公开(公告)号：WO2008134615A2

公开(公告)日：2008-11-06

申请号：PCT/US2008/061738

申请日：2008-04-28

Applicant: MEDTRONIC, INC. ,  RUBEN, David A.

Inventor： RUBEN, David A.

IPC: A61B5/02

CPC classification number: A61B5/0215 ,  A61B2562/028 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05672 ,  H01L2224/05679 ,  H01L2224/371 ,  H01L2224/37166 ,  H01L2224/37169 ,  H01L2224/37179 ,  H01L2224/37181 ,  H01L2224/37599 ,  H01L2224/45 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/84214 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/01072 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43

Abstract: The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.

Abstract translation: 本发明涉及用于可植入医疗装置的互连。 该互连包括衬垫和引入该衬垫上的第一层。 垫或第一层中的至少一个包括负热膨胀系数（CTE）材料。

公开(公告)号：WO2008134615A3

公开(公告)日：2008-12-24

申请号：PCT/US2008061738

申请日：2008-04-28

Applicant: MEDTRONIC INC ,  RUBEN DAVID A

Inventor： RUBEN DAVID A

IPC: A61B5/02 ,  A61B5/0215

CPC classification number: A61B5/0215 ,  A61B2562/028 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05672 ,  H01L2224/05679 ,  H01L2224/371 ,  H01L2224/37166 ,  H01L2224/37169 ,  H01L2224/37179 ,  H01L2224/37181 ,  H01L2224/37599 ,  H01L2224/45 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/84214 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/01072 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43

Abstract: The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.

Abstract translation: 本发明涉及一种用于可植入医疗装置的互连件。 互连包括焊盘和引导到焊盘上的第一层。 衬垫或第一层中的至少一个包括负的热膨胀系数（CTE）材料。

公开(公告)号：WO2003049178A2

公开(公告)日：2003-06-12

申请号：PCT/US2002/036459

申请日：2002-11-13

Applicant: MOTOROLA, INC.

Inventor： MERCADO, Lei, L. ,  SARIHAN, Vijay ,  CHUNG, Young, Sir ,  WANG, James, Jen-Ho ,  PRACK, Edward, R.

IPC: H01L21/60

CPC classification number: H01L24/12 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/5329 ,  H01L24/05 ,  H01L24/11 ,  H01L24/48 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05599 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05644 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/05679 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00

Abstract: In accordance with one embodiment, a stress buffer (40) is formed between a power metal structure (90) and passivation layer (30). The stress buffer (40) reduces the effects of stress imparted upon the passivation layer (30) by the power metal structure (90). In accordance with an alternative embodiment, a power metal structure (130A) is partitioned into segments (1091), whereby electrical continuity is maintained between the segments (1090) by remaining portions of a seed layer (1052) and adhesion/barrier layer (1050). The individual segments (1090) impart a lower peak stress than a comparably sized continuous power metal structure (9).

Abstract translation: 根据一个实施例，应力缓冲器40形成在功率金属结构90和钝化层30之间。应力缓冲器40减少由功率金属结构90施加在钝化层30上的应力的影响。根据替代方案 功率金属结构130A被分割成段1091，从而通过种子层1052和粘附/阻挡层1050的剩余部分在段1090之间保持电连续性。单个区段1090赋予比相对大小的较低峰值应力 连续动力金属结构9。