公开(公告)号：WO2021125890A1

公开(公告)日：2021-06-24

申请号：PCT/KR2020/018702

申请日：2020-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEON, Jongmin ,  HONG, Eunseok

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/02 ,  H05K3/361 ,  H05K3/4652

Abstract: Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.