Abstract:
A laser transmitter unit is described, the unit including a laser diode 2 emitting radiation into a lens system. The lens system includes collimating lenses L1, L3 and focussing lenses L2, L4. Additionally, compensating or steering lens S1, S2 are positioned between the collimating lenses L1, L3 and the focussing lenses L2, L4. The steering lenses S1, S2 act to reduce the sensitivity of the focussing lenses L2, L4 to position within the lens system. The position the focussing lenses can be difficult to control particularly when the lenses are welded into position on the laser transmitter unit 1.
Abstract:
While two mutually allocated optical waveguide ends (LW11, LW12) are moved in relation to each other with the aid of at least one positioning device (PO2) by specifying a set axial traverse path (SW), a measuring light (ML) is overcoupled through their longitudinal gap (SP). Local intensity distribution (IV) of interferences of said measuring light in the longitudinal gap (SP) is detected, the real traverse path (IW) actually covered by the positioning device (PO2) is determined and allocated to the set traverse path (SW) for calibrating the axial traverse path of the positioning device (PO2).
Abstract:
A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.
Abstract:
A laser transmitter unit is described, the unit including a laser diode 2 emitting radiation into a lens system. The lens system includes collimating lenses L1, L3 and focussing lenses L2, L4. Additionally, compensating or steering lens S1, S2 are positioned between the collimating lenses L1, L3 and the focussing lenses L2, L4. The steering lenses S1, S2 act to reduce the sensitivity of the focussing lenses L2, L4 to position within the lens system. The position the focussing lenses can be difficult to control particularly when the lenses are welded into position on the laser transmitter unit 1.
Abstract:
Apparatus and methods for passively aligning optical elements are disclosed. In certain embodiments, the apparatus and methods include optical elements aligned on bases which are passively aligned and secured on a substrate by alignment features adapted to secure and passively align the bases. Flexible gripping elements consisting of laterally spaced flexible strips attach the optical element to the base or the base to the substrate.
Abstract:
With the intention of preventing damage to components as a result of heating of a chip and with the intention of limiting the affect of such heating, a chip carrying a waveguide connection or a fibre connection has been soldered firmly onto a metal surface or directly onto a metal lead frame, wherewith the thermal resistance will be much lower than in the case when the chip is soldered onto a ceramic or silicon carrier. The use of an embossing tool having an active embossing/stamping part (7) enables a microstructure that includes a V-groove (3) to be produced in the metal surface at low cost and with great precision for aligning a waveguide or a fibre with the chip. The embossing process may be carried out on the metal surface or directly on the metal lead frame. An embossing process can be automated relatively easily, since the material to be embossed can be worked in strip form. A construction method in which an optical chip is soldered to a metal carrier in which waveguide receiving or fibre receiving grooves have been embossed therein will improve heat dissipation and thus substantially increase the useful life of the finished component.
Abstract:
A surface mount module (1) comprising an optical semiconductor device (5) and an optical fiber (6) on a substrate (2), and a production method of the module (1). The substrate (2) comprises a base (3) formed by a precision transfer technique and having positioning marks (3b) for the optical semiconductor device and a positioning portion (3c) for the optical fiber; and a molded article (4) integrated with the base.