LOW CTE BORO-ALUMINOSILICATE GLASS FOR GLASS CARRIER WAFERS
    1.
    发明申请
    LOW CTE BORO-ALUMINOSILICATE GLASS FOR GLASS CARRIER WAFERS 审中-公开
    用于玻璃载体晶片的低CTE硼铝硅酸盐玻璃

    公开(公告)号:WO2017132837A1

    公开(公告)日:2017-08-10

    申请号:PCT/CN2016/073212

    申请日:2016-02-02

    CPC classification number: C03C27/00 C03C3/091 C03C4/00

    Abstract: The invention concerns a low CTE boro-aluminosilicate glass having a low brittleness, in particular for the use in wafer-level-packaging (WLP) applications, with a composition in Mol-%of SiO 2 : 60-85, Al 2 O 3 : 1-17, B 2 O 3 : 8-20, Na 2 O: 0-5, K 2 O: 0-5, MgO: 0-10, CaO: 0-10, SrO: 0-10, BaO: 0-10, wherein the average number of non-bridging oxygen per polyhedron (NBO) is equal or larger than -0.2 and a ratio B 2 O 3 /Al 2 O 3 is equal or larger than 0.5, wherein the NBO is defined as NBO = 2 x O mol / (Si mol +Al mol +B mol ) –4. The invention also concerns a glass carrier wafer made from the low CTE boro-aluminosilicate glass and a use thereof as glass carrier wafer for the processing of a silicon substrate. The invention further concerns a method for providing a low CTE boro-aluminosilicate glass.

    Abstract translation: 本发明涉及具有低脆性的低CTE硼铝硅酸盐玻璃,特别是用于晶片级封装(WLP)应用中的组合物,其组成为SiO 2摩尔% > 2:60-85,Al 2 O 3:1-17,B 2 O 3: 8-20,Na 2 O:0-5,K 2 O:0-5,MgO:0-10,CaO:0-10,SrO :0-10,BaO:0-10,其中每个多面体的非桥连氧的平均数(NBO)等于或大于-0.2并且比率B 2≤0.3, / sub> 2 3 等于或大于0.5,其中NBO定义为NBO = 2×0mol%/( Si摩尔+ Al摩尔+ B摩尔)-4。 本发明还涉及由低CTE硼铝硅酸盐玻璃制成的玻璃载体晶片及其用作用于处理硅衬底的玻璃载体晶片的用途。 本发明还涉及提供低CTE硼铝硅酸盐玻璃的方法。

    METHOD FOR POST-PROCESSING OF BONDED ARTICLE
    2.
    发明申请
    METHOD FOR POST-PROCESSING OF BONDED ARTICLE 审中-公开
    粘合物品后处理方法

    公开(公告)号:WO2017066924A1

    公开(公告)日:2017-04-27

    申请号:PCT/CN2015/092320

    申请日:2015-10-20

    Abstract: A method for de-bonding of a bonded article (1), in particular a bonded glass article (1), which comprises a carrier substrate (2), in particular a glass carrier substrate (2), having a bonding surface (3.1), and an ultra-thin substrate (3), in particular an ultra-thin glass substrate (3), having a first and a second surface (3.1, 3.2) and a thickness t, where the first surface (3.1) of the ultra-thin substrate (3) forms a bonding surface (3.1) with which the ultra-thin substrate (3) is bonded to the bonding surface (3.1) of the carrier substrate (2). The method comprises adhering a contact film (4) onto the second surface (3.2) of the ultra-thin substrate (3) and retaining the ultra-thin substrate (3) with its second surface (3.2) via the contact film (4) on a retaining surface (6.1) of a retaining device (6). The method further comprises de-bonding the ultra-thin substrate (3) from the carrier substrate (2) by applying a, preferably mechanical, de-bonding force to the carrier substrate (2) relative to the retaining device (6), and removing the contact film (4) from the second surface (3.2) of the de-bonded ultra-thin substrate (3). Preferably, a weakening treatment (8) is applied to the contact film (4) after the de-bonding of the ultra-thin substrate (3) which reduces the adhesion force between the contact film (4) and the second surface (3.2) of the ultra-thin substrate (3).

