公开(公告)号：WO2021262488A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/037528

申请日：2021-06-16

Applicant: KLA CORPORATION

Inventor： MARK, Shai ,  AZARIA, Mor ,  UZIEL, Yoram ,  BIELI, Giampietro ,  PAHIMA, Adi

IPC: H01L21/67 ,  B08B7/00 ,  H01L21/677 ,  G03F7/20 ,  C23C16/44 ,  H01L21/687 ,  C23C16/458 ,  H01L21/67028 ,  H01L21/67748 ,  H01L21/6831

Abstract: A cleaning assembly may include a chuck. The cleaning assembly may include a plurality of lift pins positioned proximate to the chuck. The plurality of lift pins may be configured to engage a cleaning substrate and translate the cleaning substrate to allow the cleaning substrate to capture one or more particles from the surface of the chuck via at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is positioned in the second position. The cleaning assembly may include a replaceable top skin coupled to the chuck and configured to capture the one or more particles.

公开(公告)号：WO2022010553A1

公开(公告)日：2022-01-13

申请号：PCT/US2021/026712

申请日：2021-04-09

Applicant: APPLIED MATERIALS, INC.

Inventor： SAVANDAIAH, Kirankumar Neelasandra ,  YEDLA, Srinivasa Rao ,  BREZOCZKY, Thomas

IPC: C23C16/455 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：WO2022010555A1

公开(公告)日：2022-01-13

申请号：PCT/US2021/026895

申请日：2021-04-12

Applicant: APPLIED MATERIALS, INC.

Inventor： HOEY, Gee Sun ,  JAGANATHAN, Balasubramaniam Coimbatore ,  RANGARAJAN, Jagan

IPC: B25J11/00 ,  B25J15/02 ,  B25J15/06 ,  H01L21/02 ,  B65G47/90 ,  H01L21/67028 ,  H01L21/67219 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/68707

Abstract: An apparatus for transferring a substrate is disclosed herein. More specifically, the apparatus relates to substrate handling systems used in semiconductor device manufacturing, and more particularly, to substrate handling systems having a substrate handler with enclosed moving elements and increased compatibility with post-CMP cleaning modules. The apparatus includes one or more indexing assemblies. Each of the indexing assemblies including an enclosure, an actuator assembly disposed within the enclosure, and two handling blades disposed outside of the disclosure. Each of the two blades are moveable in either of a translational or a rotating manner.

公开(公告)号：WO2022005504A1

公开(公告)日：2022-01-06

申请号：PCT/US2020/056792

申请日：2020-10-22

Applicant: QORVO BIOTECHNOLOGIES, LLC

Inventor： DENIZ, Derya ,  JOHNSTON, Philip ,  HELLAND, Jay ,  BELSICK, John ,  MCCARRON, Kevin

IPC: C23C14/35 ,  C23C14/22 ,  C23C14/34 ,  C23C14/56 ,  H01J37/34 ,  H01L21/67 ,  H01L21/67167 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/68764

Abstract: A deposition system is disclosed that allows for growth of inclined c-axis piezoelectric material structures. The system integrates various sputtering modules to yield high quality films and is designed to optimize throughput lending it to a high-volume manufacturing environment. The system includes two or more process modules including an off-axis module constructed to deposit material at an inclined c-axis and a longitudinal module constructed to deposit material at normal incidence; a central wafer transfer unit including a load lock, a vacuum chamber, and a robot disposed within the vacuum chamber and constructed to transfer a wafer substrate between the central wafer transfer unit and the two or more process modules; and a control unit operatively connected to the robot.

公开(公告)号：WO2021178399A8

公开(公告)日：2021-09-10

申请号：PCT/US2021/020454

申请日：2021-03-02

Applicant: LAM RESEARCH CORPORATION

Inventor： FISCHER, Andreas ,  ROUTZAHN, Aaron, Lynn ,  LILL, Thorsten, Bernd ,  VARADARAJAN, Seshasayee

IPC: H01L21/3213 ,  H01L21/3205 ,  H01L21/67 ,  H01L27/11551 ,  H01L27/11578 ,  H01L21/32136 ,  H01L21/67167 ,  H01L21/67259 ,  H01L21/67748 ,  H01L27/11556 ,  H01L27/11582

Abstract: Molybdenum is etched in a highly controllable manner by performing one or more etch cycles, where each cycle involves exposing the substrate having a molybdenum layer to an oxygen-containing reactant to form molybdenum oxide followed by treatment with boron trichloride to convert molybdenum oxide to a volatile molybdenum oxychloride with subsequent treatment of the substrate with a fluorine-containing reactant to remove boron oxide that has formed in a previous reaction, from the surface of the substrate. In some embodiments the method is performed in an absence of plasma and results in a substantially isotropic etching. The method can be used in a variety of applications in semiconductor processing, such as in wordline isolation in 3D NAND fabrication.

公开(公告)号：WO2020150072A1

公开(公告)日：2020-07-23

申请号：PCT/US2020/012957

申请日：2020-01-09

Applicant: APPLIED MATERIALS, INC.

Inventor： RANGARAJAN, Jagan ,  GOLUBOVSKY, Edward ,  VAN DER VEEN, Shaun ,  WONG, Justin Ho Kuen ,  ZUNIGA, Steven M.

IPC: H01L21/677 ,  B24B37/34 ,  H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/306 ,  B24B37/345 ,  B24B41/06 ,  H01L21/67703 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/68707 ,  H01L21/68742

Abstract: A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.