTHEON COMPANY
Inventor： TRULLI, Susan, C. , LAIGHTON, Christopher, M. , HARPER, Elicia, K.
Abstract: A structure having pair of structure members separated by a gap and an interconnect structure member disposed in the gap. The interconnect structure member includes: a fill-structure having opposing sides in direct contact with the opposing sides of the first structure member and the second structure member; and, an interconnecting microwave transmission line disposed on the fill-structure electrically interconnecting the microwave transmission line of the first structure member to the second member structure. An electrically conductive member is disposed over a signal line of, and electrically connected to the ground conductor the interconnecting microwave transmission.
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