公开(公告)号：WO2022006174A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/039711

申请日：2021-06-29

Applicant: APPLIED MATERIALS, INC.

Inventor： HUDGENS, Jeffrey C. ,  MUTHUKAMATCHI, Karuppasamy

IPC: B25J9/00 ,  B25J9/04 ,  B25J9/12 ,  B25J15/00 ,  B25J17/025 ,  B25J18/00 ,  B25J9/0084 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/68707

Abstract: Electronic device manufacturing systems, robot apparatus and associated methods are described. The robot apparatus includes an arm having an inboard end and an outboard end, the inboard end is configured to rotate about a shoulder axis; a first forearm is configured for independent rotation relative to the arm about an elbow axis at the outboard end of the arm; a first wrist member is configured for independent rotation relative the first forearm about a first wrist axis at a distal end of the first forearm opposite the elbow axis, wherein the first wrist member includes a first end effector and a second end effector. The robot apparatus further includes a second forearm configured for independent rotation relative to the arm about the elbow axis; a second wrist member configured for independent rotation relative the second forearm about a second wrist axis, wherein the second wrist member comprises a third end effector and a fourth end effector. The robot apparatus further includes a third forearm configured for independent rotation relative to the arm about the elbow axis; and a third wrist member configured for independent rotation relative the third forearm about a third wrist axis, wherein the second wrist member includes a fifth end effector and a sixth end effector.

公开(公告)号：WO2023279081A1

公开(公告)日：2023-01-05

申请号：PCT/US2022/073346

申请日：2022-07-01

Applicant: LAM RESEARCH CORPORATION

Inventor： DANEK, Michal ,  HASKELL, Benjamin Allen ,  REDDY, Kapu Sirish ,  BADT, David ,  WILLIAMS, Brian Joseph ,  FRANZEN, Paul ,  LEESER, Karl Frederick ,  PETRAGLIA, Jennifer Leigh ,  SAKIYAMA, Yukinori ,  SAWLANI, Kapil

IPC: H01J37/32 ,  H05H1/00 ,  H01L21/67 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67253 ,  H05H1/0037

Abstract: Multi-pixel sensors such as camera sensors may be configured to capture two- dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications.

公开(公告)号：WO2023278387A1

公开(公告)日：2023-01-05

申请号：PCT/US2022/035235

申请日：2022-06-28

Applicant: APPLIED MATERIALS, INC.

Inventor： PARIKH, Suketu ,  JANSEN, Alexander ,  LEE, Joung Joo ,  LIU, Lequn

IPC: H01L21/768 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67207 ,  H01L21/76807 ,  H01L21/7684 ,  H01L21/76846 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53238

Abstract: Interconnect structures on a substrate have low resistivity and high dopant interfaces. In some embodiments, the structures may have an opening with a sidewall from an upper surface to an underlying metallic layer of copper, a barrier layer of tantalum nitride formed on the sidewall of the opening, a liner layer of cobalt or ruthenium formed on the barrier layer and on the underlying metallic layer, a first copper layer with a dopant with a first dopant content formed on the liner layer and filling a lower portion of the opening to form a via - the first dopant content is approximately 0.5 percent to approximately 10 percent, and a second copper layer with the dopant with a second dopant content formed on the first copper layer and filling the at least one opening - the second dopant content is more than zero to approximately 0.5 percent of the dopant and is less than the first dopant content.

公开(公告)号：WO2022006313A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/039958

申请日：2021-06-30

Applicant: BROOKS AUTOMATION, INC.

Inventor： GRACIANO, Justo ,  HWANG, Helen ,  PASTOR, Erick

IPC: G01B11/02 ,  G03F7/00 ,  G05B19/18 ,  G06T7/70 ,  H01L21/68 ,  H01L27/146 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/68707

Abstract: An automatic teaching system for a substrate processing apparatus, the automatic teaching system comprising a frame having a workpiece load station with a predetermined load station reference location, a robot transport mounted to the frame and having a movable transport arm with an end effector having a predetermined end effector reference location, and a drive section driving the movable transport arm in at least one degree of freedom motion relative to the frame, a machine vision system including both at least one fixed imaging sensor and at least one movable imaging sensor removably connected to the frame and configured to image at least one target of the machine vision system, a load jig disposed for removable engagement with the workpiece load station, with both the at least one fixed imaging sensor and the at least one movable imaging sensor mounted to the load jig, the fixed imaging sensor.

公开(公告)号：WO2022010553A1

公开(公告)日：2022-01-13

申请号：PCT/US2021/026712

申请日：2021-04-09

Applicant: APPLIED MATERIALS, INC.

Inventor： SAVANDAIAH, Kirankumar Neelasandra ,  YEDLA, Srinivasa Rao ,  BREZOCZKY, Thomas

IPC: C23C16/455 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.