- Patent Title: Techniques for forming non-planar germanium quantum well devices
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Application No.: US15790907Application Date: 2017-10-23
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Publication No.: US10236369B2Publication Date: 2019-03-19
- Inventor: Ravi Pillarisetty , Jack T. Kavalieros , Willy Rachmady , Uday Shah , Benjamin Chu-Kung , Marko Radosavljevic , Niloy Mukherjee , Gilbert Dewey , Been Y. Jin , Robert S. Chau
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Finch & Maloney PLLC
- Main IPC: H01L29/775
- IPC: H01L29/775 ; B82Y10/00 ; H01L29/267 ; H01L29/66 ; H01L29/778 ; H01L21/76 ; H01L29/78 ; H01L29/10 ; H01L29/06 ; H01L29/15 ; H01L29/51 ; H01L29/165

Abstract:
Techniques are disclosed for forming a non-planar germanium quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a germanium fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), a doping layer (e.g., delta/modulation doped), and an undoped germanium quantum well layer. An undoped germanium fin structure is formed in the quantum well structure, and a top barrier layer deposited over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.
Public/Granted literature
- US20180047839A1 TECHNIQUES FOR FORMING NON-PLANAR GERMANIUM QUANTUM WELL DEVICES Public/Granted day:2018-02-15
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