摘要:
The present invention relates to a support and an imaging element utilizing the support, wherein the support comprises at least one nacreous resin layer, wherein the uppermost layer comprises nacreous pigment in a polyolefin matrix polymer, and wherein the FLOP value of the imaging element, and, hence, the support, is greater than 25. Also included is a method of making the nacreous support.
摘要:
Composites, methods, and systems for production of multi-color images which are developable at various wavelengths are disclosed and described. The color forming composite can include a first color forming layer having a first polymer matrix, a first color former, and a first developer where the first color former and the first developer can be in separate phases within the first color forming layer; a second color forming layer having a second polymer matrix, a second color former, and a second developer where the second color former and the second developer can be in separate phases within the second color forming layer; and at least one radiation absorber. The radiation absorber can be present in at least one of the first or second color forming layers. Additionally, the first color forming layer can have a first extinction coefficient that is higher than the second extinction coefficient of the second color forming layer.
摘要:
The invention relates to a protective film against harmful substances, especially against gaseous substances towards which an object or device is sensitive, such as oxygen, moisture or other gases contained in the ambient atmosphere; the preparation and use of such a film; objects coated with such a film, such as OLEDs or photochromically coated panes or glasses; and devices comprising objects covered by such a film, such as illumination bodies or OLED-based displays or windows with photochromically coated panes.
摘要:
A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I): wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar 1 is selected from the group consisting of a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar 2 is selected from the group consisting a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, a divalent aliphatic group that may contain silicon, or mixtures thereof; Ar 3 is selected from the group consisting a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar 4 is selected from the group consisting Ar 1 (OH) 2 or Ar 2 ; G is an organic group selected from the group consisting groups having a carbonyl, carbonyloxy or sulfonyl group attached directly to the terminal NH group of the polymer; (b) one or more photo-active compounds which release acid upon irradiation (PACs); (c) a latent crosslinker which contains at least two ~N-(CH 2 OR) n units wherein n=1 or 2 and R is a linear or branched C 1 -C 8 alkyl group, with the proviso that when a glycoluril is employed as the latent crosslinker, the G group in the polybenzoxazole precursor polymer is produced from the reaction of a cyclic anhydride; and (d) at least one solvent that is not NMP.
摘要翻译:一种耐热负性光敏组合物,其包含(a)一种或多种聚苯并恶唑前体聚合物(I):其中x为约10至约1000的整数,y为0至约900的整数,(x + y)为 约少于1000; Ar 1选自四价芳族基团,四价杂环基团或其混合物; Ar 2选自二价芳族,二价杂环,二价脂环族,可含硅的二价脂族基团,或其混合物; Ar 3选自二价芳族基团,二价脂族基团,二价杂环基团或其混合物; Ar 4选自Ar 1(OH)2 2或Ar 2 O 2; G是选自具有直接与聚合物的末端NH基团连接的羰基,羰氧基或磺酰基的基团的有机基团; (b)一种或多种在照射时释放酸的光活性化合物(PAC); (c)潜在交联剂,其含有n = 1或2的至少两个N-(CH 2)2或N 2单元,R是直链或支链C 1 -C 6烷基, SUB 1 -C 8烷基,条件是当使用甘脲作为潜在交联剂时,聚苯并恶唑前体聚合物中的G基团是由环状 酐; 和(d)至少一种不是NMP的溶剂。
摘要:
A process of producing a relief image printing plate, the process comprising the steps of providing a photosensitive printing element, quenching dissolved oxygen in the photosensitive resin layer by pre-exposing the photosensitive layer to one or more sources of actinic radiation, wherein the range of wavelengths spanned by the one or more sources of actinic radiation differs by no more than about 20 nm, and imagewise exposing the photosensitive resin layer to actinic radiation to crosslink and cure the photosensitive resin layer. The photosensitive composition typically comprises at least one photoinitiator that is present in the photosensitive composition in an amount sufficient to provide an optical density in the photosensitive composition of between about 0.05 and 0.43 at a wavelength used to pre-expose the photosensitive composition.
摘要:
Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).
摘要:
A top anti-reflective coating material (TARC) and barrier layer, and the use thereof in lithography processes, is disclosed. The TARC / barrier layer may be especially useful for immersion lithography using water as the imaging medium. The TARC / barrier layer comprises a polymer which comprises at least one silicon-containing moiety and at least one aqueous base soluble moiety. Suitable polymers include polymers having a silsesquioxane (ladder or network) structure, such as polymers containing monomers having the structure (I): where R 1 comprises an aqueous base soluble moiety, and x is from about 1 to about 1.95, more preferably from about 1 to about 1.75.
摘要:
A novel process for using a hard mask or protective layer in conjunction with an extremely thin photoresist is provided. In this process, a thin film of the protective layer is coated on the surface of a substrate that is to be selectively modified by reactive ion etch (RIE). The protective layer is photosensitive and anti-reflective. An extremely thin photoresist layer is coated on top of the protective layer. The stack of the films is selectively exposed to actinic radiation at a wavelength determined by the sensitivities of the protective layer and photoresist layer. The latent images on the photoresist and protective layers resulting from the exposure are developed with a common alkaline developer. The three dimensional patterns of photoresist and underlying protective layer are formed simultaneously by the single exposure and single development. When the underlying substrate is etched by RIE, the protective layer is the masking layer, not the photoresist.
摘要:
The present invention relates to a directly photoimageable polymer composition (DPPC) and methods for its use in forming microelectronic and optoelectronic devices. Such DPPC encompasses a polymer having at least one norbornene-type repeat unit having a pendant silyl containing radical and at least one norbornene-type repeat unit having an acrylate containing radical.