光モジュール
    2.
    发明申请
    光モジュール 审中-公开
    光学模块

    公开(公告)号:WO2009069540A1

    公开(公告)日:2009-06-04

    申请号:PCT/JP2008/071196

    申请日:2008-11-21

    Abstract: 光ファイバをファイバ挿入孔へ挿入する際発塵させることがない光モジュールを提供し、もって、光結合効率の低下や、耐雑音特性の劣化防止を図る。光モジュールは、電気回路の形成された端面にファイバ挿入孔が開口したフェルールと、電気回路に接続され、挿入孔と対向する光電変換素子と、光電変換素子と直接光結合する光ファイバとを含む。光ファイバは、ガラスファイバと保護被覆とからなり、挿入孔に対して保護被覆を介して位置決めされ、ガラスファイバが挿入口と接触していない状態で挿入孔に保持されている。

    Abstract translation: 提供了当将光纤插入光纤插入孔时不会引起粉尘的光学模块。 利用该光学模块,防止了光耦合效率的降低和抗噪声特性的劣化。 该光模块包括一个套圈,其具有在其上形成电路的端面处开口的光纤插入孔,连接到电路并面向插入孔的光电转换元件,以及与光电转换器直接光耦合的光纤 元件。 光纤包括玻璃纤维和保护涂层,通过保护涂层相对于插入孔定位,并且在玻璃纤维不与插入孔接触的同时保持在插入孔处。

    OPTICAL COUPLING DEVICES
    3.
    发明申请
    OPTICAL COUPLING DEVICES 审中-公开
    光耦合器件

    公开(公告)号:WO2004097478A8

    公开(公告)日:2006-01-05

    申请号:PCT/GB2004001860

    申请日:2004-04-29

    Inventor: HILL ROGER

    Abstract: A laser transmitter unit is described, the unit including a laser diode 2 emitting radiation into a lens system. The lens system includes collimating lenses L1, L3 and focussing lenses L2, L4. Additionally, compensating or steering lens S1, S2 are positioned between the collimating lenses L1, L3 and the focussing lenses L2, L4. The steering lenses S1, S2 act to reduce the sensitivity of the focussing lenses L2, L4 to position within the lens system. The position the focussing lenses can be difficult to control particularly when the lenses are welded into position on the laser transmitter unit 1.

    Abstract translation: 描述了激光发射器单元,该单元包括将辐射发射到透镜系统中的激光二极管2。 透镜系统包括准直透镜L1,L3和聚焦透镜L2,L4。 此外,补偿或转向透镜S1,S2位于准直透镜L1,L3和聚焦透镜L2,L4之间。 转向透镜S1,S2用于降低聚焦透镜L2,L4在透镜系统内的位置的灵敏度。 当透镜被焊接到激光发射机单元1上的位置时,聚焦透镜可能难以控制的位置。

    METHOD AND DEVICE FOR REGULATING A GIVEN LONGITUDINAL AXIAL DISTANCE BETWEEN AT LEAST TWO OPTICAL WAVEGUIDE ENDS
    4.
    发明申请
    METHOD AND DEVICE FOR REGULATING A GIVEN LONGITUDINAL AXIAL DISTANCE BETWEEN AT LEAST TWO OPTICAL WAVEGUIDE ENDS 审中-公开
    方法和设备设置特定的轴向的纵向距离的至少两个光纤端

    公开(公告)号:WO99056163A1

    公开(公告)日:1999-11-04

    申请号:PCT/DE1999/000785

    申请日:1999-03-19

    CPC classification number: G02B6/4227 G02B6/2551 G02B6/30 G02B6/4233

    Abstract: While two mutually allocated optical waveguide ends (LW11, LW12) are moved in relation to each other with the aid of at least one positioning device (PO2) by specifying a set axial traverse path (SW), a measuring light (ML) is overcoupled through their longitudinal gap (SP). Local intensity distribution (IV) of interferences of said measuring light in the longitudinal gap (SP) is detected, the real traverse path (IW) actually covered by the positioning device (PO2) is determined and allocated to the set traverse path (SW) for calibrating the axial traverse path of the positioning device (PO2).

