Abstract:
Die vorliegende Erfindung betrifft die Verwendung einer Zusammensetzung umfassend Methylmethacrylat MMA, mindestens ein Elastomer und/oder ein Core-shell Polymer, sowie mindestens einen Radikalbildner als Klebstoff, Dichtstoff oder als Beschichtung für das Verkleben oder Abdichten oder Beschichten von Substraten enthaltend weichmacherhaltigen PVC.
Abstract:
Adhesive compositions, including pressure sensitive adhesives, are the reaction product of free radically polymerizable mixtures. The free radically polymerizable mixtures include a free radically polymerizable urethane-based or urea-based oligomer, a free radically polymerizable segmented siloxane-based copolymer, and an initiator. The free radically polymerizable mixture may contain additional reactive and/or unreactive additives. The adhesive compositions can be used to prepare a variety of adhesive articles.
Abstract:
A pre-adhesive syrup polymer composition is described comprising an acid-functional (meth)acrylate copolymer and an aminoalkyl (meth)acryloyl solvent monomer, which when polymerized, provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
Abstract:
Non-silicone, urethane-based adhesives are disclosed which are prepared by the polymerization of reactive oligomers with the general formula X-A-B-A-X, where X is an ethylenically unsaturated group B is a unit free of silicone, and A is a urethane linkage. The adhesives are optically clear, self wetting and removable. Adhesive articles, including optical adhesive articles, may be prepared using the disclosed non-silicone urethane-based adhesives.
Abstract:
The present invention concerns a pressure-sensitive adhesive film and a method for back-grinding semiconductor wafers using the same. The present invention provides, for example, a pressure-sensitive adhesive film having excellent brittleness and adhesion in the semiconductor production process, as well as a superior cushioning, and that is capable of markedly improving production efficiency in the wafer back-grinding process of semiconductor production. In addition, the present invention provides a pressure-sensitive adhesive film having superior releasability, re-releasable characteristics, and wafer wettability, and also exhibiting excellent water resistance; and a back-grinding method using the same.
Abstract:
The present invention concerns a pressure-sensitive adhesive film and a method for back-grinding semiconductor wafers using the same. The present invention provides, for example, a pressure-sensitive adhesive film having excellent brittleness and adhesion in the semiconductor production process, as well as a superior cushioning, and that is capable of markedly improving production efficiency in the wafer back-grinding process of semiconductor production. In addition, the present invention provides a pressure-sensitive adhesive film having superior releasability, re-releasable characteristics, and wafer wettability, and also exhibiting excellent water resistance; and a back-grinding method using the same.
Abstract:
The present invention relates to a free-radically radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive, the precursor comprising: (i) 30-75 wt.% of one or more mono(meth)acrylate functional oligomer compounds at least one of said oligomer compounds comprising at least one urethane bond, (ii) 0-15 wt.% of one or more poly(meth)acrylate functional oligomer compounds, (iii) 5-45 wt.% of one or more monomer compounds comprising one ethylenically unsaturated group, (iv) 0-5 wt.% of one or more monomer compounds comprising two or more ethylenically unsaturated groups, and (v) an effective amount of one or more free radical photoinitiators, wherein the percentages which are percentages by weight with respect to the mass of the precursor, are selected so that the precursor has a dynamic viscosity at 20 °C and at a shear rate of 100 s -1 of between 300 to 15,000 mPa.s.