The invention provides a high frequency module with improved heat dissipation performances. The high frequency module (1) includes a transmission power amplifier (11), a bump electrode (13) connectedto a principal surface of the transmission power amplifier (11) and having an elongated shape in a plan view of the principal surface, and a mounting board (90) on which the transmission power amplifier (11) is mounted, wherein the mounting board (90) includes a via conductor (91) having an elongated shape in the plan view, the length direction of the bump electrode (13) and the length direction of the via conductor (91) are aligned in the plan view, and the bump electrode (13) and the via conductor (90) are connected in an overlapping area where the bump electrode (13) and the via conductor (90) overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.