    Abstract translation: 另外两个使用给定的轴向的目标横动(SW)的至少一个定位装置(PO2)相互配置的光波导路的端部(LW11,LW21)相对于彼此移动,测量光(ML)在纵向间隙(SP)被耦合。 此测量光(SP)的干扰的局部强度分布(IV)中的纵向间隙检测从中通过所述定位装置(PO2)实际上导致实际路径(IW)被确定,并且这为的轴向行程的校准所需的路径(SW) 定位装置(PO2)被分配。

    CHANNELED SUBSTRATES FOR INTEGRATED OPTICAL DEVICES EMPLOYING OPTICAL FIBERS
    5.
    发明申请
    CHANNELED SUBSTRATES FOR INTEGRATED OPTICAL DEVICES EMPLOYING OPTICAL FIBERS 审中-公开
    用于使用光纤的集成光学器件的通道基板

    公开(公告)号:WO2011041196A2

    公开(公告)日:2011-04-07

    申请号:PCT/US2010049918

    申请日:2010-09-23

    CPC classification number: G02B6/4214 G02B6/3636 G02B6/4233 G02B6/4249

    Abstract: A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.

    Abstract translation: 公开了用于形成采用光纤和至少一个有源光学部件的集成光学器件的沟道衬底。 引导基板包括具有形成在其中的上表面一个或多个凹槽的基板构件和透明片。 优选由薄玻璃制成的透明片材固定到基底构件上表面,以与一个或多个凹槽组合以限定一个或多个通道。 每个通道的尺寸均适于容纳光纤以允许通过有源光学部件和光纤之间的透明片材进行光学通信。 还提出了通过模制和绘图形成的引导衬底。 还公开了采用沟道衬底的集成光学器件。

    OPTICAL COUPLING DEVICES
    6.
    发明申请
    OPTICAL COUPLING DEVICES 审中-公开
    光耦合器件

    公开(公告)号:WO2004097478A1

    公开(公告)日:2004-11-11

    申请号:PCT/GB2004/001860

    申请日:2004-04-29

    Inventor: HILL, Roger

    Abstract: A laser transmitter unit is described, the unit including a laser diode 2 emitting radiation into a lens system. The lens system includes collimating lenses L1, L3 and focussing lenses L2, L4. Additionally, compensating or steering lens S1, S2 are positioned between the collimating lenses L1, L3 and the focussing lenses L2, L4. The steering lenses S1, S2 act to reduce the sensitivity of the focussing lenses L2, L4 to position within the lens system. The position the focussing lenses can be difficult to control particularly when the lenses are welded into position on the laser transmitter unit 1.

    Abstract translation: 描述了激光发射器单元,该单元包括将辐射发射到透镜系统中的激光二极管2。 透镜系统包括准直透镜L1,L3和聚焦透镜L2,L4。 此外,补偿或转向透镜S1,S2位于准直透镜L1,L3和聚焦透镜L2,L4之间。 转向透镜S1,S2用于降低聚焦透镜L2,L4在透镜系统内的位置的灵敏度。 当透镜被焊接到激光发射机单元1上的位置时,聚焦透镜可能难以控制的位置。

    OPTOELECTRONIC MODULE WITH PASSIVE ALIGNMENT OF OPTICAL ELEMENTS
    7.
    发明申请
    OPTOELECTRONIC MODULE WITH PASSIVE ALIGNMENT OF OPTICAL ELEMENTS 审中-公开
    光学元件与光学元件被动对准的光电模块

    公开(公告)号:WO2004010190A1

    公开(公告)日:2004-01-29

    申请号:PCT/US2003/022939

    申请日:2003-07-23

    Abstract: Apparatus and methods for passively aligning optical elements are disclosed. In certain embodiments, the apparatus and methods include optical elements aligned on bases which are passively aligned and secured on a substrate by alignment features adapted to secure and passively align the bases. Flexible gripping elements consisting of laterally spaced flexible strips attach the optical element to the base or the base to the substrate.