    Abstract translation: (1),尤其是粘合的玻璃制品(1)的去粘合方法,该粘合的玻璃制品包括载体基底(2),尤其是玻璃载体基底(2) ,具有结合表面(3.1)和具有第一和第二表面(3.1,3.2)和厚度t的超薄基板(3),特别是超薄玻璃基板(3),其中 超薄基板(3)的第一表面(3.1)形成结合表面(3.1),超薄基板(3)通过结合表面(3.1)结合到载体基板(2)的结合表面(3.1)。 该方法包括通过接触膜(4)将接触膜(4)粘附到超薄基板(3)的第二表面(3.2)上并且用其第二表面(3.2)保持超薄基板(3) 在保持装置(6)的保持表面(6.1)上。 该方法还包括通过相对于保持装置(6)向载体基板(2)施加优选机械的分离力而将超薄基板(3)从载体基板(2)分离,以及 从剥离的超薄基板(3)的第二表面(3.2)去除接触膜(4)。 优选地,在减小接触膜(4)和第二表面(3.2)之间的粘合力的超薄基板(3)脱离之后,对接触膜(4)施加弱化处理(8) 的超薄基板(3)。

    BONDED ARTICLE OF THIN GLASS AND SUPPORT SUBSTRATE, AND METHODS FOR PRODUCING AND DEBONDING THEREOF
    3.
    发明申请
    BONDED ARTICLE OF THIN GLASS AND SUPPORT SUBSTRATE, AND METHODS FOR PRODUCING AND DEBONDING THEREOF 审中-公开
    薄玻璃和支撑基板的粘结物及其生产和脱粘方法

    公开(公告)号:WO2016101128A1

    公开(公告)日:2016-06-30

    申请号:PCT/CN2014/094609

    申请日:2014-12-23

    Abstract: A bonded article of thin glass and support substrate with a unique interlayer in between. The interlayer has adhesive on its both surfaces. The adhesion force between the thin glass and interlayer is less than 1 N/mm; the thickness of the adhesive between interlayer and support substrate is more than 50 mm. This bonded article can be subjected to an easy 2-step debonding method: the support substrate is firstly removed from the bonded article by a blade, and then the interlayer is peeled off from the thin glass without any breakage of the thin glass.

    Abstract translation: 薄玻璃和支撑基板的粘结制品,其间具有独特的中间层。 中间层在其两个表面上具有粘合剂。 薄玻璃和中间层之间的粘附力小于1N / mm; 中间层和支撑基板之间的粘合剂厚度大于50mm。 这种粘合制品可以经受容易的两步脱粘方法:首先通过刮刀从支撑基材上除去支撑基材,然后将中间层从薄玻璃上剥离,而不会使薄玻璃破裂。

    BONDED ARTICLE OF THIN GLASS ON SUPPORT SUBSTRATE, PREPARATION METHOD AND USE THEREOF
    4.
    发明申请
    BONDED ARTICLE OF THIN GLASS ON SUPPORT SUBSTRATE, PREPARATION METHOD AND USE THEREOF 审中-公开
    支撑基板上的薄玻璃粘结物品,制备方法及其用途

    公开(公告)号:WO2014201665A1

    公开(公告)日:2014-12-24

    申请号:PCT/CN2013/077585

    申请日:2013-06-20

    Abstract: The invention is related to a method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.

    Abstract translation: 本发明涉及一种制造接合制品的方法,其中在外部压力的帮助下,通过静电粘附工艺在不存在任何夹层的情况下将薄玻璃基板粘结在支撑基板上,在压力作用下不断地或逐步地施加压力 通过使用诸如辊或车轮的工具或具有弯曲表面的其它可移动装置的粘合过程。 粘合制品没有缺陷,例如 粘结界面中的气泡或夹杂物,这有利于薄玻璃基板的输送及其后处理。 还公开了这种无缺陷的粘合制品。 由两个构件的静电电荷附着引起的压力支持的静电粘附,例如。 衬底构件和支撑构件能够最小化,防止和排除缺陷,粘附表面之间的变形。

