公开(公告)号：WO2017132837A1

公开(公告)日：2017-08-10

申请号：PCT/CN2016/073212

申请日：2016-02-02

Applicant: SCHOTT GLASS TECHNOLOGIES (SUZHOU) CO. LTD.

Inventor： QIAN, Pengxiang ,  HOU, Yunfei ,  XUE, Junming ,  LIEBALD, Rainer ,  KUROKI, Hiroshi

IPC: C03C4/02

CPC classification number: C03C27/00 ,  C03C3/091 ,  C03C4/00

Abstract: The invention concerns a low CTE boro-aluminosilicate glass having a low brittleness, in particular for the use in wafer-level-packaging (WLP) applications, with a composition in Mol-％of SiO 2 : 60-85, Al 2 O 3 : 1-17, B 2 O 3 : 8-20, Na 2 O: 0-5, K 2 O: 0-5, MgO: 0-10, CaO: 0-10, SrO: 0-10, BaO: 0-10, wherein the average number of non-bridging oxygen per polyhedron (NBO) is equal or larger than -0.2 and a ratio B 2 O 3 /Al 2 O 3 is equal or larger than 0.5, wherein the NBO is defined as NBO ＝ 2 x O mol / (Si mol +Al mol +B mol ) –4. The invention also concerns a glass carrier wafer made from the low CTE boro-aluminosilicate glass and a use thereof as glass carrier wafer for the processing of a silicon substrate. The invention further concerns a method for providing a low CTE boro-aluminosilicate glass.

Abstract translation: 本发明涉及具有低脆性的低CTE硼铝硅酸盐玻璃，特别是用于晶片级封装（WLP）应用中的组合物，其组成为SiO 2摩尔％ > 2：60-85，Al 2 O 3：1-17，B 2 O 3： 8-20，Na 2 O：0-5，K 2 O：0-5，MgO：0-10，CaO：0-10，SrO ：0-10，BaO：0-10，其中每个多面体的非桥连氧的平均数（NBO）等于或大于-0.2并且比率B 2≤0.3， / sub> 2 _{3 等于或大于0.5，其中NBO定义为NBO = 2×0mol％/（ Si摩尔+ Al摩尔+ B摩尔）-4。 本发明还涉及由低CTE硼铝硅酸盐玻璃制成的玻璃载体晶片及其用作用于处理硅衬底的玻璃载体晶片的用途。 本发明还涉及提供低CTE硼铝硅酸盐玻璃的方法。}

公开(公告)号：WO2017066924A1

公开(公告)日：2017-04-27

申请号：PCT/CN2015/092320

申请日：2015-10-20

Applicant: SCHOTT GLASS TECHNOLOGIES (SUZHOU) CO. LTD.

Inventor： HOU, Yunfei ,  QIAN, Pengxiang ,  LIEBALD, Rainer

IPC: H01L21/673

CPC classification number: H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2221/68395

Abstract: A method for de-bonding of a bonded article (1), in particular a bonded glass article (1), which comprises a carrier substrate (2), in particular a glass carrier substrate (2), having a bonding surface (3.1), and an ultra-thin substrate (3), in particular an ultra-thin glass substrate (3), having a first and a second surface (3.1, 3.2) and a thickness t, where the first surface (3.1) of the ultra-thin substrate (3) forms a bonding surface (3.1) with which the ultra-thin substrate (3) is bonded to the bonding surface (3.1) of the carrier substrate (2). The method comprises adhering a contact film (4) onto the second surface (3.2) of the ultra-thin substrate (3) and retaining the ultra-thin substrate (3) with its second surface (3.2) via the contact film (4) on a retaining surface (6.1) of a retaining device (6). The method further comprises de-bonding the ultra-thin substrate (3) from the carrier substrate (2) by applying a, preferably mechanical, de-bonding force to the carrier substrate (2) relative to the retaining device (6), and removing the contact film (4) from the second surface (3.2) of the de-bonded ultra-thin substrate (3). Preferably, a weakening treatment (8) is applied to the contact film (4) after the de-bonding of the ultra-thin substrate (3) which reduces the adhesion force between the contact film (4) and the second surface (3.2) of the ultra-thin substrate (3).

