摘要:
The optical-electrical printed circuit board disclosed herein includes a waveguide link assembly and a printed circuit board assembly. The printed circuit board assembly has first and second PCB layers between which optical waveguides of the waveguide link assembly are disposed. The end faces the optical waveguides are accessible through an access aperture in the printed circuit board assembly. An optical interconnector can be used to optically connect the optical waveguides to waveguides of an optical-electrical integrated circuit operably disposed on the printed circuit board assembly to form a photonic device. A waveguide bending structure can be used to bend the optical waveguides to facilitate optical coupling to the optical interconnector or directly to the waveguides of the optical-electrical integrated circuit. Methods of forming an optical-electrical printed circuit board, a photonic assembly and a photonic device are also disclosed.
摘要:
Embodiments herein describe techniques for testing or aligning optical components (205, 225) in a photonic chip (200) using a grating coupler (220). In one embodiment, the photonic chip (200) may include an edge coupler (205) and a grating coupler (220) for optically coupling the photonic chip to external fiber optic cables (920). The edge coupler (205) may be disposed on a side or edge of the photonic chip while the grating coupler (220) is located on a top or side of the photonic chip. During fabrication, the edge coupler (205) may be inaccessible. Instead of using the edge coupler (205) to test the photonic chip, a testing apparatus (805) can use the grating coupler (220) along with a splitter (215) to transfer optical test signals between an optical component in the photonic chip (e.g., a modulator or detector) and a test probe (505) optically coupled to the grating coupler (220).
摘要:
Photonic integrated circuits including controllable cantilevers are described. Such photonic integrated circuits may be used in connection with other optical devices, in which light is transferred between the photonic integrated circuit and one of these optical device. The photonic integrated circuit (302) may comprise an optical waveguide (316) having an end disposed proximate to a facet of the cantilever (312). The orientation of the cantilever (312) may be actively controlled in one or two dimensions, thus adjusting the orientation of the optical waveguide (316). Actuation (318) of the cantilever may be performed, for example, thermally and/or electrostatically. Orientation of the cantilever may be performed in such a way to align the optical waveguide with an optical device (326)
摘要:
An apparatus comprises a first photonic device (218) comprising a waveguide loop (212) configured to guide a first light from a first location of a surface (250) to a second location of the surface (252), and a second photonic device (218) comprising a light source (224) configured to provide the first light, and a first alignment coupler (220A) optically coupled to the light source (224) and configured to optically coupled to the waveguide loop (212) at the first location, a second alignment coupler (220B) configured to optically coupled to the waveguide loop (212) at the second location, and a photodetector (222) optically coupled to the second alignment coupler (220B) and configured to detect the first light when the waveguide loop (212) is aligned with the first alignment coupler (220A) and the second alignment coupler (220B).The photodetector generates an electrical signal based on the detection and on the received light.
摘要:
An optical coupling efficiency detection assembly includes a first housing (520) accommodating a beam splitter (304) and a fiber port (404), a second housing (530) accommodating a ferrule (424) enclosing a monitoring fiber (306), and an attachment block (510) attaching the first housing to the second housing to establish a parfocal arrangement among the beam splitter, the fiber port, and the ferrule. Further, an assembly method for the optical coupling efficiency detection assembly is disclosed. The assembly method may include providing a beam splitter (304) and a fiber port (404) in a first housing (520), providing a ferrule (424) enclosing a monitoring fiber (306) in a second housing (530), and attaching the second housing to the first housing via an attachment block (510) to establish a parfocal arrangement among the beam splitter, the fiber port, and the ferrule.
摘要:
Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces. Either the first or second waveguide may be configured to be moveable in response to an inertial change of the apparatus, wherein movement of the first or second waveguide causes a corresponding change in light intensity of the portion of the light beam, the change in light intensity indicating a measure of the inertial change. Other embodiments may be described and/or claimed.
摘要:
A planar lightwave circuit (PLC) is disclosed having fixed thereto a coupling tube for coupling an optical fiber. The PLC comprises a planar optical substrate having in it an optical waveguide having an optical aperture located on an edge surface of the optical substrate and a tube formed having a lumen dimensioned to receive an optical fiber ferrule and an edge surface fixed to the substrate edge surface so that a cross section of the lumen at the edge surface is aligned with the optical aperture.
摘要:
Methods of optimizing optical alignment in an optical package are provided. In one embodiment, the optical package includes a laser diode, a wavelength conversion device, coupling optics positioned along an optical path extending from the laser diode to the wavelength conversion device, and one or more adaptive actuators. The method involves adjusting the optical alignment of the wavelength conversion device in a non-adaptive degree of freedom by referring to a thermally-dependent output intensity profile of the laser diode and a thermally-dependent coupling efficiency profile of the optical package. The adjustment in the non-adaptive degree of freedom is quantified such that, over a given operating temperature range of the optical package, portions of the coupling efficiency profile characterized by relatively low coupling efficiency offset portions of the output intensity profile characterized by relatively high laser output intensity and portions of the coupling efficiency profile characterized by relatively high coupling efficiency offset portions of the output intensity profile characterized by relatively low laser output intensity. Additional embodiments are disclosed and claimed.