    THIN GLASS ARTICLE WITH A NON-UNIFORMLY ION-EXCHANGED SURFACE LAYER AND METHOD FOR PRODUCING SUCH A THIN GLASS ARTICLE
    5.
    发明申请
    THIN GLASS ARTICLE WITH A NON-UNIFORMLY ION-EXCHANGED SURFACE LAYER AND METHOD FOR PRODUCING SUCH A THIN GLASS ARTICLE 审中-公开
    具有非均匀离子交换表面层的薄玻璃制品和生产这种薄玻璃制品的方法

    公开(公告)号:WO2016149860A1

    公开(公告)日:2016-09-29

    申请号:PCT/CN2015/074681

    申请日:2015-03-20

    Abstract: A thin glass article having a first face and a second face, a method for producing it and a use thereof are provided. The article has one or more edges joining the first and the second face and a thickness between the first and the second face, where the both faces and the one or more edges together form an outer surface of the thin glass article. The article has a non-uniform ion-exchanged surface layer on its outer surface, wherein the non-uniformly ion-exchanged surface layer has an associated compressive surface stress which varies between a minimum and a maximum value over the outer surface and/or a depth of layer which varies between a minimum and a maximum value over the outer surface.

    Abstract translation: 提供具有第一面和第二面的薄玻璃制品,其制造方法及其用途。 制品具有连接第一和第二面的一个或多个边缘以及第一和第二面之间的厚度,其中两个面和一个或多个边缘一起形成薄玻璃制品的外表面。 所述制品在其外表面上具有不均匀的离子交换表面层,其中所述非均匀离子交换表面层具有相关联的压缩表面应力,其在外表面上的最小值和最大值之间变化,和/或 层的深度在外表面之间在最小值和最大值之间变化。

    METHOD FOR PRODUCING A BONDED ARTICLE INCLUDING AN ULTRA-THIN SUBSTRATE AND BONDED ARTICLE
    6.
    发明申请
    METHOD FOR PRODUCING A BONDED ARTICLE INCLUDING AN ULTRA-THIN SUBSTRATE AND BONDED ARTICLE 审中-公开
    用于生产包含超薄基底和粘结物品的粘结物品的方法

    公开(公告)号:WO2016095155A1

    公开(公告)日:2016-06-23

    申请号:PCT/CN2014/094196

    申请日:2014-12-18

    CPC classification number: G01N21/94 G01N21/8422

    Abstract: A method for producing a bonded article (70) comprising providing an ultra-thin substrate (1), in particular an ultra-thin glass substrate, with a first surface (1.1) and a second surface (1.2), where the ultra-thin substrate (1) is at least partially transmissible to an electromagnetic inspection radiation, and providing a support substrate (60) having a first surface and a second surface. The method comprises laminating a dark-screen film (2) on the second surface of the ultra-thin substrate (1) to produce a laminated ultra-thin substrate prior to cleaning the first surface (1.1) of the ultra-thin substrate (1). After cleaning, the first surface (1.1) of the ultra-thin substrate (1) is inspected for impurities (27) by irradiating the first surface (1.1) with the electromagnetic inspection radiation and identifying impurities (27) by way of contrast between the irradiated impurities (27) and the dark-screen film (2). If a desired cleanliness has been reached, a bonded article (70) is produced by bonding the laminated ultra-thin substrate with its first surface to the first or second surface of the support substrate (60). A bonded article (70) and a method for inspecting a surface of an ultra-thin substrate for impurities (27) are also provided.

    Abstract translation: 一种接合体(70)的制造方法,其特征在于,在所述超薄基板(1),特别是超薄玻璃基板上设置有第一面(1.1)和第二面(1.2) 衬底(1)至少部分地传播到电磁检查辐射,并且提供具有第一表面和第二表面的支撑衬底(60)。 该方法包括在超薄基板(1)的第二表面上层叠暗屏膜(2)以在清洁超薄基板(1)的第一表面(1.1)之前制造层叠的超薄基板 )。 在清洁之后,通过用电磁检查辐射照射第一表面(1.1)并通过对比度来识别杂质(27)来检查超薄基板(1)的第一表面(1.1)的杂质(27) 照射的杂质(27)和暗屏膜(2)。 如果达到所需的清洁度,则通过将叠层的超薄基板与其第一表面接合到支撑基板(60)的第一或第二表面来制造粘合物(70)。 还提供了一种粘合制品(70)和用于检查超薄基材表面的杂质(27)的方法。

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