公开(公告)号：WO2017086877A1

公开(公告)日：2017-05-26

申请号：PCT/SG2015/050463

申请日：2015-11-19

Applicant: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD

Inventor： JIN, Jian Ping ,  GAN, Tai Heng

IPC: H01L21/302

CPC classification number: H01L21/67028

Abstract: The present disclosure relates to an apparatus for cleaning a wafer table surface and/or an object disposed thereon. The apparatus comprises: a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon; at least one cleaning device disposed above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface, each cleaning device carrying a set of orifices directed in a non-normal direction toward the wafer table surface; a set of internal chambers fluidically coupled to the set of orifices of each cleaning device; a pump assembly fluidically coupled to the set of internal chambers, the pump assembly operable for fluid communication with the set of internal chambers; and a displacement mechanism configured for automatically displacing the wafer table such that the set of orifices travels across at least portions of the wafer table surface. Fluid communication of the pump assembly with the set of internal chambers creates a pressure differential between the set of internal chambers and an environment external to the set of orifices to enable fluid transfer across the spatial gap between at least one orifice and the wafer table surface. The fluid transfer across the spatial gap causes particulate matter on the wafer table surface and/or the object to be removed therefrom, thereby cleaning the wafer table surface and/or the object.

Abstract translation: 本公开涉及一种用于清洁晶圆台面和/或设置在其上的物体的设备。 该设备包括：晶片台组件，其包括提供晶片台表面的晶片台，该晶片台表面被构造成用于将物体牢固地保持在其上; 至少一个清洁装置，所述至少一个清洁装置设置在所述晶圆台表面上方，使得沿着所述晶圆台表面的法向轴线在每个清洁装置和所述晶圆台表面之间形成空间间隙，每个所述清洁装置承载一组以不导向的方式定向的孔口， 正常方向朝向晶圆台面; 一组内部腔室，其流体耦合到每个清洁装置的一组孔口; 泵组件，所述泵组件流体地联接到所述一组内腔室，所述泵组件可操作用于与所述一组内腔室流体连通; 以及位移机构，该位移机构被配置用于自动地移动晶片台，使得该组孔横过晶片台表面的至少部分行进。 泵组件与一组内腔室的流体连通在该组内腔室与该组孔口外部的环境之间产生压力差，以使流体能够跨越至少一个孔口和晶片台面之间的空间间隙传递。 横跨空间间隙的流体转移导致晶片台面和/或物体上的颗粒物质被从中移除，由此清洁晶片台面和/或物体。

公开(公告)号：WO2016022074A1

公开(公告)日：2016-02-11

申请号：PCT/SG2015/050252

申请日：2015-08-05

Applicant: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD

Inventor： JIN, Jian Ping ,  CHAN, Chen Foo

IPC: H01L21/677

CPC classification number: H01L21/677 ,  H01L21/67132

Abstract: A multi-reel handling apparatus is configured for aligning a first tape reel having a first winding axis with a feeding position and/or a corresponding tape transport axis; disposing a second tape reel having a second winding axis a standby position offset from the feeding position; performing first tape transfer operations directed to the first tape reel; and after the first tape transfer operations, simultaneously displacing the first and second tape reels by (a) linearly shuttling the first and second tape reels in a common direction perpendicular to the tape transport axis, or (b) changing the physical locations of the first and second tape reels by rotating the first and second tape reels about a common pivot axis oriented perpendicular to the first and second winding axes to thereby (i) dispose the second tape reel at the feeding position, and (ii) dispose the first tape reel at a standby position.

Abstract translation: 多卷轴处理装置被配置为使具有第一卷绕轴线的第一带卷轴与进给位置和/或相应的带传送轴线对准; 设置具有第二卷绕轴线的第二带卷轴，该备用位置偏离所述进给位置; 执行指向第一磁带卷轴的第一磁带传送操作; 并且在第一磁带传送操作之后，同时使第一和第二磁带盘移位（a）沿垂直于磁带传送轴线的共同方向线性地穿过第一和第二磁带卷轴，或（b）改变第一和第二磁带盘的物理位置 和第二磁带卷盘，使第一和第二磁带卷绕围绕垂直于第一和第二卷绕轴线定向的公共枢转轴线，从而（i）将第二磁带卷轴布置在进给位置，以及（ii） 在待机位置。

公开(公告)号：WO2015088449A1

公开(公告)日：2015-06-18

申请号：PCT/SG2014/000591

申请日：2014-12-11

Applicant: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD

Inventor： JIN, Jian Ping

IPC: H05K13/02

CPC classification number: H05K13/0417

Abstract: A tape reel turret apparatus for a tape and reel machine includes a central hub and a plurality of arms radially extending therefrom. A first actuator can collectively rotate the plurality of arms such that one arm rotates toward a feeding position simultaneous with rotation of the other arms away from the feeding position. Once a given arm resides at the feeding position, a second actuator can spin a tape reel carried by the arm such that a flexible linear tape carrying components can be loaded onto or offloaded from a tape reel carried by this arm. After tape reel loading or unloading, the first actuator collectively rotates the plurality of arms about the first axis of rotation to dispose a next arm at the feeding position, such that the flexible linear tape can be loaded onto or unloaded from a next tape reel carried by this arm. Arms disposed away from the feeding position can have tape reels decoupled / removed therefrom, and/or receive new tape reels, while a tape reel corresponding to the feeding position is spun.

Abstract translation: 一种用于卷带机的带盘转塔装置，包括中心毂和从其径向延伸的多个臂。 第一致动器可以共同地旋转多个臂，使得一个臂同时与另一个臂的旋转远离进给位置同时朝向进给位置旋转。 一旦给定的臂位于进给位置，第二致动器可以旋转由臂承载的带盘，以便携带部件的柔性线性带可以被装载到由该臂承载的带盘上或从其卸载。 在磁带卷轴装载或卸载之后，第一致动器共同地围绕第一旋转轴旋转多个臂，以将下一个臂布置在馈送位置，使得柔性线性带可以被装载到下一个带盘带上 通过这个手臂。 远离进给位置的臂可以使带卷筒脱离/去除，和/或接收新的卷轴，同时旋转对应于进给位置的带卷轴。

公开(公告)号：WO2014035348A1

公开(公告)日：2014-03-06

申请号：PCT/SG2013/000383

申请日：2013-09-02

Applicant: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD

Inventor： JIN, Jian Ping ,  LEE, Leng Kheam

IPC: H01L21/677 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

Abstract: A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.

Abstract translation: 一种多功能晶片和薄膜框架处理系统，包括晶片台组件，该晶片台组件具有提供用于承载晶片或薄膜框架的超平面晶片台表面的晶片台，以及至少一个：平坦化装置，其被配置为自动施加向下 在垂直于晶片台表面的方向上对翘曲或非平面晶片的部分施力; 位移限制装置，被配置为在停止施加的负压之后自动约束或防止晶片相对于晶片台表面的不受控横向运动，并且通过晶片台向晶片的下侧施加正压力; 以及旋转对准补偿装置，被配置为自动补偿安装在胶片框架上的晶片的旋转未对准。