公开(公告)号：WO2008134615A3

公开(公告)日：2008-12-24

申请号：PCT/US2008061738

申请日：2008-04-28

Applicant: MEDTRONIC INC ,  RUBEN DAVID A

Inventor： RUBEN DAVID A

IPC: A61B5/02 ,  A61B5/0215

CPC classification number: A61B5/0215 ,  A61B2562/028 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05672 ,  H01L2224/05679 ,  H01L2224/371 ,  H01L2224/37166 ,  H01L2224/37169 ,  H01L2224/37179 ,  H01L2224/37181 ,  H01L2224/37599 ,  H01L2224/45 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/84214 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/01072 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43

Abstract: The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.

Abstract translation: 本发明涉及一种用于可植入医疗装置的互连件。 互连包括焊盘和引导到焊盘上的第一层。 衬垫或第一层中的至少一个包括负的热膨胀系数（CTE）材料。

公开(公告)号：WO2008134615A2

公开(公告)日：2008-11-06

申请号：PCT/US2008/061738

申请日：2008-04-28

Applicant: MEDTRONIC, INC. ,  RUBEN, David A.

Inventor： RUBEN, David A.

IPC: A61B5/02

CPC classification number: A61B5/0215 ,  A61B2562/028 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05672 ,  H01L2224/05679 ,  H01L2224/371 ,  H01L2224/37166 ,  H01L2224/37169 ,  H01L2224/37179 ,  H01L2224/37181 ,  H01L2224/37599 ,  H01L2224/45 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/84214 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/01072 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43

Abstract: The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.

Abstract translation: 本发明涉及用于可植入医疗装置的互连。 该互连包括衬垫和引入该衬垫上的第一层。 垫或第一层中的至少一个包括负热膨胀系数（CTE）材料。