公开(公告)号：WO2021040189A1

公开(公告)日：2021-03-04

申请号：PCT/KR2020/006575

申请日：2020-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HONG, Eunseok ,  PARK, Gyounghwan ,  CHUNG, Cheolyoon

IPC: H05K1/02

Abstract: According to various embodiments, a printed circuit board may include: a first wiring layer including at least one first signal line and at least one first dummy line; and a second wiring layer arranged on the first wiring layer and including at least one second signal line and at least one second dummy line, wherein when the printed circuit board is viewed from above, the at least one first signal line may be arranged to overlap, at least in part, the at least one second dummy line, and the at least one second signal line may be arranged to overlap, at least in part, the at least one first dummy line.

公开(公告)号：WO2021125890A1

公开(公告)日：2021-06-24

申请号：PCT/KR2020/018702

申请日：2020-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEON, Jongmin ,  HONG, Eunseok

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/02 ,  H05K3/361 ,  H05K3/4652

Abstract: Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.

公开(公告)号：WO2019245230A1

公开(公告)日：2019-12-26

申请号：PCT/KR2019/007136

申请日：2019-06-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HONG, Eunseok

IPC: H05K9/00 ,  H05K5/00 ,  H04M1/02

Abstract: An electronic device according to various embodiments may include: a first communication module comprising communication circuitry configured to process a communication signal in a first frequency band among multiple frequency bands corresponding to a specified communication method; a second communication module comprising communication circuitry configured to process a communication signal in a second frequency band among the multiple frequency bands; a first circuit board on which the first communication module and a first connector electrically connected to the first communication module are mounted; a shield can including an upper face including at least one opening and the shield can further including a side face surrounding the upper face of the shield can, the shield can being disposed on the first circuit board to accommodate the first communication module in an inner space defined by the upper face and the side face, the side face being electrically connected to a first ground portion of the first circuit board; a second circuit board on which the second communication module and a second connector electrically connected to the second communication module are mounted, the second circuit board being disposed on the upper face of the shield can such that the second communication module corresponds to the first communication module and/or at least one component mounted on the first circuit board in the inner space through a corresponding opening among the at least one opening wherein the second connector is electrically coupled to the first connector; and an adhesive disposed between the upper face and the second circuit board.

公开(公告)号：WO2021162420A1

公开(公告)日：2021-08-19

申请号：PCT/KR2021/001723

申请日：2021-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： LEE, Youngsun ,  KIM, Byeongkeol ,  LEE, Yeongjin ,  JEON, Jongmin ,  JUNG, Jaeyoub ,  HONG, Eunseok

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H04M1/02

Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.

公开(公告)号：WO2020130732A1

公开(公告)日：2020-06-25

申请号：PCT/KR2019/018246

申请日：2019-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HONG, Eunseok

IPC: G06F1/16 ,  G06F1/20 ,  G06F11/32

Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.