Abstract:
The invention concerns a low CTE boro-aluminosilicate glass having a low brittleness, in particular for the use in wafer-level-packaging (WLP) applications, with a composition in Mol-%of SiO 2 : 60-85, Al 2 O 3 : 1-17, B 2 O 3 : 8-20, Na 2 O: 0-5, K 2 O: 0-5, MgO: 0-10, CaO: 0-10, SrO: 0-10, BaO: 0-10, wherein the average number of non-bridging oxygen per polyhedron (NBO) is equal or larger than -0.2 and a ratio B 2 O 3 /Al 2 O 3 is equal or larger than 0.5, wherein the NBO is defined as NBO = 2 x O mol / (Si mol +Al mol +B mol ) –4. The invention also concerns a glass carrier wafer made from the low CTE boro-aluminosilicate glass and a use thereof as glass carrier wafer for the processing of a silicon substrate. The invention further concerns a method for providing a low CTE boro-aluminosilicate glass.
Abstract:
A method for de-bonding of a bonded article (1), in particular a bonded glass article (1), which comprises a carrier substrate (2), in particular a glass carrier substrate (2), having a bonding surface (3.1), and an ultra-thin substrate (3), in particular an ultra-thin glass substrate (3), having a first and a second surface (3.1, 3.2) and a thickness t, where the first surface (3.1) of the ultra-thin substrate (3) forms a bonding surface (3.1) with which the ultra-thin substrate (3) is bonded to the bonding surface (3.1) of the carrier substrate (2). The method comprises adhering a contact film (4) onto the second surface (3.2) of the ultra-thin substrate (3) and retaining the ultra-thin substrate (3) with its second surface (3.2) via the contact film (4) on a retaining surface (6.1) of a retaining device (6). The method further comprises de-bonding the ultra-thin substrate (3) from the carrier substrate (2) by applying a, preferably mechanical, de-bonding force to the carrier substrate (2) relative to the retaining device (6), and removing the contact film (4) from the second surface (3.2) of the de-bonded ultra-thin substrate (3). Preferably, a weakening treatment (8) is applied to the contact film (4) after the de-bonding of the ultra-thin substrate (3) which reduces the adhesion force between the contact film (4) and the second surface (3.2) of the ultra-thin substrate (3).
Abstract:
A bonded article of thin glass and support substrate with a unique interlayer in between. The interlayer has adhesive on its both surfaces. The adhesion force between the thin glass and interlayer is less than 1 N/mm; the thickness of the adhesive between interlayer and support substrate is more than 50 mm. This bonded article can be subjected to an easy 2-step debonding method: the support substrate is firstly removed from the bonded article by a blade, and then the interlayer is peeled off from the thin glass without any breakage of the thin glass.
Abstract:
The invention is related to a method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.
Abstract:
A thin glass article having a first face and a second face, a method for producing it and a use thereof are provided. The article has one or more edges joining the first and the second face and a thickness between the first and the second face, where the both faces and the one or more edges together form an outer surface of the thin glass article. The article has a non-uniform ion-exchanged surface layer on its outer surface, wherein the non-uniformly ion-exchanged surface layer has an associated compressive surface stress which varies between a minimum and a maximum value over the outer surface and/or a depth of layer which varies between a minimum and a maximum value over the outer surface.
Abstract:
A method for producing a bonded article (70) comprising providing an ultra-thin substrate (1), in particular an ultra-thin glass substrate, with a first surface (1.1) and a second surface (1.2), where the ultra-thin substrate (1) is at least partially transmissible to an electromagnetic inspection radiation, and providing a support substrate (60) having a first surface and a second surface. The method comprises laminating a dark-screen film (2) on the second surface of the ultra-thin substrate (1) to produce a laminated ultra-thin substrate prior to cleaning the first surface (1.1) of the ultra-thin substrate (1). After cleaning, the first surface (1.1) of the ultra-thin substrate (1) is inspected for impurities (27) by irradiating the first surface (1.1) with the electromagnetic inspection radiation and identifying impurities (27) by way of contrast between the irradiated impurities (27) and the dark-screen film (2). If a desired cleanliness has been reached, a bonded article (70) is produced by bonding the laminated ultra-thin substrate with its first surface to the first or second surface of the support substrate (60). A bonded article (70) and a method for inspecting a surface of an ultra-thin substrate for impurities (27) are also provided.