    Abstract translation: 公开了用于被动对准光学元件的装置和方法。 在某些实施例中,该装置和方法包括在基底上对准的光学元件,其被动地对准并且通过适于固定和被动对准基座的对准特征固定在基板上。 由横向间隔的柔性条组成的柔性夹紧元件将光学元件附接到基底或基底到基底。

    MICRO-REPLICATION IN METAL
    9.
    发明申请
    MICRO-REPLICATION IN METAL 审中-公开
    金属微复制

    公开(公告)号:WO1998026885A1

    公开(公告)日:1998-06-25

    申请号:PCT/SE1997002084

    申请日:1997-12-12

    CPC classification number: G02B6/423 G02B6/4233 G02B6/4243 G02B6/4272

    Abstract: With the intention of preventing damage to components as a result of heating of a chip and with the intention of limiting the affect of such heating, a chip carrying a waveguide connection or a fibre connection has been soldered firmly onto a metal surface or directly onto a metal lead frame, wherewith the thermal resistance will be much lower than in the case when the chip is soldered onto a ceramic or silicon carrier. The use of an embossing tool having an active embossing/stamping part (7) enables a microstructure that includes a V-groove (3) to be produced in the metal surface at low cost and with great precision for aligning a waveguide or a fibre with the chip. The embossing process may be carried out on the metal surface or directly on the metal lead frame. An embossing process can be automated relatively easily, since the material to be embossed can be worked in strip form. A construction method in which an optical chip is soldered to a metal carrier in which waveguide receiving or fibre receiving grooves have been embossed therein will improve heat dissipation and thus substantially increase the useful life of the finished component.

    Abstract translation: 为了防止由于芯片的加热而导致的部件损坏,并且为了限制这种加热的影响,携带波导连接或光纤连接的芯片已经牢固地焊接在金属表面上或直接焊接到 金属引线框架,其热阻将远低于当芯片焊接到陶瓷或硅载体上时的情况。 使用具有有源压花/冲压部件(7)的压花工具使得能够以低成本和高精度地在金属表面中生产包括V形槽(3)的微结构,以使波导或纤维与 芯片。 压花过程可以在金属表面上或直接在金属引线框架上进行。 压花过程可以相对容易地自动化,因为待压花的材料可以以带状形式进行加工。 其中将光学芯片焊接到其中已经在其中压印波导接收或光纤接收槽的金属载体上的结构方法将改善散热并因此显着地增加最终部件的使用寿命。

    SURFACE MOUNT MODULE AND PRODUCTION METHOD THEREOF
    10.
    发明申请
    SURFACE MOUNT MODULE AND PRODUCTION METHOD THEREOF 审中-公开
    表面安装模块及其生产方法

    公开(公告)号:WO1997012270A1

    公开(公告)日:1997-04-03

    申请号:PCT/JP1996002768

    申请日:1996-09-25

    Abstract: A surface mount module (1) comprising an optical semiconductor device (5) and an optical fiber (6) on a substrate (2), and a production method of the module (1). The substrate (2) comprises a base (3) formed by a precision transfer technique and having positioning marks (3b) for the optical semiconductor device and a positioning portion (3c) for the optical fiber; and a molded article (4) integrated with the base.

    Abstract translation: 一种在基板(2)上包括光学半导体器件(5)和光纤(6)的表面安装模块(1),以及模块(1)的制造方法。 基板(2)包括通过精密转印技术形成的基座(3),并具有用于光学半导体器件的定位标记(3b)和用于光纤的定位部分(3c); 和与底座一体化的模制品(4)。

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