Abstract translation: （1），尤其是粘合的玻璃制品（1）的去粘合方法，该粘合的玻璃制品包括载体基底（2），尤其是玻璃载体基底（2） ，具有结合表面（3.1）和具有第一和第二表面（3.1,3.2）和厚度t的超薄基板（3），特别是超薄玻璃基板（3），其中 超薄基板（3）的第一表面（3.1）形成结合表面（3.1），超薄基板（3）通过结合表面（3.1）结合到载体基板（2）的结合表面（3.1）。 该方法包括通过接触膜（4）将接触膜（4）粘附到超薄基板（3）的第二表面（3.2）上并且用其第二表面（3.2）保持超薄基板（3） 在保持装置（6）的保持表面（6.1）上。 该方法还包括通过相对于保持装置（6）向载体基板（2）施加优选机械的分离力而将超薄基板（3）从载体基板（2）分离，以及 从剥离的超薄基板（3）的第二表面（3.2）去除接触膜（4）。 优选地，在减小接触膜（4）和第二表面（3.2）之间的粘合力的超薄基板（3）脱离之后，对接触膜（4）施加弱化处理（8） 的超薄基板（3）。

公开(公告)号：WO2016095155A1

公开(公告)日：2016-06-23

申请号：PCT/CN2014/094196

申请日：2014-12-18

Applicant: SCHOTT GLASS TECHNOLOGIES (SUZHOU) CO. LTD.

Inventor： HOU, Yunfei ,  QIAN, Pengxiang ,  LIEBALD, Rainer

IPC: G01N21/17

CPC classification number: G01N21/94 ,  G01N21/8422

Abstract: A method for producing a bonded article (70) comprising providing an ultra-thin substrate (1), in particular an ultra-thin glass substrate, with a first surface (1.1) and a second surface (1.2), where the ultra-thin substrate (1) is at least partially transmissible to an electromagnetic inspection radiation, and providing a support substrate (60) having a first surface and a second surface. The method comprises laminating a dark-screen film (2) on the second surface of the ultra-thin substrate (1) to produce a laminated ultra-thin substrate prior to cleaning the first surface (1.1) of the ultra-thin substrate (1). After cleaning, the first surface (1.1) of the ultra-thin substrate (1) is inspected for impurities (27) by irradiating the first surface (1.1) with the electromagnetic inspection radiation and identifying impurities (27) by way of contrast between the irradiated impurities (27) and the dark-screen film (2). If a desired cleanliness has been reached, a bonded article (70) is produced by bonding the laminated ultra-thin substrate with its first surface to the first or second surface of the support substrate (60). A bonded article (70) and a method for inspecting a surface of an ultra-thin substrate for impurities (27) are also provided.

Abstract translation: 一种接合体（70）的制造方法，其特征在于，在所述超薄基板（1），特别是超薄玻璃基板上设置有第一面（1.1）和第二面（1.2） 衬底（1）至少部分地传播到电磁检查辐射，并且提供具有第一表面和第二表面的支撑衬底（60）。 该方法包括在超薄基板（1）的第二表面上层叠暗屏膜（2）以在清洁超薄基板（1）的第一表面（1.1）之前制造层叠的超薄基板 ）。 在清洁之后，通过用电磁检查辐射照射第一表面（1.1）并通过对比度来识别杂质（27）来检查超薄基板（1）的第一表面（1.1）的杂质（27） 照射的杂质（27）和暗屏膜（2）。 如果达到所需的清洁度，则通过将叠层的超薄基板与其第一表面接合到支撑基板（60）的第一或第二表面来制造粘合物（70）。 还提供了一种粘合制品（70）和用于检查超薄基材表面的杂质（27）的方法。